Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > UMC to build second 12-inch fab

January 18th, 2007

UMC to build second 12-inch fab

Abstract:
Taiwan's United Microelectronics Corp. announced Jan. 8 that it had launched an investment plan to construct a new 12-inch wafer plant in southern Taiwan, and that its new nanotechnology research and development center was on target for completion by the end of March.

Source:
taiwanjournal.nat.gov.tw

Bookmark:

Related News Press

Investments/IPO's/Splits

Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013

Harris & Harris Group Notes the Sale of a Second D-Wave Quantum Computer May 16th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

Nanostart-holding New Asia Investments invests in breakthrough water projects May 13th, 2013

Chip Technology

UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013

Industrial

Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013

Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Peratech designs the QTC Ultra Sensor - an ultra-sensitive touch sensor for domestic, commercial and industrial use: Pressure sensor so sensitive that it can be operated through glass or steel sheet May 13th, 2013