Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Major Power Management Components Maker Purchases Tegal Endeavor AT™ PVD System Upgrade

Abstract:
Additional Suite of Power Device Manufacturing Processes for Thin Wafer Backside Metallization Enabled by Endeavor AT System Upgrade

Major Power Management Components Maker Purchases Tegal Endeavor AT™ PVD System Upgrade

Petaluma, CA | Posted on January 15th, 2009

Tegal Corporation (Nasdaq:TGAL), a leading designer and manufacturer of plasma etch and deposition systems used in the production of power semiconductor, MEMS, and optoelectronic devices, announced today that the Company received an order for an Endeavor AT PVD cluster tool upgrade from a leading global manufacturer of power management components for the communications, consumer electronics, and industrial markets. The Endeavor AT PVD system upgrade will ship in the first quarter of CY2009, and will be used by Tegal's customer to expand the suite of thin silicon wafer backside metallization applications now running in volume production at the customer's domestic, ISO-certified wafer fab.

"Our customer's successful production experience with the superior wafer handling, film adhesion, and film eutectic creation capabilities of the Endeavor AT PVD system on thin wafer backside metallization applications resulted in this tool upgrade order, and we are pleased to have earned this repeat business," said Paul Werbaneth, Vice President - Marketing, Tegal Corporation. "Once their Endeavor AT tool was released into volume production, our customer saw demonstrable commercial advantages resulting from the S-Gun PVD processes running on the Endeavor AT, and, as a result, have now decided to upgrade their Endeavor tool in order to expand the process and production capabilities of the system."

The Tegal Endeavor AT system is a state-of the-art, ultra-high vacuum PVD cluster tool used in production fabs to deposit consistent, high purity films, with low to zero stress values, in an extremely clean process environment. Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for BAW, FBAR, and RF MEMS applications. The Endeavor AT has an easy-to-use GUI, SECS/GEM communication, reliable low-contact wafer handling, and flexible wafer shape and size capability, that make the Endeavor tool ideal for ultra-clean production environments for both front-side and back-side applications. Optional damage-free soft-etch modules, and a variety of DC, AC, and RF magnetron configurations, are available to sputter the many different dielectric and conductive films used in semiconductor, MEMS, and other electronic device production.

Safe Harbor Statement

Except for historical information, matters discussed in this news release contain forward-looking statements within the meaning of Section 27A of the Securities Act and Section 21E of the Exchange Act. Forward-looking statements, which are based on assumptions and describe our future plans, strategies and expectations, are generally identifiable by the use of the words "anticipate," "believe," "estimate," "expect," "intend," "project" or similar expressions. These forward-looking statements are subject to risks, uncertainties and assumptions about the Company including, but not limited to industry conditions, economic conditions, acceptance of new technologies and market acceptance of the Company's products and services. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by the cautionary statements in this paragraph. For a further discussion of these risks and uncertainties, please refer to the Company's periodic filings with the Securities and Exchange Commission.

####

About Tegal Corporation
Tegal sells production-qualified process tools for commercial fabrication of power semiconductor, MEMS, and optoelectronic devices. Incorporating unique, patented, etch and deposition technologies, our installed base of more than 1,700 etch and deposition systems is backed by 35+ years of continuous technology improvements, and over 100 patents. We’ve earned a reputation among our customers for award-winning support, and for supplying reliable, value-oriented systems, for Silicon DRIE MEMS and Power Device etch, AlN PVD and PZT plasma etch, precision descum, and stress-controlled metal film PVD. Some examples of products enabled by Tegal technology are power management modules found in portable computers, cellphones, and handheld consumer electronic gear; megapixel imaging chips used in digital and cellphone cameras; power amplifiers for portable handsets and wireless networking; and MEMS devices like accelerometers for consumer electronics, gaming, and automotive safety and stability control, microfluidic control devices for ink jet printers; and laboratory-on-a-chip medical test kits.

For more information, please click here

Contacts:
Tegal Corporation
Paul Werbaneth
707-765-5608
Vice President – Marketing
or
The Blueshirt Group
Chris Danne
415-217-7722

Copyright © Business Wire 2009

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Smallest possible diamonds form ultra-thin nanothreads: Diamond nanothreads are likely to have extraordinary properties, including strength and stiffness greater than that of today's strongest nanotubes and polymers September 22nd, 2014

Engineers show light can play seesaw at the nanoscale: Discovery is another step toward faster and more energy-efficient optical devices for computation and communication September 22nd, 2014

New chip promising for tumor-targeting research September 22nd, 2014

Twisted graphene chills out: When two sheets of graphene are stacked in a special way, it is possible to cool down the graphene with a laser instead of heating it up, University of Manchester researchers have shown September 22nd, 2014

Chip Technology

Twisted graphene chills out: When two sheets of graphene are stacked in a special way, it is possible to cool down the graphene with a laser instead of heating it up, University of Manchester researchers have shown September 22nd, 2014

SouthWest NanoTechnologies (SWeNT) Receives NIST Small Business Innovation Research (SBIR) Phase 1 Award to Produce Greater than 99% Semiconducting Single-Wall Carbon Nanotubes September 19th, 2014

Toward optical chips: A promising light source for optoelectronic chips can be tuned to different frequencies September 19th, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

Announcements

Engineers show light can play seesaw at the nanoscale: Discovery is another step toward faster and more energy-efficient optical devices for computation and communication September 22nd, 2014

New chip promising for tumor-targeting research September 22nd, 2014

Twisted graphene chills out: When two sheets of graphene are stacked in a special way, it is possible to cool down the graphene with a laser instead of heating it up, University of Manchester researchers have shown September 22nd, 2014

New star-shaped molecule breakthrough: Scientists at The University of Manchester have generated a new star-shaped molecule made up of interlocking rings, which is the most complex of its kind ever created September 22nd, 2014

Tools

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

FEI Opens New Technology Center in Czech Republic: FEI expands its presence in Brno with the opening of a new, larger facility September 18th, 2014

New NPZ100-403 Piezo Stage from nPoint Inc. September 17th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

New-Contracts/Sales/Customers

Fullerex: Talga Resources Joins INSCX™ Exchange September 4th, 2014

Global Energy Systems Signs Master Sales Agreement with China Aviation Supplies Group September 4th, 2014

East China University of Science and Technology Purchases Nanonex Advanced Nanoimprint Tool NX-B200 July 30th, 2014

University of Manchester selects Anasys AFM-IR for coatings and corrosion research July 30th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE