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February 17th, 2004
Nanometrics Announces Integration of NanoOCD
Nanometrics, Inc. today announced that it has entered into an integrated metrology agreement with Lam Research Corporation. Under the agreement, Lam has integrated a Nanometrics' NanoOCD/DUV 9010b film thickness mapping module into a CMP tool for post copper CMP erosion, oxide thickness and residue measurements. The NanoOCD/DUV 9010b has been qualified by Lam for monitoring of dielectric film thickness, erosion and copper residue.
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