- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
April 25th, 2005
A published road map for the semiconductor industry has the smallest distances between wires on a memory chip shrinking from 90 nanometers today to 65nm in 2007, to 45nm in 2010, to 32nm in 2013 and on down from there.
"What they are going to do 12 years from now is mapped out, but they don't have a clue how to do that," says (HP Labs' Duncan) Stewart. "In fact, they think they may not be able to do it."
The 32nm milestone is "a reasonable place for us to inject some of these ideas," he says. The idea isn't to replace silicon transistors but to build certain devices, such as ultradense memories, on top of CMOS chips. Stewart says HP hopes to eventually build crossbar devices smaller than 3nm.
|Related News Press|
Breaking cell barriers with retractable protein nanoneedles: Adapting a bacterial structure, Wyss Institute researchers develop protein actuators that can mechanically puncture cells February 12th, 2016
Properties of Polymeric Nanofibers Optimized to Treat Damaged Body Tissues February 12th, 2016
A metal that behaves like water: Researchers describe new behaviors of graphene February 12th, 2016
Research reveals carbon films can give microchips energy storage capability: International team from Drexel University and Paul Sabatier University reveals versatility of carbon films February 11th, 2016
The iron stepping stones to better wearable tech without semiconductors February 8th, 2016
Spin dynamics in an atomically thin semi-conductor February 1st, 2016
Russia’s Nano-enabled Products Market to Witness Massive Growth February 8th, 2011
Adept Technology Announces Orders for Over $600K from Chinese Partner January 18th, 2011
Nanostart-held ItN Nanovation Receives Major Follow-on Order in Saudi Arabia November 29th, 2010
Homegrown Companies Developing Batteries for Clean Energy Storage November 2nd, 2010