Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology

Abstract:
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti's sequential 3D technology.

CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology

Washington, DC | Posted on December 9th, 2013

In recent years, Leti has been actively working on a new 3D integration technology process called sequential 3D integration that enables the stacking of active layers of transistors in the third dimension. In comparison with 3D-TSV technologies, advantageously used to stack separate die, sequential 3D technology is anticipated to process all the functions in a single semiconductor manufacturing flow. Thus, the technology allows connecting active areas at the transistor level, at a very high density as it uses a standard lithography process to align them.

According to Leti experts, this new technology is expected to allow a 50 percent gain in area and a 30 percent gain in speed compared to the same generation of technology made ​​in classical 2D. These gains are comparable to those expected in next-generation 2D technology, but the sequential 3D technology is expected to be much less complex and expensive to implement, making this technology a potential alternative to conventional planar scaling solutions.

Leti has shown a number of significant technical advances in sequential 3D technology. The arrangement between Leti and Qualcomm Technologies will allow the critical assessment of this technology in the context of practical applications, further evaluating the potential impact of this sequential 3D technology for future industrialization.

####

About CEA-Leti
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.

Qualcomm is a trademark, registered in the US and other countries. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners.

For more information, please click here

Contacts:
Pierre-Damien Berger
+33 4 38 78 02 26


Amélie Ravier
+33 6 64 52 81 10

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Quantum twisted Loong confirms the physical reality of wavefunctions September 23rd, 2017

Application of air-sensitive semiconductors in nanoelectronics: 2-D semiconductor gallium selenide in encapsulated nanoelectronic devices September 22nd, 2017

Researchers set time limit for ultrafast perovskite solar cells September 22nd, 2017

DNA triggers shape-shifting in hydrogels, opening a new way to make 'soft robots' September 21st, 2017

Chip Technology

Application of air-sensitive semiconductors in nanoelectronics: 2-D semiconductor gallium selenide in encapsulated nanoelectronic devices September 22nd, 2017

Physicists develop new recipes for design of fast single-photon gun Physicists develop high-speed single-photon sources for quantum computers of the future September 21st, 2017

GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications: Advanced 8SW 300mm SOI technology enables cost-effective, high-performance RF front-end modules for 4G LTE mobile and sub-6GHz 5G applications September 20th, 2017

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications: Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G September 20th, 2017

Announcements

Quantum twisted Loong confirms the physical reality of wavefunctions September 23rd, 2017

Application of air-sensitive semiconductors in nanoelectronics: 2-D semiconductor gallium selenide in encapsulated nanoelectronic devices September 22nd, 2017

Researchers set time limit for ultrafast perovskite solar cells September 22nd, 2017

DNA triggers shape-shifting in hydrogels, opening a new way to make 'soft robots' September 21st, 2017

Research partnerships

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems: Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI September 20th, 2017

Solar-to-fuel system recycles CO2 to make ethanol and ethylene: Berkeley Lab advance is first demonstration of efficient, light-powered production of fuel via artificial photosynthesis September 19th, 2017

A new approach to ultrafast light pulses: Unusual fluorescent materials could be used for rapid light-based communications systems September 19th, 2017

New insights into nanocrystal growth in liquid: Understanding process that creates complex crystals important for energy applications September 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project