Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EVG Achieves Key MEMS Market Milestones, Installing 500th Bond Chamber and 100th Automated Wafer Bonder for High-volume Manufacturing Environments

Abstract:
-- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced it has successfully installed its 500th bond chamber and 100th automated production wafer bonder for high-volume manufacturing. Today's milestone achievement is testament to EVG's systems' ease of implementation and performance within high-volume production lines and its proximity to its customers around the globe -- enabling superior service and support.

EVG Achieves Key MEMS Market Milestones, Installing 500th Bond Chamber and 100th Automated Wafer Bonder for High-volume Manufacturing Environments

ST. FLORIAN, Austria | Posted on November 1st, 2007

According to Jean-Christophe Eloy, general manager of Lyon, France-based market research firm Yole Developpement, "Wafer-bonding equipment developed for MEMS manufacturing, particularly for wafer-level packaging, has been widely adopted into full-volume production for a wide range of devices -- from compound semiconductors, such as LEDs and high-brightness LEDs, to integrated circuits, such as SOI-based and power devices, 3D devices and image sensors -- and for more and more applications. As a result, the market for wafer-bonding equipment is experiencing more than 20-percent growth per year, with EVG leading the way, especially for production-level tools. These milestone installations further underscore the importance of wafer bonding as a key process for IC and MEMS manufacturing."

"EVG has significant influence on the MEMS value chain, especially on the speed of new-product commercialization through optimizing the cost of ownership for production equipment," noted Herwig Kirchberger, business development manager for EVG. "It's essential for our company to be as close to the market as possible, and for our customers to rapidly implement capabilities for future requirements. The latest capabilities on our GEMINI fully automated high-precision aligned wafer bonding cluster with optional pre-processing chambers for novel wafer-level-MEMS packaging applications include throughput of up to 20 wafers per hour and a post-bond alignment accuracy of less than 1 micron at 3 sigma. We look forward to continuing to bring new innovations to our growing global customer base."

In related MEMS news, EVG also announced today that it is the Platinum sponsor of the MEMS Executive Congress(R), which will be held November 4-5, 2007 in Del Mar, Calif. EVG's Vice President and General Manager of North America, Steven Dwyer, will kick off the conference on Monday, Nov. 5 -- introducing both the keynote speaker and subsequent panel sessions, which will focus on the role of MEMS in areas such as energy, mobile media, consumer goods and bio/medical.

Commenting on EVG's active participation at the event, Karen Lightman, managing director of the MEMS Industry Group noted, "As MEMS devices are used as components in a number of well-publicized commercial applications, most notably the Nintendo Wii and the Apple iPhone, interest in MEMS technology is at an all-time high. To respond to this interest, we have assembled an elite group of executives representing a wide spectrum of industries. We are proud to be at the center of this unprecedented gathering of industry leaders such as EVG who are like-minded in their goal of accelerating the deployment of MEMS technology."

Editors interested in meeting with EVG during the MEMS Executive Congress ( http://www.memscongress.com/ ) can contact Marie Labrie of MCA via email at or phone: (650) 968-8900, ext. 119.

####

About EV Group (EVG)
Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EVG holds the dominant share of the market for wafer bonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). The company's unique Triple i approach (INVENT - INNOVATE - IMPLEMENT) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit http://www.evgroup.com/ and our EVG-TShop "Click, Stop -- the new way to shop" http://www.evgtshop.com/ .

For more information, please click here

Contacts:
EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian/Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

MEMS

First Capacitive Transducer with 13nm Gap July 27th, 2017

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Chip Technology

Nagoya physicists resolve long-standing mystery of structure-less transition: Nagoya University-led team of physicists use a synchrotron radiation X-ray source to probe a so-called 'structure-less' transition and develop a new understanding of molecular conductors August 21st, 2017

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Announcements

Nagoya physicists resolve long-standing mystery of structure-less transition: Nagoya University-led team of physicists use a synchrotron radiation X-ray source to probe a so-called 'structure-less' transition and develop a new understanding of molecular conductors August 21st, 2017

Tokai University research: Nanomaterial wrap for improved tissue imaging August 21st, 2017

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Events/Classes

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

FRITSCH Milling and Sizing! Innovations at POWTECH 2017 - Hall 2 Stand 227 August 9th, 2017

Thermo Fisher Scientific Showcases Innovations in Electron Microscopy and Spectroscopy at M&M 2017: New analytical technologies improve workflows for life sciences and materials science researchers August 8th, 2017

Nanometrics Announces Upcoming Investor Events August 3rd, 2017

Printing/Lithography/Inkjet/Inks/Bio-printing

Researchers printed graphene-like materials with inkjet August 17th, 2017

Simultaneous Design and Nanomanufacturing Speeds Up Fabrication: Method enhances broadband light absorption in solar cells August 5th, 2017

Meniscus-assisted technique produces high efficiency perovskite PV films July 7th, 2017

Carbodeon demonstrates NanoDiamond nickel coatings with enhanced tribological properties June 7th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project