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Home > Press > Leti to Present its Silicon Photonics Device Library and 3D Stacking Techniques for Communication Applications at OFC 2014

Abstract:
CEA-Leti will present on its silicon photonics device library and 3D stacking techniques for communication applications at OFC 2014 in San Francisco, Calif., March 11-14.

Leti to Present its Silicon Photonics Device Library and 3D Stacking Techniques for Communication Applications at OFC 2014

Grenoble, France | Posted on March 11th, 2014

A Leti team will be in the Moscone Center, Hall D/booth 4476, March 11-13 to discuss updates and activities in:

• Leti's library of state-of-the-art devices, including III-V on silicon lasers, and circuits in silicon photonics
• Leti's 3D stacking and silicon interposer developments, for integration of CMOS chips with silicon photonics circuits, and
• Specific silicon photonics developments jointly driven with STMicroelectronics researchers on 12-inch wafer fabrication tools.

Leti also will report results on "advanced modulation techniques" - multi-level modulation of a silicon-ring-resonator-modulator - (OFDM with up to 64-QAM formats), on the application of 3D stacking techniques to silicon photonics, and on its specific silicon photonics developments on 12-inch wafer fabrication tools.

At the booth, the team will be accompanied by AEPI, Invest in Grenoble-Isere. AEPI provides complimentary information, introductions and services to assist companies in exploring business opportunities in the Grenoble area of France.

Presentation dates, times and locations are below.

Monday, March 10, 4-5:45 p.m.
Room 125
Presentation No. M3G.3
Session: High Speed Transmitters and Receivers
"Up to 64-QAM Modulation of a Silicon-Ring-Resonator-Modulator"
Giovanni Beninca de Farias, Sylvie Menezo, Olivier Dubray, Delphine Marris-Morini, Laurent Vivien, Andre Myko and Benjamin Blampey


Wednesday, March 12, 2:25-2:55 p.m.
Room 131
Panel 1, Presentation W31.
Session: Symposium on Advanced Electro-optic Packaging and Assembly Technologies
"3D Integration: from Tool Box to Photonic Applications"
Yann Lamy, Stéphane Bernabe, Sylvie Menezo and Laurent Fulbert

Thursday, March 13, 10 a.m.-12 p.m.
Exhibit Hall South
Presentation No. Th2A.22
Poster Session II
"Complete Si-Photonics Device Library on 300mm Wafers"
David Fowler, Charles Baudot, Jean-Marc Fedeli, Boris Caire, Leopold Virot, Alban Leliepvre, Gilles Grand, Andre Myko, Delphine Marris-Morini, Sonia Messaoudene, Aurelie Souhaité, Ségolène Olivier, Philippe Grosse, Guang-Hua Duan, Badhise Ben-Bakir, Frederic Boeuf, Laurent Vivien and Sylvie Menezo

####

About CEA-Leti
By creating innovation and transfering it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.

For more information, please click here

Contacts:
Amélie Ravier
Phone: +33664528110
Fax: 664528110



Event contacts at Leti:
Sylvie Menezo, Ph.D.
Head of the Silicon Photonics Lab

Tel: +33 684 822 764

Hughes Metras (In U.S.)
VP Strategic Partnership, North America

Tel: +1 626 537 7270

CEA-Leti
+33 4 38 78 02 26

Copyright © CEA-Leti

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