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Home > News > Carbon nanofibre forest cuts thermal resistance

November 23rd, 2005

Carbon nanofibre forest cuts thermal resistance

Abstract:
NASA is using carbon nanotubes to cut thermal resistance, aiming to improve heat flow between chips and heatsinks. With conventional smooth heatsink surfaces “thermal conductivity is poor because of surface roughness”, Dr Jun Li of NASA’s Ames Research Center told Electronics Weekly. “Normally you have to put on grease or to solder with a eutectic to make it better.” Li’s alternative uses a form of nanotube called carbon nanofibres in the interface.

Source:
electronicsweekly.com

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