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Home > News > Researchers propose futuristic interconnects for ICs

June 8th, 2005

Researchers propose futuristic interconnects for ICs

At the IEEE International Interconnect Technology Conference (IITC) here, researchers presented several futuristic technologies to solve the interconnect bottleneck in chip design. Activated bonding, air gap, carbon nanotubes, molecular wires, optical interconnects and spin-wave buses were among the technologies proposed at the event.

EETimes UK

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