Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > News > Nano-scale finish offers PCB protection

October 3rd, 2007

Nano-scale finish offers PCB protection

Abstract:
A completely new nano-size surface finish is being introduced by Ormecon International into the printed circuit board market.

The thickness is only 55nm, with the layer consisting of a nanoparticle complex formed between the organic nanometal and silver (the silver contributes less than 10 per cent to the total thickness).

Nonetheless, this ultrathin layer is claimed to provide greater oxidation protection and solderability preservation than any other established metallic finish such as ENIG, immersion silver, immersion tin or OSP - although the established finishes are between six and 100 times thicker than this new nanofinish.

Source:
engineerlive.com

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

NUS scientists use low cost technique to improve properties and functions of nanomaterials: By 'drawing' micropatterns on nanomaterials using a focused laser beam, scientists could modify properties of nanomaterials for effective applications in photonic and optoelectric applicat July 22nd, 2014

Nanoelectronics

A Crystal Wedding in the Nanocosmos July 23rd, 2014

3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

IBM Announces $3 Billion Research Initiative to Tackle Chip Grand Challenges for Cloud and Big Data Systems: Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future July 10th, 2014

Carbodeon enables 20 percent increase in polymer thermal filler conductivity with 0.03 wt.% nanodiamond additive at a lower cost than with traditional fillers: Improved materials and processes enable nanodiamond cost reductions of up to 70 percent for electronics and LED app July 9th, 2014

Announcements

Silicene Labs Announces the Launch of Patent-Pending, 2D Materials Composite Index™ : The Initial 2D Materials Composite Index™ for Q2 2014 Is: 857.3; Founders Include World-Renowned Physicist and Seasoned Business and IP Professionals July 24th, 2014

Iranian Scientists Produce Transparent Nanocomposite Coatings with Longer Lifetime July 24th, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE