Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > TEL Joins SEMATECH’s Front End Processes Program at UAlbany NanoCollege

Abstract:
Joint effort to accelerate and extend advanced memory and logic technologies

TEL Joins SEMATECH’s Front End Processes Program at UAlbany NanoCollege

Albany, NY and Tokyo, Japan | Posted on December 3rd, 2009

Tokyo Electron Limited (TEL) and SEMATECH today announced that TEL has joined SEMATECH's Front End Processes (FEP) program at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex. The joint partnership will establish a collaborative approach to develop new materials and processing techniques for extending CMOS logic and memory technologies.

As a member of this program, TEL will closely collaborate with SEMATECH's FEP research team at the UAlbany NanoCollege, with support from SEMATECH's facilities in Austin, TX. Specifically, TEL experts will leverage SEMATECH activities in advanced materials, device structures, and physical and electrical characterization infrastructure to develop cutting-edge new processes and associated tools.

"As device scaling becomes more and more difficult and as end products in electronics become more diversified, the integration of the processes, materials, and devices that will define next generations of CMOS and non-CMOS technology will become increasingly important," said Masayuki Tomoyasu, Senior Vice President of TEL Technology Center, America, LLC. "SEMATECH's FEP program blends innovation with practical solutions to meet technical and economic requirements and move the industry forward. SEMATECH provides the most suitable development foundation for TEL to apply our current wafer process knowledge to develop new techniques for extending advanced memory and logic technologies."

"TEL has been a valued partner of SEMATECH for many years and across many projects, including an ongoing strong interaction on 3D interconnects. Given their leadership in providing state-of-the-art tool solutions that are manufacturing friendly, we are very pleased to expand our partnership with TEL on advanced materials and device technologies," said Raj Jammy, SEMATECH's vice president of materials and emerging technologies. "Building on the success of past and present collaborations, we look forward to working closely with TEL to provide an excellent platform for development of leading edge memory and logic process solutions for future generation technologies."

Richard Brilla, vice president for strategy, alliances and consortia at CNSE, said, "We are delighted to welcome this new partnership between SEMATECH and TEL, both of which are among the global technology leaders engaged in next-generation nanoelectronics research and development at the UAlbany NanoCollege. This new collaboration will enable advanced materials and process development to support the critical needs of industry, while further demonstrating the success of the SEMATECH-CNSE alliance in accelerating leading-edge technologies."

The goal of SEMATECH's FEP program is to provide novel leading-edge materials, processes, structural modules and electrical and physical characterization solutions to support the continued scaling of logic and memory applications.

####

About SEMATECH
For over 20 years, SEMATECH® has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About TEL

TEL, established in 1963, is a leading supplier of innovative semiconductor and FPD production equipment worldwide. In Japan, TEL also distributes computer network related products and electronic components of global leading suppliers. To support this diverse product base, TEL is strategically located around the world. TEL is a publicly held company listed on the Tokyo Stock Exchange. www.tel.com

About CNSE

The UAlbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $5 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE’s Albany NanoTech, from companies including IBM, AMD, GlobalFoundries, SEMATECH, Toshiba, Applied Materials, Tokyo Electron, ASML, Novellus Systems, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road
Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Quantum memory with record-breaking capacity based on laser-cooled atoms December 15th, 2017

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Error-free into the quantum computer age December 15th, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Academic/Education

Luleå University of Technology is using the Deben CT5000TEC stage to perform x-ray microtomography experiments with the ZEISS Xradia 510 Versa to understand deformation and strain inside inhomogeneous materials November 7th, 2017

Park Systems Announces the Grand Opening of the Park NanoScience Center at SUNY Polytechnic Institute November 3rd, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Chip Technology

Error-free into the quantum computer age December 15th, 2017

Columbia engineers create artificial graphene in a nanofabricated semiconductor structure: Researchers are the first to observe the electronic structure of graphene in an engineered semiconductor; finding could lead to progress in advanced optoelectronics and data processing December 13th, 2017

UCLA chemists synthesize narrow ribbons of graphene using only light and heat: Tiny structures could be next-generation solution for smaller electronic devices December 8th, 2017

Device makes power conversion more efficient: New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid December 8th, 2017

Memory Technology

Quantum memory with record-breaking capacity based on laser-cooled atoms December 15th, 2017

Leti Breakthroughs Point Way to Significant Improvements in SoC Memories December 6th, 2017

Scientists make transparent materials absorb light December 1st, 2017

A material with promising properties: Konstanz scientist synthesizes an important ferromagnetic semiconductor November 25th, 2017

Nanoelectronics

Columbia engineers create artificial graphene in a nanofabricated semiconductor structure: Researchers are the first to observe the electronic structure of graphene in an engineered semiconductor; finding could lead to progress in advanced optoelectronics and data processing December 13th, 2017

GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card November 14th, 2017

Leti Will Present 11 Papers and Host More-than-Moore Technologies Workshop November 14th, 2017

The next generation of power electronics? Gallium nitride doped with beryllium: How to cut down energy loss in power electronics? The right kind of doping November 9th, 2017

Announcements

Quantum memory with record-breaking capacity based on laser-cooled atoms December 15th, 2017

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Error-free into the quantum computer age December 15th, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Alliances/Trade associations/Partnerships/Distributorships

A new product to help combat mouldy walls, thanks to technology developed at the ICN2 December 14th, 2017

JPK Instruments announce partnership with Swiss company, Cytosurge AG. The partnership makes Cytosurge’s FluidFM® technology available on the JPK NanoWizard® AFM platform December 8th, 2017

Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time November 21st, 2017

EC Project Aims at Creating and Commercializing Cyber-Physical-System Solutions November 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project