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Home > News > Gutenberg + nanotechnology = printable electronics

February 26th, 2007

Gutenberg + nanotechnology = printable electronics

Abstract:
Nanoelectronics devices often are made by integrating dissimilar classes of semiconductors and various other disparate materials into one heterogeneous single system. The two primary modes of combining these materials - mechanical bonding and epitaxial growth processes - place stringent requirements on the ultimate scale or constituent materials of circuits. With mechanical bonding, there is a limited ability to scale to large areas (i.e., larger than the wafers) or to more than a few stacking layers; incompatibility with unusual materials (such as nanostructured materials) and/or low-temperature materials and substrates; challenging fabrication and alignment for the through-wafer electrical interconnects; demanding requirements for planar bonding surfaces; and bowing and cracking that can occur from mechanical strains generated by differential thermal expansion and contraction of disparate materials. Epitaxy avoids some of these problems but places severe restrictions on the quality and type of materials that can be grown. Using a process akin to the printing press, researchers have managed to bypass the need for epitaxial growth or wafer bonding to integrate wide ranging classes of dissimilar semiconducting nanomaterials onto substrates for the purpose of constructing heterogeneous, three dimensional electronics.

Source:
nanowerk.com

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