Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > Conductive adhesive could replace solder

October 15th, 2008

Conductive adhesive could replace solder

Abstract:
Researchers have invented a nanotube-based dry adhesive that they propose using instead of solder to assemble components on circuit boards. The adhesive, which has very high electrical and thermal conductivity, models its sticking power on the foot of the gecko lizard. It works without heat or solvents, permitting use in the vacuum environments used to make chips and in space.

"This will be useful to put electronic components together because the nanotubes have very high thermal conductivity," said professor Liming Dai at Ohio's University of Dayton. Carbon nanotubes, which have very high electron mobility, enable the adhesive to be used to assemble chips on boards without the heat of soldering. The researchers are also experimenting with patterning the material onto chips themselves.

Source:
eetimes.com

Bookmark:

Related News Press

News and information

Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013

Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013

Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Chip Technology

UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013

Nanoelectronics

Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013

Piezoelectric 'taxel' arrays convert motion to electronic signals for tactile imaging April 25th, 2013

Battery and Memory Device in One April 25th, 2013

Secret of the Crystal's Corners: New Nanowire Structure Has Potential to Increase Semiconductor Applications: University of Cincinnati research describes discovery of a new structure that is a fundamental game changer in the physics of semiconductor nanowires April 23rd, 2013

Discoveries

Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013

Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013

Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013

Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013

Announcements

Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013

Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013