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SUSS MicroTec (FWB:SMH)(GER:SMH) and Surface Technology Systems, two of the leading providers of MEMS manufacturing solutions worldwide, announced today a U.S. based roadshow called "MEMS Technology: Embracing the Future," scheduled to debut in Boston, Massachusetts on April 20th.
"MEMS Technology: Embracing the Future" will include presentations on the latest critical manufacturing processes in MEMS today. Talks will cover high aspect ratio lithography and plasma etching, wafer bonding, ,dry release processing and wafer level test. In addition, speakers will discuss the key manufacturing issues critical for advanced MEMS device fabrication today. SUSS and STS have invited representatives from Primaxx, Inc. and XACTIX, Inc. to join the roadshow, creating a unique opportunity to listen to industry experts cover most of the key MEMS technologies used today.
John Saunders, CEO of STS explained "We are very excited to have the opportunity to co-host this roadshow and share our experience and vision for the future of MEMS manufacturing. Like SUSS, we are committed to advancing technology and enabling customers to manage the complexities of MEMS chip fabrication today."
"We work every day with MEMS customers who are pushing the technology envelope," said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. "By coming together with companies like STS who do the same, we are in a unique position to help the industry develop strategies for handling rapidly changing technology and MEMS manufacturing challenges."
The "MEMS Technology: Embracing the Future" roadshow will begin in Boston on April 20th and in the following weeks will move on to geographic technology centers including Austin, TX and San Jose, CA. Presenters will provide an overview of the leading-edge technologies currently available to support the most advanced MEMS processes. More detailed information is available at http://www.memsroadshow.com/ .
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit http://www.suss.com .
About Surface Technology Systems plc
STS designs and manufactures a range of highly specialized systems incorporating innovative technology used in the production of semiconductors and related devices and is a leader in plasma based etch and deposition technologies for processing non ‘mainstream’ semiconductor devices. STS serves a range of applications in several emerging sectors within the telecommunications, data storage, advanced packaging, MEMS and Nanotechnology.
STS is the market leader in deep silicon etching for the growing MEMS market, offering patent-protected technology. In addition, STS has a strong presence in each of its other served markets and distributes its process solutions worldwide through an experienced sales and service operation. The Group currently markets in over 30 countries and has an installed base of over 900 systems. For more information about STS please see http://www.stsystems.com
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.
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Fiona Kemp, Corporate Communications Manager
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