Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Breaking News; Tegal Acquires Alcatel Micro Machining

Abstract:
Tegal Corporation (NASDAQ: TGAL), a leading designer and manufacturer of plasma etch and deposition systems, today announced that it has signed an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their Deep Reactive Ion Etch (DRIE) and Plasma Enhanced Chemical Vapor Deposition (PECVD) products, and the related intellectual property, directed at advanced 3-dimensional wafer-level packaging applications. The restricted stock and cash deal, valued at US$5 million, is expected to close later this month. As part of the agreement, Gilbert Bellini, President of AMMS, will be appointed to Tegal's Board of Directors.

Breaking News; Tegal Acquires Alcatel Micro Machining

Petaluma, CA | Posted on September 2nd, 2008

The agreement calls for the continued support by AMMS of the existing installed base of DRIE tools in use by MEMS and integrated device manufacturers. Tegal will continue the development of the AMMS DRIE product line, including the integration of the AMMS process modules on its recently-introduced Compact™ bridge platform and the completion of a 300mm process chamber. In addition, Tegal will assume responsibility for AMMS' joint development programs with key customers, as well as research and academic institutions.

"This is an important strategic move for Tegal," said Thomas Mika, Chairman, President and CEO of Tegal. "These products, along with our current etch and deposition technologies, will form the basis for a comprehensive strategy to aggressively pursue a large, high growth market in MEMS and semiconductor device manufacturing. With this transaction, we believe that we can offer customers the best combination of leading edge technology, customer support and proven systems for production applications."

"Tegal is well-known for providing advanced processes and production tools to MEMS and semiconductor device manufacturers worldwide," said Gilbert Bellini, President of AMMS. "I am proud to be associated with Tegal and pleased to work with the Company as a director to ensure the smooth transition of the AMMS business to Tegal in the near-term and to help guide Tegal into the rapidly expanding markets for 3D wafer level packaging applications."

At closing, Tegal will pay to AMMS US$1 million in cash and US$ 4 million worth of newly issued shares of Tegal common stock. The number of shares to be issued will be equal to US$4,000,000 divided by the average of the closing sales prices of Tegal common stock for the five (5) consecutive trading days immediately prior to the closing date of the Acquisition. Completion of the transaction is subject to customary closing conditions, but parties expect to close the transaction on or about September 16, 2008. Tegal's senior management will conduct a conference call today at 5:00 p.m. EDT / 2:00 p.m. PDT to discuss the agreement between Tegal and AMMS. More information about the conference call is provided below.

Conference Call

The company will host a conference call for investors today (September 2, 2008) at 5:00 p.m. EDT /2:00 p.m. PDT. The dial-in phone numbers are 866-203-3436 or 617-213-8849. Investors should reference passcode: 82647184. A digital recording will be made available two hours after the completion of the conference call, and it will be accessible through midnight on September 16, 2008. To access, investors should dial 888-286-8010 or 617-801-6888 and enter passcode: 82455405. A replay of the teleconference will be available on the Company's website.

####

About Tegal Corporation
Tegal provides process and equipment solutions to leading edge suppliers of LED, optoelectronic, magnetic data storage, advanced semiconductor, MEMS, and nanotechnology devices. Incorporating unique, patented etch and deposition technologies, Tegal’s system solutions are backed by over 35 years of advanced development and over 100 patents. Some examples of devices enabled by Tegal
technology are energy efficient memories found in portable computers, cell phones, PDAs and RFID applications; megapixel imaging chips used in digital and cell phone cameras; power amplifiers for portable handsets and wireless networking gear; and MEMS devices like accelerometers for automotive airbags, microfluidic control devices for ink jet printers; and laboratory-on-a-chip medical test kits.

About Alcatel Micro Machining Systems and Alcatel Lucent

Alcatel Micro Machining Systems (AMMS) is a subsidiary of Alcatel-Lucent. AMMS is specialized in designing, manufacturing, marketing and servicing Deep Reactive Ion Etch (DRIE) systems as well as Plasma Enhanced Chemical Vapor Deposition (PECVD) systems for the fabrication of MEMS (Micro Electro Mechanical Systems) and Semiconductor devices. Its main application markets are the telecommunication, automotive, aerospace, computer peripheral, biomedical industries and semiconductors, including power devices and wafer level packaging. For more information about AMMS, please visit: www.alcatelmicromachining.com   

Alcatel-Lucent provides solutions that enable service providers, enterprises and governments worldwide, to deliver voice, data and video communication services to end-users. As a leader in fixed, mobile and converged broadband access, carrier and enterprise IP technologies, applications, and services, Alcatel-Lucent offers the end-to-end solutions that enable compelling communications services for people at home, at work and on the move. With 77,000 employees and operations in more than 130 countries, Alcatel-Lucent is a local partner with global reach. The company has the most experienced global services team in the industry, and Bell Labs, one of the largest research, technology and innovation organizations focused on communications. Alcatel-Lucent achieved adjusted revenues of Euro 17.8 billion in 2007, and is incorporated in France, with executive offices located in Paris. For more information about Alcatel-Lucent, please visit: www.alcatel-lucent.com  

Safe Harbor Statement

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on AMMS’ and Tegal’s respective current expectations, estimates and projections about their respective industry and businesses, respective management's beliefs, and certain assumptions made by AMMS and Tegal, all of which are subject to change. Forward-looking statements can often be identified by words such as “aims,” "anticipates," “becoming,” "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," “targeted” similar expressions, and variations or negatives of these words. Examples of such forward-looking statements include, but are not limited to, references to the anticipated benefits to Tegal related to its acquisition of the AMMS business, the expected market and demand for AMMS products, the expected completion and timing of the transaction, and references to the anticipated benefits to Tegal relating to the transaction. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Tegal in connection with the acquisition of the AMMS business include, but are not limited to:

• the ability of the parties to successfully consummate the transactions contemplated by the asset purchase agreement and related transaction documents;

• unexpected variations in market growth and demand for the AMMS products and technologies;

• the risks inherent in acquisitions of technologies and businesses, including the timing and successful completion of technology and product development through volume production;

• integration issues;

• costs and unanticipated expenditures;

• changing relationships with customers, suppliers and strategic partners;

• potential contractual, intellectual property or employment issues;

• the risk that anticipated benefits of the acquisition may not be realized; and

• accounting treatment and charges.

The Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings of Tegal discuss other important risk factors that could contribute to such differences or otherwise affect Tegal’s business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. Tegal undertakes no obligation to revise or update publicly any forward-looking statement for any reason, except as required by law. All statements made by or concerning Tegal or AMMS or Alcatel Lucent, respectively, are made solely by such applicable party and such party is solely responsible for the content of such statements.

For more information, please click here

Copyright © Tegal Corporation

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Simulating magnetization in a Heisenberg quantum spin chain April 5th, 2024

NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024

Innovative sensing platform unlocks ultrahigh sensitivity in conventional sensors: Lan Yang and her team have developed new plug-and-play hardware to dramatically enhance the sensitivity of optical sensors April 5th, 2024

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

Chip Technology

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024

HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024

Electrons screen against conductivity-killer in organic semiconductors: The discovery is the first step towards creating effective organic semiconductors, which use significantly less water and energy, and produce far less waste than their inorganic counterparts February 16th, 2024

Announcements

NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024

Innovative sensing platform unlocks ultrahigh sensitivity in conventional sensors: Lan Yang and her team have developed new plug-and-play hardware to dramatically enhance the sensitivity of optical sensors April 5th, 2024

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

A simple, inexpensive way to make carbon atoms bind together: A Scripps Research team uncovers a cost-effective method for producing quaternary carbon molecules, which are critical for drug development April 5th, 2024

Tools

First direct imaging of small noble gas clusters at room temperature: Novel opportunities in quantum technology and condensed matter physics opened by noble gas atoms confined between graphene layers January 12th, 2024

New laser setup probes metamaterial structures with ultrafast pulses: The technique could speed up the development of acoustic lenses, impact-resistant films, and other futuristic materials November 17th, 2023

Ferroelectrically modulate the Fermi level of graphene oxide to enhance SERS response November 3rd, 2023

The USTC realizes In situ electron paramagnetic resonance spectroscopy using single nanodiamond sensors November 3rd, 2023

Acquisitions/Mergers/Splits

The concept of creating «brain-on-chip» revealed: A team of scientists is working to create brain-like memristive systems providing the highest degree of adaptability for implementing compact and efficient neural interfaces, new-generation robotics, artificial intelligence, perso May 29th, 2020

180 Degree Capital Corp. Life Science Portfolio Company Enters Into Definitive Agreement to be Acquired May 6th, 2020

180 Degree Capital Corp.’s Portfolio Company, Synacor, Inc., Agrees to Merge with Qumu Corporation in All-Stock Transaction February 11th, 2020

Combination of Nanometrics and Rudolph Technologies to Create Onto Innovation October 16th, 2019

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project