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April 13th, 2006
University of Wisconsin-Madison researchers have demonstrated a way to release thin membranes of semiconductors from a substrate and transfer them to new surfaces — an advance that could unite the properties of silicon and many other materials, including diamond, metal and even plastic.
The new technique makes tuning the strain of materials simpler, while avoiding the defects that normally result. In addition, Lagally says, "We're no longer held to a rigid rock of material. We now have the ability to transfer the membranes to anything we want. So there are some really novel things we can do."
University of Wisconsin-Madison
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