Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > TEL Joins SEMATECH’s Front End Processes Program at UAlbany NanoCollege

Abstract:
Joint effort to accelerate and extend advanced memory and logic technologies

TEL Joins SEMATECH’s Front End Processes Program at UAlbany NanoCollege

Albany, NY and Tokyo, Japan | Posted on December 3rd, 2009

Tokyo Electron Limited (TEL) and SEMATECH today announced that TEL has joined SEMATECH's Front End Processes (FEP) program at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex. The joint partnership will establish a collaborative approach to develop new materials and processing techniques for extending CMOS logic and memory technologies.

As a member of this program, TEL will closely collaborate with SEMATECH's FEP research team at the UAlbany NanoCollege, with support from SEMATECH's facilities in Austin, TX. Specifically, TEL experts will leverage SEMATECH activities in advanced materials, device structures, and physical and electrical characterization infrastructure to develop cutting-edge new processes and associated tools.

"As device scaling becomes more and more difficult and as end products in electronics become more diversified, the integration of the processes, materials, and devices that will define next generations of CMOS and non-CMOS technology will become increasingly important," said Masayuki Tomoyasu, Senior Vice President of TEL Technology Center, America, LLC. "SEMATECH's FEP program blends innovation with practical solutions to meet technical and economic requirements and move the industry forward. SEMATECH provides the most suitable development foundation for TEL to apply our current wafer process knowledge to develop new techniques for extending advanced memory and logic technologies."

"TEL has been a valued partner of SEMATECH for many years and across many projects, including an ongoing strong interaction on 3D interconnects. Given their leadership in providing state-of-the-art tool solutions that are manufacturing friendly, we are very pleased to expand our partnership with TEL on advanced materials and device technologies," said Raj Jammy, SEMATECH's vice president of materials and emerging technologies. "Building on the success of past and present collaborations, we look forward to working closely with TEL to provide an excellent platform for development of leading edge memory and logic process solutions for future generation technologies."

Richard Brilla, vice president for strategy, alliances and consortia at CNSE, said, "We are delighted to welcome this new partnership between SEMATECH and TEL, both of which are among the global technology leaders engaged in next-generation nanoelectronics research and development at the UAlbany NanoCollege. This new collaboration will enable advanced materials and process development to support the critical needs of industry, while further demonstrating the success of the SEMATECH-CNSE alliance in accelerating leading-edge technologies."

The goal of SEMATECH's FEP program is to provide novel leading-edge materials, processes, structural modules and electrical and physical characterization solutions to support the continued scaling of logic and memory applications.

####

About SEMATECH
For over 20 years, SEMATECH® has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About TEL

TEL, established in 1963, is a leading supplier of innovative semiconductor and FPD production equipment worldwide. In Japan, TEL also distributes computer network related products and electronic components of global leading suppliers. To support this diverse product base, TEL is strategically located around the world. TEL is a publicly held company listed on the Tokyo Stock Exchange. www.tel.com

About CNSE

The UAlbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $5 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE’s Albany NanoTech, from companies including IBM, AMD, GlobalFoundries, SEMATECH, Toshiba, Applied Materials, Tokyo Electron, ASML, Novellus Systems, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road
Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Scientists from the University of Manchester and Diamond Light Source work with Deben to develop and test a new compression stage to study irradiated graphite at elevated temperatures August 15th, 2017

Academic/Education

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Graduate Students from Across the Country Attend Hands-on NanoCamp: Prominent scientists Warren Oliver, Ph.D., and George Pharr, Ph.D., presented a weeklong NanoCamp for hand-picked graduate students across the United States July 26th, 2017

The Physics Department of Imperial College, London, uses the Quorum Q150T to deposit metals and ITO to make plasmonic sensors and electric contact pads July 13th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Memory Technology

Surprise discovery in the search for energy efficient information storage August 10th, 2017

Liquid electrolyte contacts for advanced characterization of resistive switching memories July 26th, 2017

Shining rings: A new material emits white light when exposed to electricity: New synthetic approach could spark development of other dynamic materials July 24th, 2017

Pulses of electrons manipulate nanomagnets and store information: Scientists use electron pulses to create and manipulate nanoscale magnetic excitations that can store data July 21st, 2017

Nanoelectronics

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Announcements

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Scientists from the University of Manchester and Diamond Light Source work with Deben to develop and test a new compression stage to study irradiated graphite at elevated temperatures August 15th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Oxford Instruments Plasma Technology announces a new partner in Korea August 15th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Technology Companies Join Forces for TEM Imaging and Analysis August 3rd, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project