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Home > News > Samsung mulls new 300mm fab for 65nm chips

August 30th, 2004

Samsung mulls new 300mm fab for 65nm chips

Continuing to expand its capacity, Korea's Samsung Electronics Co. Ltd has disclosed plans that it is looking to build a new wafer fab for use in processing devices at the 65nm node. The proposed fab would be a 300mm facility, which would make NAND-based flash memories and other 65nm products. The company is already developing its first sub-70nm parts, including an 8-gigabit flash-memory device for advanced NAND applications.


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