Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > AquiVia Fill Sets New Standards for Metallization Process Of the Most Advanced Through-Silicon Vias

Abstract:
New Alchimer Fill Technology Supports Narrow, High-Aspect-Ratio TSVs,

Offering Real Estate Savings, Reduced Fill Time and Higher Reliability

AquiVia Fill Sets New Standards for Metallization Process Of the Most Advanced Through-Silicon Vias

Paris | Posted on June 22nd, 2010

Alchimer S.A., a leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), today announced a groundbreaking advance for filling narrow, high-aspect-ratio TSVs while significantly reducing the need for chemical components in the metallization process.

The new AquiVia Fill process is an innovative, high-purity copper-plating chemistry that was specially developed to fill narrow TSVs with diameters of less than five microns and aspect ratios greater than 10:1. Reduced via diameter frees up substantial space on stacked chips, and improves signal integrity, where traditional manufacturing technologies have struggled to provide quality filling at an affordable cost.

"AquiVia Fill overcomes processing limitations in the current marketplace; lack of fill technology has been an obstacle to chip and system designers who are trying to pack as much power as possible into next-generation portable systems," said Dr. Claudio Truzzi, Alchimer's chief technology officer. "This new approach to via filling complements Alchimer's AquiVia XS seedless TSV films process, which deposits insulation and barrier layers in high aspect ratio TSVs prior to filling."

The combination of AquiVia XS and AquiVia Fill also extends designers' and chipmakers' ability to shorten the metallization process, and slashes overall cost of ownership compared to traditional electroplating metallization processes.

In contrast with current solutions based on strongly acidic, complex chemistries, AquiVia Fill is a mild basic solution that does not attack or degrade the underlying barrier or seed layer. It eliminates the need to electrically polarize the cathode before the introduction of the wafer. This procedure, called "hot entry", has historically been introduced to limit the acidic attack of the solution, but it seriously degrades the metallic films and is difficult to control.

In another distinct improvement over current solutions, AquiVia Fill contains no chlorine (Cl) components. Cl must be added to acidic solutions to boost the effect of accelerator and suppressor additives. As an added benefit, AquiVia Fill does not form CuCl crust on the anode, eliminating the risk of having crust fragments detach and deposit onto the wafer. This risk is so high in legacy solutions that a filtering membrane must be introduced between the wafer and the anode, significantly adding to the cost of the deposition equipment.

"The most distinct benefit of AquiVia Fill probably is its extremely low number of added components, improving the purity level of the plated copper and drastically reducing the risk of via pull-up during subsequent thermal cycles," Truzzi said. "This is typically due to previously deposited components bubbling up to the TSV's exposed surface."

Alchimer will start sampling AquiVia Fill with select customers by July 1.

####

About Alchimer
Founded in 2001 as a spin-off from the Commissariat ŕ l’Energie Atomique, Alchimer is headquartered in Massy, France, near Paris.

Alchimer is backed by world class investors and staffed with a well-respected team of scientists who excel in the areas of surface science, chemistry, electrochemistry, physics, materials science and semiconductors, and who are second to none.

Recent awards include the prestigious R&D100, Red Herring 100 winner, Best of West 2008 and Best of West finalist in 2009.

For more information, please click here

Contacts:
Jana Yuen
Phone: +33158185930

Copyright © Alchimer

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Nanobiotix: The Independent Data Monitoring Committee Recommends the Continuation of the Ongoing Phase II/III Trial of NBTXR3 in Soft Tissue Sarcoma March 23rd, 2017

Leti Presents Advances in Propagation Modeling and Antenna Design for mmWave Spectrum: Paper Is One of 15 that Leti Presented at European Conference on Antennas and Propagation March 19-24 March 23rd, 2017

Rice U. refines filters for greener natural gas: New study defines best materials for carbon capture, methane selectivity March 23rd, 2017

Artificial photosynthesis steps into the light: Rice University lab turns transition metals into practical catalyst for solar, other applications March 23rd, 2017

Chip Technology

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

Pulverizing e-waste is green, clean -- and cold: Rice, Indian Institute researchers use cryo-mill to turn circuit boards into separated powders March 21st, 2017

Electro-optical switch transmits data at record-low temperatures: Operating at temperatures near absolute zero, switch could enable significantly faster data processing with lower power consumption March 20th, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

Nanoelectronics

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

A SOI wafer is a suitable substrate for gallium nitride crystals: Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth March 4th, 2017

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Announcements

Nanobiotix: The Independent Data Monitoring Committee Recommends the Continuation of the Ongoing Phase II/III Trial of NBTXR3 in Soft Tissue Sarcoma March 23rd, 2017

Leti Presents Advances in Propagation Modeling and Antenna Design for mmWave Spectrum: Paper Is One of 15 that Leti Presented at European Conference on Antennas and Propagation March 19-24 March 23rd, 2017

Rice U. refines filters for greener natural gas: New study defines best materials for carbon capture, methane selectivity March 23rd, 2017

Artificial photosynthesis steps into the light: Rice University lab turns transition metals into practical catalyst for solar, other applications March 23rd, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project