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October 3rd, 2007
A completely new nano-size surface finish is being introduced by Ormecon International into the printed circuit board market.
The thickness is only 55nm, with the layer consisting of a nanoparticle complex formed between the organic nanometal and silver (the silver contributes less than 10 per cent to the total thickness).
Nonetheless, this ultrathin layer is claimed to provide greater oxidation protection and solderability preservation than any other established metallic finish such as ENIG, immersion silver, immersion tin or OSP - although the established finishes are between six and 100 times thicker than this new nanofinish.
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