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May 9th, 2008
The latest research developments in interconnect technologies will be featured at IITC this summer. The two most interesting trends: 3D ICs and nanotube interconnects. The International Interconnect Technology Conference (Burlingame, Calif., June 2 - 4) is a forum to address interconnect issues from the system level.
"Interconnect" is the wiring system that connects transistors and other components on an integrated circuit. The interconnect problem threatens to retard the development of chip technology. Papers presented at IITC address this problem.
This year, Georgia Tech, IBM and Nanonexus researchers will describe an integrated microfluidic heat sink technology for 3D integrated circuits. The primary challenge with stacked chips is how to remove the heat generated by their operation. For example, the power density of two stacked high-performance microprocessors may be as much as 200W/cm2, implying a heat flux beyond the capacity of current fan-cooling technology.
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