Home > Press > SUSS MicroTec Announces 300 mm ProbeShield System Order: ProbeShield® Technology Chosen over Competition in Head-to-Head Comparison at Major Asian Me
Abstract:
SUSS MicroTec Test Systems has announced that it has received an order for the PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test, from a major Asian semiconductor memory manufacturer.
SUSS MicroTec Announces 300 mm ProbeShield System Order: ProbeShield® Technology Chosen over Competition in Head-to-Head Comparison at Major Asian Me
DRESDEN, Germany | Posted on September 4th, 2008
The decision follows a six-month, head-to-head comparison against the incumbent and major competition for wafer-level test solutions at the manufacturer's facilities. During this time, several benchmarking activities were undertaken. These consisted mainly of advanced tests of semiconductor devices, such as flicker noise, I-V, C-V and S-parameter measurements, which are used to extract critical parameters in the device design and process control phases. SUSS MicroTec's ProbeShield Technology consistently outperformed the competitive solutions, leading to its ultimate selection.
"The engineers at the manufacturer chose ProbeShield Technology due to the superior measurement results and significant time savings the advanced feature sets provide," said Rob Carter, Vice President of Marketing and Sales for SUSS MicroTec Test Systems. "They were particularly impressed with the unattended test capabilities that are provided with the unique Automated Thermal Management™ (ATM) and ReAlign™ functions."
The ATM and ReAlign features enable test procedures to run through the night and weekends at multiple temperature settings without operator intervention to re-align the probe tips to the test pads on the wafer each time temperature changes.
####
About SUSS MicroTec Test Systems
SUSS MicroTec Test Systems GmbH is a part of the SUSS MicroTec group listed in Deutsche Börse AG’s Prime Standard.
SUSS MicroTec is one of the world’s leading suppliers of process and testing solutions for markets such as 3D Integration, advanced packaging, MEMS, nanotechnology and compound semiconductor. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.
SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. Headquartered in Garching near Munich, Germany, SUSS MicroTec employs more than 730 employees worldwide.
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.
For more information, please click here
Contacts:
SUSS MicroTec Test Systems
Joshua M. Preston, Marketing Group Manager
Tel: +49 (0) 35240 73-0
Copyright © Business Wire 2008
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013
NanoInk, Inc. Assets To Be Sold May 18th, 2013
Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
Chip Technology
UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013
Nanometrics Announces Upcoming Investor Events May 14th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013
Announcements
Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013
NanoInk, Inc. Assets To Be Sold May 18th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
New-Contracts/Sales/Customers
Harris & Harris Group Notes the Sale of a Second D-Wave Quantum Computer May 16th, 2013
Industrial Nanotech Announces 3300 Gallon Nansulate(R) Crystal Order - First of Five Orders Expected to Total Over 15,000 Gallons May 13th, 2013
Robert Bosch GmbH places order for SolMateS' Pulsed Laser Deposition system March 1st, 2013
JPK reports on the applied research of Ioan Notingher at the University of Nottingham using AFM and the Tip Assisted Optics module to study individual nanotubes and fibrils. February 27th, 2013