Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > 3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors

Abstract:
3M, a leading supplier of advanced materials to the semiconductor industry, and SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of semiconductor processing equipment, today announced an agreement to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3M's WSS materials including 3M Liquid UV-Curable Adhesive and Light-To-Heat Conversion coating. Under the agreement, both companies will work closely to address customer demands for high-performance process solutions that support high-volume manufacturing with a competitive cost of ownership.

3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors

MUNICH and GARCHING, Germany | Posted on June 22nd, 2009

3M WSS uses processes and materials for temporary wafer bonding to support wafer thinning and processing of ultra thin wafers for 3-D packaging. 3M's innovative use of a UV-curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding. This is particularly important in the multiple high-temperature cycles required in subsequent wafer processing steps. After processing, 3M's unique Light-To-Heat Conversion layer allows low stress, room temperature debonding of the thinned wafer directly to the tape carrier. The thinned wafer is supported throughout the entire process reducing warpage, stress and process complexity compared to other processes that require high-temperature exposure and stress to the thinned wafer, or solvents to release the temporary bonding material. 3M's WSS enables wafer processing currently in high-volume production at multiple semiconductor sites worldwide.

"SUSS MicroTec is a recognized leader in wafer bonding and applications for 3-D and MEMS markets. Working with an industry leader, like SUSS, allows 3M to focus on advanced materials development. The joint efforts of both companies provide 3M customers with improved support, lower overall costs and faster access to more advanced solutions for their demanding 3-D packaging requirements," commented Mike Bowman, marketing development manager for 3M Electronics Markets Materials Division.

"We are pleased to collaborate with a leading material expert like 3M to offer customers a leading edge temporary bonding process with superior performance compared to current materials and processes on the market," said Wilfried Bair, general manager, Wafer Bonder Division, SUSS MicroTec. "This relationship and process offering fits nicely with SUSS MicroTec's 3-D strategy to provide a flexible and modular bonding platform that can be configured to meet customers' needs."

####

About SUSS MicroTec AG
SUSS MicroTec is a leading supplier of process and test solutions for markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership. SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany.

About 3M

A recognized leader in research and development, 3M produces thousands of innovative products for dozens of diverse markets. 3M’s core strength is applying its more than 40 distinct technology platforms – often in combination – to a wide array of customer needs. With $25 billion in sales, 3M employs 76,000 people worldwide and has operations in more than 60 countries. For more information, visit www.3M.com.

For more information, please click here

Contacts:
SUSS MicroTec
Sabine Radeboldt, Corporate Marketing Manager
Tel: +49 (0) 89 32007-395

Copyright © Business Wire 2009

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Three-dimensional graphene: Experiment at BESSY II shows that optical properties are tuneable May 24th, 2017

Leti to Demo 1st Wireless UNB Transceiver for ‘Massive Internet of Things’ at RFIC 2017 and IMS 2017: Leti Will also Present Three Papers & Two Workshops on 5G Communications IC Design, from RF to mm-Wave, During IMS 2017 and RFIC 2017 in Hawaii May 24th, 2017

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Chip Technology

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

Oddball enzyme provides easy path to synthetic biomaterials May 17th, 2017

Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology: Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program May 11th, 2017

Announcements

Three-dimensional graphene: Experiment at BESSY II shows that optical properties are tuneable May 24th, 2017

Leti to Demo 1st Wireless UNB Transceiver for ‘Massive Internet of Things’ at RFIC 2017 and IMS 2017: Leti Will also Present Three Papers & Two Workshops on 5G Communications IC Design, from RF to mm-Wave, During IMS 2017 and RFIC 2017 in Hawaii May 24th, 2017

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Tools

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

The brighter side of twisted polymers: Conjugated polymers designed with a twist produce tiny, brightly fluorescent particles with broad applications May 16th, 2017

Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology: Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program May 11th, 2017

UnitySC Announces Wafer Thinning Inspection System; Win from Power Semiconductor IDM for Automotive: Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications May 11th, 2017

Alliances/Trade associations/Partnerships/Distributorships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

BASF and Landa partner to create revolutionary pigments for automotive coatings: The alliance combines BASF innovations with Landa nano-pigment technology April 5th, 2017

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project