Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Rensselaer Researcher Wins IEEE Award for Work on 3-D Computer Chips

Abstract:
A professor at Rensselaer Polytechnic Institute will be recognized this week for research and technical achievements toward the design and realization of 3-D integrated computer chips.

Rensselaer Researcher Wins IEEE Award for Work on 3-D Computer Chips

Troy, NY | Posted on May 28th, 2008

James Jian-Qiang Lu, associate professor in the Department of Electrical, Computer, and Systems Engineering (ECSE) and the Center for Integrated Electronics (CIE) at Rensselaer, will receive the 2008 IEEE CPMT Exceptional Technical Achievement Award from the Institute of Electrical and Electronics Engineers' Components, Packaging and Manufacturing Technology Society.

The award — designated for an individual or group who develops a significant invention, introduces an important new technology or product, or advances the state-of-the-art in the CPMT Society's field of interest — honored Lu as a leader in the field of 3-D chip packaging and manufacturing.

"Dr. Lu is being recognized as a pioneer and technical leader in 3-D integration/packaging. His contributions span nearly 20 years and have resulted in more than 150 publications in this field in refereed journals, book chapters, trade press journals, and conferences," the IEEE CPMT said in the award citation. The award also included a $2,500 prize.

The award will be presented at the international 2008 IEEE Electronic Components and Technology Conference on May 29 in Lake Buena Vista, Fla. Lu will attend the conference and present both a research paper and a professional development course on 3-D integration.

Lu is a pioneer and technical leader in 3-D computer chip integration, and has been working to design the processes and architecture that could one day be the platform for 3-D chips.

Flat, conventional computer chips used today can only shrink so much smaller, as their flat surface must have enough room to accommodate scores of different components. But the semiconductor industry and academia are looking at ways to layer chip components into a vertical, 3-D stack, which could dramatically shrink the size of the overall chip and take advantage of high data bandwidth, performance efficiency, and functionality increase of the 3-D integration.

Lu's research spans a wide spectrum of micro- nano-electronics technology, from theory and design to materials, devices, processing, and system integration. He also studies 3-D hyper-integration technology and micro-nano-bio interfaces for future chips, novel electron devices, interconnect technology, micro-system integration technology for micro-electrical-mechanical systems (MEMS), and has long-term research projects on photonics, nanotech, bio-MEMS, bio-engineering, bio-inspired devices, and information processing/computation.

He has collaborated with many on-campus colleagues from the departments of ECSE; Physics; Materials Science and Engineering; Chemical and Biological Engineering; as well as Mechanical, Aerospace, and Nuclear Engineering at Rensselaer. Lu has collaborated with off-campus researchers from the College of Nanoscale Science and Engineering at University at Albany, Massachusetts Institute of Technology, Georgia Institute of Technology, IBM Corp., Freescale Semiconductor, SEMATECH, and EVGroup.

Lu's research has been supported by Defense Advanced Research Projects Agency, the Microelectronics Advanced Research Corporation, and the New York State Foundation for Science, Technology and Innovation (NYSTAR) through the Interconnect Focus Center, National Science Foundation, Semiconductor Research Corp., IBM, SEMATECH, Freescale, EVGroup, and other organizations.

For more information on Lu's research into 3-D integration, visit: www.rpi.edu/research/magazine/spring05/chips.html or news.rpi.edu/update.do?artcenterkey=2186.

####

About Rensselaer Polytechnic Institute
Rensselaer Polytechnic Institute, founded in 1824, is the nation’s oldest technological university. The university offers bachelor’s, master’s, and doctoral degrees in engineering, the sciences, information technology, architecture, management, and the humanities and social sciences. Institute programs serve undergraduates, graduate students, and working professionals around the world. Rensselaer faculty are known for pre-eminence in research conducted in a wide range of fields, with particular emphasis in biotechnology, nanotechnology, information technology, and the media arts and technology. The Institute is well known for its success in the transfer of technology from the laboratory to the marketplace so that new discoveries and inventions benefit human life, protect the environment, and strengthen economic development.

For more information, please click here

Contacts:
Michael Mullaney
Phone: (518) 276-6161

Copyright © Rensselaer Polytechnic Institute

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Nanoelectronics

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Announcements

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Grants/Sponsored Research/Awards/Scholarships/Gifts/Contests/Honors/Records

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

2-faced 2-D material is a first at Rice: Rice University materials scientists create flat sandwich of sulfur, molybdenum and selenium August 14th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Landscapes give latitude to 2-D material designers: Rice University, Oak Ridge scientists show growing atom-thin sheets on cones allows control of defects August 9th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project