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Home > Press > FSI International Receives Follow-on Order for ORION® Single Wafer Cleaning Technology from Major Semiconductor Manufacturer

Abstract:
New cleaning capability will be integrated into manufacturing for BEOL copper/low-k interconnect fabrication

FSI International Receives Follow-on Order for ORION® Single Wafer Cleaning Technology from Major Semiconductor Manufacturer

Minneapolis, MN | Posted on January 7th, 2009

FSI International, Inc. (Nasdaq: FSII) a leading supplier of wafer processing, cleaning and surface conditioning equipment for semiconductor manufacturing, announced today the receipt of an additional order for its new ORION® single wafer cleaning technology from a major semiconductor manufacturer. The follow-on order provides expanded cleaning capacity and capability beyond the original order, announced on December 23, 2008. The additional purchase was motivated by the excellent on-site performance of the currently installed ORION tool. The ORION system will be used in manufacturing for BEOL fabrication of copper/low-k interconnects.

"This order is especially important to us as it validates the use of our ORION technology in manufacturing," said Don Mitchell, FSI's president and CEO. "This customer had initially evaluated our new single wafer technology for BEOL 32nm processes. Their experience with the ORION system's performance was sufficient for them to extend its value to existing manufacturing. The order reassures us that, even in the current industry downturn, our customers are willing to invest in new technology that delivers superior performance and clear economic benefits."

The ORION system's unique closed-chamber design addresses critical path cleaning issues for both FEOL and BEOL advance manufacturing processes. For more information on the FSI ORION system, visit the FSI web site at www.fsi-intl.com/index.php/index.php/applications-and-products/orion-single-wafer-cleaning-cluster.

####

About FSI International, Inc.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.

For more information, please click here

Contacts:
FSI International, Inc.
Trade Media:
Laurie Walker
952-448-8066
or
Financial Media and Investors:
Benno Sand
952-448-8936

Copyright © Business Wire 2008

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