Nanotechnology Now - Press Release: CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity: Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber For Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses

Home > Press > CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity: Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber For Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses

Abstract:
As part of its broad focus on millimeter-wave (mmWave) data transfer applications, CEA-Leti has developed a hybrid, ultra-fast, ultra-low latency technology that guides mmWave radio signals through flexible plastic tubing. Called H-Link, the low-cost, energy-saving system ensures Gb/s broadband connectivity that also overcomes the limits of copper wire and optical fiber, such as oxidation of metal and brittleness. In addition to being flexible and less sensitive to vibration and electromagnetism, H-Link’s wireless technology delivers transmission speeds of up to 15 Gb/s.

CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity: Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber For Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses

Grenoble, France | Posted on May 28th, 2021

Designed for multiple robotic and other applications, the system meets next-generation wireless-system performance requirements of the automotive, aeronautics, telecom, Industry 4.0 and healthcare sectors. The first-of-its-kind technology can transfer information over distances up to 10 meters at a speed of 15 Gb/s, with an average data transmission speed of 6 Gb/s over a little more than two meters.

mmWave systems operate in frequency ranges from 30 to 300 GHz. CEA-Leti’s previous work in mmWave communications includes design and use of 5G networks on the MINATEC campus in Grenoble. In addition to being the next challenge to delivering the full potential of 5G, mmWave technology will be required for future innovative services such as fixed, super-high-speed broadband access, industrial automation, healthcare and intelligent transport systems.

The plastic-based system, which is much lighter than copper, uses one-tenth of the energy of copper and less than fiber-optic cable. In addition, it can be connected by hand with tape, because it uses millimeter waves rather than nanometer waves (optical fiber) and eliminates the need for heat splicing or welding.

H-Link advantages by application:

Automotive: 100 percent wireless system delivers strong 360° signal and ultra-low energy consumption, which is essential in moving vehicles and that require multiple high-speed connections; not affected by vibration.
Aeronautics/space applications: ultra-low power consumption is essential because of limited power supply; low weight is suitable for space missions.
Telemedicine: robotics allows remote treatment, e.g., dentists working with patients in a clinic from a distant office; no cable kinking.
Lab research: manipulation of robotic arms in enclosed containers, e.g., glove boxes, protects researchers from dangerous materials and eliminates electromagnetic interference that could affect findings.
Industry 4.0, no cable kinking, no electromagnetic interference.
Telecommunications: Reduces cost, power consumption and need for physical/cable links to meet data deluge in data centers. For 5G, need to transfer info from base station to emitting antenna at ultra-low cost.

“H-Link is a highly versatile and adaptable robotic system for multiple applications that use high-data-rate communication for performing scientific, industrial and medical tasks,” said Didier Belot, an RF and mmWave design senior expert at CEA-Leti. “For example, in addition to allowing scientists to perform chemistry experiments or jobs in confined spaces and protected biology work with viruses and bacteria in gloveboxes, the system allows remote micro- and nanotechnology development and remote nuclear material manipulation.”

See video for more details: https://www.youtube.com/watch?v=Btffu4ep1KE

H-Link will be featured during the Leti Innovation Days virtual event, June 22-23. Register here: www.leti-innovation-days.com/

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About CEA Leti
Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 3,100 patents, 10,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 65 startups and is a

member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.

Technological expertise

CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.

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