Home > News > Nanometrics Announces Integration of NanoOCD
February 17th, 2004
Nanometrics Announces Integration of NanoOCD
Nanometrics, Inc. today announced that it has entered into an integrated metrology agreement with Lam Research Corporation. Under the agreement, Lam has integrated a Nanometrics' NanoOCD/DUV 9010b film thickness mapping module into a CMP tool for post copper CMP erosion, oxide thickness and residue measurements. The NanoOCD/DUV 9010b has been qualified by Lam for monitoring of dielectric film thickness, erosion and copper residue.
Mysteries of ‘Molecular Machines’ Revealed: Phenix software uses X-ray diffraction spots to produce 3-D image December 22nd, 2014
New non-invasive method can detect Alzheimer's disease early: MRI probe technology shows brain toxins in living animals for first time December 22nd, 2014
Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014
Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014