Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH to Demonstrate Advances and Technical Breakthroughs at SPIE 2013: Papers showcase leadership in advancing EUV extendibility and metrology techniques for defect inspection and 3D TSVs

Abstract:
SEMATECH experts will present world-leading research and development results on extreme ultraviolet (EUV) manufacturability and extendibility, alternative lithography, and related areas of metrology at the SPIE Advanced Lithography 2013 conferences taking place February 25-28 at the San Jose Convention Center and Marriott in San Jose, CA.

SEMATECH to Demonstrate Advances and Technical Breakthroughs at SPIE 2013: Papers showcase leadership in advancing EUV extendibility and metrology techniques for defect inspection and 3D TSVs

Albany, NY | Posted on February 19th, 2013

"We are enthusiastic about sharing our progress on some of the most critical aspects of the development of EUV infrastructure," said Stefan Wurm, director of lithography at SEMATECH. "SEMATECH lithographers will recount achievements in multiple areas of EUV to further enable EUVL pilot line readiness and advance EUV extendibility."

SEMATECH engineers will report progress on EUV mask infrastructure, manufacturability, extendibility and metrology, and will showcase some of their findings in over 30 papers and posters demonstrating breakthrough results in exposure tool capability, resist advances, defect-related inspection, e-beam and nanoimprint.

More importantly, the results presented will be instrumental in driving timely creation of the remaining infrastructure required to bring EUV to production. In one area of investigation, technologists from SEMATECH's Mask Blank Development Center will report progress with its multilayer deposition process, including recent defect printability results from an NXE3100 tool with comparison of the imaging to various simulation modeling approaches.

Other SEMATECH papers will showcase advances in metrology techniques, photoresist shrinkage, nanopolishing, scatterometry, through-silicon via (TSV) reveal, transmission electron microscopy (TEM) tomography, critical dimension atomic force microscopy (CD-AFM), critical dimension X-ray scattering (CD-SAXS)—a potential metrology technique for FinFET and 3D memory structures—and a through-focus scanning optical microscopy (TSOM) technique being explored for future defect inspection or to enable high-volume manufacturing of high-aspect ratio features.

Additionally, technologists will present a "big picture" CD metrology gaps analysis, which interrelates the combined results from years of SEMATECH CD metrology studies to summarize the outlook for various tool technologies for different applications.

"We will be showcasing impressive metrology advances achieved through collaborative research, as well as revealing new defect characterization results for EUV mask blanks that form the basis of the technology for SEMATECH's new Nanodefect Center," said Michael Lercel, senior director of nanodefectivity and metrology at SEMATECH.

Among the global semiconductor community's leading gatherings, the SPIE conference series attracts thousands of specialists in various aspects of lithography and related metrology, two of the most challenging areas of advanced microchip production.

For a complete list of SEMATECH presentations at SPIE please visit bit.ly/VHBzTw.

####

About SEMATECH
For over 25 years, SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market. Information about SEMATECH can be found at www.sematech.org. Twitter: www.twitter.com/sematech

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
Phone: 518-649-1041

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Quantum teleportation on a chip: A significant step towards ultra-high speed quantum computers April 1st, 2015

So, near and yet so far: Stable HGNs for Raman April 1st, 2015

Two-dimensional dirac materials: Structure, properties, and rarity April 1st, 2015

3-D neural structure guided with biocompatible nanofiber scaffolds and hydrogels April 1st, 2015

Chip Technology

Mind the gap: Nanoscale speed bump could regulate plasmons for high-speed data flow April 1st, 2015

Quantum teleportation on a chip: A significant step towards ultra-high speed quantum computers April 1st, 2015

Rutgers, NIST physicists report technology with potential for sub-micron optical switches March 31st, 2015

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

Announcements

Quantum teleportation on a chip: A significant step towards ultra-high speed quantum computers April 1st, 2015

So, near and yet so far: Stable HGNs for Raman April 1st, 2015

Two-dimensional dirac materials: Structure, properties, and rarity April 1st, 2015

3-D neural structure guided with biocompatible nanofiber scaffolds and hydrogels April 1st, 2015

Tools

So, near and yet so far: Stable HGNs for Raman April 1st, 2015

PIHera: Largest Family of Piezo Stage Scanners with 10X Greater Positioning Area March 31st, 2015

New Applications Brochure on Complex Motion Control Systems for Scientific Research March 31st, 2015

'Atomic chicken-wire' is key to faster DNA sequencing March 30th, 2015

Events/Classes

Nanomedicine pioneer Mauro Ferrari at ETH Zurich March 31st, 2015

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

LAMDAMAP 2015 hosted by the University March 26th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

Alliances/Partnerships/Distributorships

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Young NTU Singapore spin-off clinches S$4.3 million joint venture with Chinese commercial giant March 23rd, 2015

Halas, Nordlander awarded Optical Society's R.W. Wood Prize: Rice University researchers recognized for pioneering nanophotonics March 21st, 2015

EU Funded PCATDES Project has completed its half-period with success March 19th, 2015

Printing/Lithography/Inkjet/Inks

Haydale Announce Dedicated Graphene Inks Manufacturing Capability March 25th, 2015

NC State researchers create 'nanofiber gusher': Report method of fabricating larger amounts of nanofibers in liquid March 19th, 2015

'Additive manufacturing' could greatly improve diabetes management March 17th, 2015

Advantest to Exhibit at SEMICON China in Shanghai, China, March 17-19: Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions March 10th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE