Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > Nanosys, DoCoMo Capital, and NTT DoCoMo to Collaborate...

January 11th, 2007

Nanosys, DoCoMo Capital, and NTT DoCoMo to Collaborate...

Abstract:
Nanosys, Inc. and DoCoMo Capital, Inc., a wholly owned US subsidiary of NTT DoCoMo, Inc., today announced they have entered into an exclusive collaboration agreement among Nanosys, DoCoMo Capital, and NTT DoCoMo, Inc. to develop Nanosys' nanotechnology platform for potential product opportunities in wireless communications for mobile telephone applications in Japan. Under the terms of the agreement, NTT DoCoMo and DoCoMo Capital will fund development efforts at Nanosys and NTT DoCoMo. In addition, DoCoMo Capital announced its equity investment in Nanosys. Financial details of the agreements were not disclosed.

Source:
marketwire.com

Bookmark:

Related News Press

Investments/IPO's/Splits

Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013

Harris & Harris Group Notes the Sale of a Second D-Wave Quantum Computer May 16th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

Nanostart-holding New Asia Investments invests in breakthrough water projects May 13th, 2013

Announcements

Penn engineers' nanoantennas improve infrared sensing May 20th, 2013

Researchers Perform Fastest Measurements Ever Made of Ion Channel Proteins May 20th, 2013

Kinks and curves at the nanoscale: New research shows 'perfect twin boundaries' are not so perfect May 20th, 2013

Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013

Alliances/Partnerships/Distributorships

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013