Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > Nanometrics Announces Integration of NanoOCD

February 17th, 2004

Nanometrics Announces Integration of NanoOCD

Abstract:
Nanometrics, Inc. today announced that it has entered into an integrated metrology agreement with Lam Research Corporation. Under the agreement, Lam has integrated a Nanometrics' NanoOCD/DUV 9010b film thickness mapping module into a CMP tool for post copper CMP erosion, oxide thickness and residue measurements. The NanoOCD/DUV 9010b has been qualified by Lam for monitoring of dielectric film thickness, erosion and copper residue.

Source:
Businesswire

Bookmark:

Related News Press

Tools

Atomic-Scale Investigations Solve Key Puzzle of LED Efficiency: MIT and Brookhaven Lab scientists use electron microscopy imaging techniques to settle a solid-state controversy and raise new experimental possibilities May 22nd, 2013

Xmark Media announces the 2013 Vacuum Expo & Vacuum Symposium, Ricoh Arena - Coventry 16-17 October May 21st, 2013

JPK reports on single molecule research at IISER Pune in India using AFM and CellHesion techniques May 21st, 2013

Penn engineers' nanoantennas improve infrared sensing May 20th, 2013