Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > European project solves variability issues of designing in deep submicron IC technology

Abstract:
REALITY, a European funded initiative on Design for Variability, has just finished its project mission.

European project solves variability issues of designing in deep submicron IC technology

Leuven, Belgium | Posted on September 21st, 2010

In about its 2.5 years lifespan REALITY has focused on developing industrially relevant innovative design techniques, methods, and flows for the design and analysis of energy-efficient self-adaptive System-on-Chips (SoCs). The tackled challenges include benchmarking the impact of the latest 32nm CMOS process manufacturing variability at all abstraction levels, from device to System-on-a-Chip level, while developing approaches to compensate their negative impact in the design of final products. REALITY has resulted in a number of first time conclusions.

Full-scale 3D simulation of statistical variability associated with metal gate granularity and the corresponding metal work function variations have been carried out to clarify the magnitude of statistical variability in 32nm CMOS transistors with high-k/metal gate stack. For these devices the metal granularities can double the variability if the metal grain size becomes comparable to the transistor dimensions.

Also, a full statistical characterization of an ARM926 core has been achieved. A correlation between the timing, leakage and dynamic power has been demonstrated on local (within die) and non-local (above die) variations. The traditional corner analysis could be benchmarked with innovative statistical analysis techniques. Using the ARM core as driver, REALITY has confirmed that the SRAM components are responsible for more than the half of the variations on critical path timing.

Hence, Statistical Timing Analysis (SSTA) flows that assume predictable timing response from these components may lead to over-optimistic conclusions. For that purpose REALITY has deployed a holistic statistical characterization flow including SRAM analysis.

With a novel flow integrating manufacturing variations and ageing effects for mixed-signal circuits, the REALITY project also developed a CAD environment that allows designers to make more accurate estimations and thus make circuits more energy and cost efficient.

Finally, REALITY evaluated the impact of process variation in SW-level metrics showing process variability is not only a concern for HW but for SW as well. Variability affecting multi-core multimedia platforms makes it hard to guarantee a certain QoS from the running application's functionality. For that purpose, different circuit design techniques for system adaptation have been investigated, among them Adaptive Body Biasing (ABB). REALITY has shown that ABB can speed up a system-on-chip when due to technology parameter variations the manufactured product became too slow.

####

For more information, please click here

Contacts:
Miguel Miranda
Project Coordinator
imec
Kapeldreef 75, 3001 Leuven, Belgium

Copyright © imec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Nanoelectronics

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Announcements

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Oxford Instruments Plasma Technology announces a new partner in Korea August 15th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Technology Companies Join Forces for TEM Imaging and Analysis August 3rd, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project