Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices

Abstract:
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec’s accuracy and control with Oxford Instruments’ renowned wafer processing expertise.

Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers’ yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTec’s control with its advanced wafer processing solutions to deliver an enhanced solution to the customer.

Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices

Yatton, UK | Posted on April 7th, 2021

Driven by market demands for efficient power conversion, the IoT and datacomms compound semiconductor devices based on materials such as GaAs/InP, SiC or GaN, are becoming increasingly used due to their superior performance. However, challenges remain to move the technology from small prototypes to wafer scale, HVM. While device dimensions are relatively large, the often-complex layer structure means that acute accuracy of processing within these layers is required to realise the required process stability and yield to drive down the cost per wafer and accelerate adoption into the target application.



Volker Blank, CEO, LayTec comments: “LayTec is very excited to take the next step in widening its product portfolio with an innovation leader like Oxford Instruments. This technology partnership allows us to expand further along the process chain in one of our traditional core markets by applying our key knowledge of data analysis and integration of customised high-precision optical metrology systems. After serving our customers in the compound semiconductor industry for more than two decades, we look forward to this new opportunity to support our customers in further processes and device optimization.”



Frazer Anderson, Innovations & Solutions Director at Oxford Instruments states: “This is a crucial next step in the implementation of our product development strategy and the accelerated timing reflects the recent momentum we’ve seen in the markets we serve. It also underlines our commitment to deliver continuous productivity improvements to our customers.”



Anderson continues: “As we enter a very exciting period of innovation and growth, it is our firm intention to meet the requirement of improved performance and reduced cost of ownership objectives necessary to support needs of the emerging GaN power and RF market. This collaboration with LayTec will further increase our ability to be able to deliver both requirements.”



Oxford Instruments is a recognised technology leader in compound semiconductor processing with a range of proven wafer processing solutions installed at HVM customers. Combining Oxford Instruments’ stable plasma processing platform with LayTec’s innovative and precise end point technology in plasma etching applications allows the control and repeatability needed to increase the wafer-to-wafer yield. The synergy of joint development and exclusive supply agreement will allow the expertise in both companies to develop and supply unique HVM ready solutions for the evolving needs of the compounds industry. The long-term agreement will cover developments on the entire range of Oxford Instruments’ plasma etch and deposition systems with shared rights to the Intellectual property (IP) produced and co-ordinated marketing activities. The delivery of the first joint customer solution is targeted for H2 of 2021.

####

About Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for the etching of nanometre sized features, nanolayer deposition and the controlled growth of nanostructures.

These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition, deep silicon etch and physical vapour deposition. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.

About Oxford Instruments plc

Oxford Instruments designs, supplies, and supports high-technology tools and systems with a focus on research and industrial applications. Innovation has been the driving force behind Oxford Instruments' growth and success for 60 years, supporting its core purpose to address some of the world’s most pressing challenges.

The first technology business to be spun out from Oxford University, Oxford Instruments is now a global company and is listed on the FTSE250 index of the London Stock Exchange (OXIG). Its strategy focuses on being a customer-centric, market-focused Group, understanding the technical and commercial challenges faced by its customers. Key market segments include Semiconductor & Communications, Advanced Materials, Healthcare & Life Science, and Quantum Technology.

Their portfolio includes a range of core technologies in areas such as low temperature and high magnetic field environments; Nuclear Magnetic Resonance; X-ray, electron, laser and optical based metrology; atomic force microscopy; optical imaging; and advanced growth, deposition and etching.

Oxford Instruments is helping enable a greener economy, increased connectivity, improved health, and leaps in scientific understanding. Their advanced products and services allow the world’s leading industrial companies and scientific research communities to image, analyse, and manipulate materials down to the atomic and molecular level, helping to accelerate R&D, increase manufacturing productivity and make ground-breaking discoveries.

For more information, please click here

Contacts:
For further information about LayTec please contact:

Dr. Christian Camus, CMO | LayTec

E: | T: +49 (0)30 89 00 55 0

For further information about Oxford Instruments please contact:

Claire Critchell, Marketing Communications Manager Oxford Instruments Plasma Technology

E: | T: +44 (0)1934 837053

Copyright © Oxford Instruments Plasma Technology

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Lehigh University to lead ‘integrative partnerships’ for multi-university research collaboration in advanced optoelectronic material development: 5-year, $25 million NSF investment in IMOD, a revolutionary center for optoelectronic, quantum technologies September 10th, 2021

Engineering various sources of loss provides new features for perfect light absorption: "Loss is ubiquitous in nature, and by better understanding it, we make it more useful" September 10th, 2021

New substance classes for nanomaterials: Nano spheres and diamond slivers made of silicon and germanium: Potential applications as nano semiconductor materials September 10th, 2021

‘Anti-rust’ coating for plants protects against disease with cellulose nanofiber: Researchers from the University of Tsukuba find that coating soybean plant leaves with cellulose nanofiber offers resistance to infection by Asian soybean rust pathogen September 10th, 2021

Chip Technology

Engineering various sources of loss provides new features for perfect light absorption: "Loss is ubiquitous in nature, and by better understanding it, we make it more useful" September 10th, 2021

Leibniz Prize winner Professor Dr. Oliver G. Schmidt moves to Chemnitz University of Technology: President Professor Dr. Gerd Strohmeier refers to an 'absolute top transfer' September 10th, 2021

Ultrafast & ultrathin: new physics professor at TU Dresden makes mysterious quantum world visible September 10th, 2021

Tapping into magnets to clamp down on noise in quantum information September 9th, 2021

Announcements

‘Anti-rust’ coating for plants protects against disease with cellulose nanofiber: Researchers from the University of Tsukuba find that coating soybean plant leaves with cellulose nanofiber offers resistance to infection by Asian soybean rust pathogen September 10th, 2021

Leibniz Prize winner Professor Dr. Oliver G. Schmidt moves to Chemnitz University of Technology: President Professor Dr. Gerd Strohmeier refers to an 'absolute top transfer' September 10th, 2021

Ultrafast & ultrathin: new physics professor at TU Dresden makes mysterious quantum world visible September 10th, 2021

Stretching the capacity of flexible energy storage September 10th, 2021

Tools

Tweezer grant pleases Rice researchers: University wins NSF grant to acquire ‘optical tweezer’ to manipulate micron-scale matter September 10th, 2021

Imaging single spine structural plasticity at the nanoscale level: Researchers at the Max Planck Florida Institute for Neuroscience (MPFI) have developed a new imaging technique capable of visualizing the dynamically changing structure of dendritic spines with unprecedented resol September 3rd, 2021

Rice physicists find 'magnon' origins in 2D magnet: Topological feature could prove useful for encoding information in electron spins September 3rd, 2021

Optical tweezer technology tweaked to overcome dangers of heat June 25th, 2021

Alliances/Trade associations/Partnerships/Distributorships

National 2D materials research center wins NSF funding: Boise State joins Penn State, Rice for Phase II expansion of ATOMIC center August 20th, 2021

National 2D materials research center wins NSF funding: Boise State joins Penn State, Rice for Phase II expansion of ATOMIC center August 20th, 2021

The National Space Society Joins the Progressive Policy Institute in Supporting Rapid Development of Space Solar Power: Orbiting Solar Power Stations Would Help to Save the Environment August 20th, 2021

Verizon and Zurich Instruments join Q-NEXT national quantum science center August 6th, 2021

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project