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Home > News > Samsung mulls new 300mm fab for 65nm chips

August 30th, 2004

Samsung mulls new 300mm fab for 65nm chips

Abstract:
Continuing to expand its capacity, Korea's Samsung Electronics Co. Ltd has disclosed plans that it is looking to build a new wafer fab for use in processing devices at the 65nm node. The proposed fab would be a 300mm facility, which would make NAND-based flash memories and other 65nm products. The company is already developing its first sub-70nm parts, including an 8-gigabit flash-memory device for advanced NAND applications.

Source:
EETimes

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