Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH, SIA and SRC Team to Establish New Collaborative Program for Enabling 3D ICs

Abstract:
Industry pulls together to develop industry standards to guide 3D integration and accelerate technology adoption

SEMATECH, SIA and SRC Team to Establish New Collaborative Program for Enabling 3D ICs

Albany, NY & Washington, DC | Posted on December 8th, 2010

SEMATECH, the Semiconductor Industry Association (SIA), and Semiconductor Research Corporation (SRC) announced today they have established a new 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration.

Administered by SEMATECH's 3D Interconnect program, based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, working in partnership with SRC, the program aims to establish the infrastructure necessary for the industry to leverage 3D packaging technology for innovative new applications.

The new 3D Enablement program, launched by a group of existing member companies in SIA and SEMATECH, will focus primarily on developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer and die handling. To achieve this SEMATECH will partner with SRC to enable select university research projects.

"This initiative underscores the importance of industry-wide convergence on infrastructure and standards. SEMATECH will leverage its existing 3D capabilities to lead a more collaborative approach to reduce risks and development costs for the participants," said Dan Armbrust, president and CEO of SEMATECH. "The 3D Enablement program has been established to bring down the barriers to integrating chips from different suppliers for adoption of 3D technologies in high volume manufacturing."

"The semiconductor industry, specifically the development of 3D integration, is at an inflection point," said Dr. John E. Kelly III, senior vice president and director of research at IBM and chair of SIA's technology steering committee. "In tackling the challenges faced by lack of standardization, we will have deep collaboration with SEMATECH and SRC addressing both bonding processes and 3D inspection. The program will accelerate the adoption of 3D integration technology."

"The lack of convergence will delay industry success. The 3D Enablement program serves as a common ground to serve a broad industry base," said Larry W. Sumney, president and CEO of SRC. "SRC has extensive university programs and expertise. Combined with SEMATECH's existing efforts in developing 3D technologies, we will pursue an ambitious interface standardization for 3D integration to enable the commercialization of 3D ICs."

3D ICs will play an important role in the semiconductor industry, given their potential to alleviate scaling limitations, increase performance and functionality, and reduce cost. While research on 3D technologies has been ongoing for many years, they have not yet made it to mainstream production due to lack of uniform standards and a limited understanding of key manufacturing parameters. In order to build critical industry infrastructure and drive 3D into mainstream high volume manufacturing, the industry will need to come to a consensus on the most promising and cost-effective options.

The program will address these industry infrastructure gaps in phases. First efforts will focus on developing the necessary standards and technical specifications, followed by planning activities to identify the key areas for developing design tools to support 3D chip design.

The program will address these industry infrastructure gaps in phases. First efforts will focus on developing the necessary standards and technical specifications, followed by planning activities to identify the key areas for developing design tools to support 3D chip design.

Designed to meet the needs of diverse business models, the 3D Enablement program is open to international fabless, fab-lite and IDM companies, outsourced assembly and test (OSAT) suppliers, and tool vendors.

####

About SEMATECH
For over 20 years, SEMATECH (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About SIA
The SIA is the voice of the U.S. semiconductor industry, America's number-one export industry over the past five years. SIA seeks to continue U.S. leadership in this critical sector that employs 185,000 people in the U.S. and provides the enabling technology for America's $1.1 trillion high-tech industries with a U.S. workforce of nearly 6 million people. More information about the SIA can be found at www.sia-online.org.

About SRC
Celebrating 28 years of collaborative research for the semiconductor industry, SRC defines industry needs, invests in and manages the research that gives its members a competitive advantage in the dynamic global marketplace. Awarded the National Medal of Technology, Americas highest recognition for contributions to technology, SRC expands the industry knowledge base and attracts premier students to help innovate and transfer semiconductor technology to the commercial industry. For more information, visit www.src.org.

For more information, please click here

Contacts:
SEMATECH Media Contacts:
Erica McGill
518-487-8256

Anne Englander
512-771-7431


SIA Media Contact:
Kirsten Romer
202-446-1707


SRC Media Contact:
Dan Francisco
The Francisco Group for SRC
916-293-9030

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Pulses of electrons manipulate nanomagnets and store information: Scientists use electron pulses to create and manipulate nanoscale magnetic excitations that can store data July 21st, 2017

The first light atomic nucleus with a second face July 20th, 2017

Semiliquid chains pulled out of a sea of microparticles July 20th, 2017

Harnessing light to drive chemical reactions July 19th, 2017

Academic/Education

The Physics Department of Imperial College, London, uses the Quorum Q150T to deposit metals and ITO to make plasmonic sensors and electric contact pads July 13th, 2017

Oxford Instruments congratulates Lancaster University for inaugurating the IsoLab, built for studying quantum systems June 20th, 2017

The 2017 Winners for Generation Nano June 8th, 2017

MIT Energy Initiative awards 10 seed fund grants for early-stage energy research May 4th, 2017

Chip Technology

Semiliquid chains pulled out of a sea of microparticles July 20th, 2017

A firefly's flash inspires new nanolaser light July 18th, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GFs 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Nanometrics to Announce Second Quarter Financial Results on August 1, 2017 July 14th, 2017

Nanoelectronics

Tokyo Institute of Technology research: Antiaromatic molecule displays record electrical conductance July 19th, 2017

A firefly's flash inspires new nanolaser light July 18th, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GFs 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Thinking thin brings new layering and thermal abilities to the semiconductor industry: In a breakthrough for the semiconductor industry, researchers demonstrate a new layer transfer technique called "controlled spalling" that creates many thin layers from a single gallium nitride July 11th, 2017

Announcements

Pulses of electrons manipulate nanomagnets and store information: Scientists use electron pulses to create and manipulate nanoscale magnetic excitations that can store data July 21st, 2017

Probiotics: Novel biosynthetic tool to develop metallic nanoparticles: This research article by Dr. Nida Akhtar et al has been published in Recent Patents on Drug Delivery & Formulation, Volume 11, Issue 1, 2017 July 20th, 2017

The first light atomic nucleus with a second face July 20th, 2017

Semiliquid chains pulled out of a sea of microparticles July 20th, 2017

Alliances/Trade associations/Partnerships/Distributorships

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GFs 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Advanced Nanomechanical Characterization Centre Open in India: Nanomechanics, Inc. announces the establishment of the joint technology development center in Hyderabad, India July 5th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Cambridge Nanotherm partners with Inabata for global sales and distribution June 20th, 2017

Research partnerships

Studying Argon Gas Trapped in Two-Dimensional Array of Tiny "Cages": Understanding how individual atoms enter and exit the nanoporous frameworks could help scientists design new materials for gas separation and nuclear waste remediation July 17th, 2017

Coupling a nano-trumpet with a quantum dot enables precise position determination July 14th, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GFs 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Carbon displays quantum effects July 13th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project