- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
|Figure MEMSreadout: Microphotographs of the accelerometer, strain sensor and readout ASIC and topology of a single channel capacitive readout.|
Imec and Holst Centre report an ultralow-power readout ASIC for capacitive MEMS/NEMS-based sensors. The system can read both accelerometers and strain sensors in a half-bridge configuration. The gain is controlled by integrating pulses from the excitation voltage allowing accurate control of the SNR (signal-to-noise) ratio. We achieved a figure-of-merit of 4.41×10-20 F√(W/Hz) for a sensor range of ±2.0g and ±20,000με over a 100Hz bandwidth. The system has also been designed to cancel residual motion artifacts.
With the growing number of MEMS sensors for all types of applications, there is a need for innovative, flexible and power-efficient readout architectures. These have to be able to read signals from a wide range of capacitive devices (such as accelerometers and strain sensors with different actuation voltages, sensitivities and resolutions). One particular interesting application field is the monitoring of building integrity, where the sensors have to measure displacements and stresses, as an indication for the integrity of structures during e.g. seismic events. Such applications impose resolution requirements of 1mg and 10με for the accelerometer and strain sensor respectively, and a range of ±2.0g and ±20,000με over a 100Hz bandwidth.
Most of the existing readout chips are custom-made for a particular sensor, which usually has a large sensitivity in a narrow band. Our architecture can interface with a variety of sensors without jeopardizing the power consumption. This is important for monitoring building integrity, which requires battery-operated systems to keep working for several years. It's also a cost-effective solution, since the same readout can be used for both accelerometers and strain sensors. Last, the system's flexibility is a major asset: sensors with different sensitivities, offsets and mismatch can easily be handled by modifying the timing and duty cycle of the excitation pulses.
Our readout architecture has the lowest reported equivalent acceleration noise level and the highest bandwidth. It offers a unique tradeoff between SNR, bandwidth, and power. The design was fabricated on TSMC 0.25μm CMOS with metal-insulator-metal capacitors. The total power consumption of the 3 channels is 15μW. The clock and excitation voltages for the sensors are external.
Imec performs world-leading research in nano-electronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society.
Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, USA, China and Japan. Its staff of about 1,900 people includes more than 500 industrial residents and guest researchers. In 2010, imec's revenue (P&L) was 285 million euro.
Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).
For more information, please click here
External Communications Officer
T: +32 16 281 769
Mobile: +32 486 065 175
Copyright © IMECIf you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
Weighing -- and imaging -- molecules one at a time April 28th, 2015
Robust new process forms 3-D shapes from flat sheets of graphene June 23rd, 2015
MEMS Industry Group Hosts Its First MEMS/Sensors Conference Session at Transducers 2015: MIG Speakers Will Explore Technology Transfer, Emerging MEMS/Sensors, Manufacturing Infrastructure and Process Technology, June 23 in Anchorage June 3rd, 2015
Janusz Bryzek Joins MEMS Industry Group to Lead New TSensors Division - New Division will Focus on Accelerating Development of Emerging Ultra-high Volume Sensors Supporting Abundance, mHealth and IoT May 14th, 2015
Clues to inner atomic life from subtle light-emission shifts: Hyperfine structure of light absorption by short-lived cadmium atom isotopes reveals characteristics of the nucleus that matter for high precision detection methods July 3rd, 2015