Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology

Abstract:
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti's sequential 3D technology.

CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology

Washington, DC | Posted on December 9th, 2013

In recent years, Leti has been actively working on a new 3D integration technology process called sequential 3D integration that enables the stacking of active layers of transistors in the third dimension. In comparison with 3D-TSV technologies, advantageously used to stack separate die, sequential 3D technology is anticipated to process all the functions in a single semiconductor manufacturing flow. Thus, the technology allows connecting active areas at the transistor level, at a very high density as it uses a standard lithography process to align them.

According to Leti experts, this new technology is expected to allow a 50 percent gain in area and a 30 percent gain in speed compared to the same generation of technology made ​​in classical 2D. These gains are comparable to those expected in next-generation 2D technology, but the sequential 3D technology is expected to be much less complex and expensive to implement, making this technology a potential alternative to conventional planar scaling solutions.

Leti has shown a number of significant technical advances in sequential 3D technology. The arrangement between Leti and Qualcomm Technologies will allow the critical assessment of this technology in the context of practical applications, further evaluating the potential impact of this sequential 3D technology for future industrialization.

####

About CEA-Leti
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.

Qualcomm is a trademark, registered in the US and other countries. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners.

For more information, please click here

Contacts:
Pierre-Damien Berger
+33 4 38 78 02 26


Amélie Ravier
+33 6 64 52 81 10

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Imec Reports Four Percent Growth for 2013 Fiscal Year End —Continues to Accelerate Innovation Through Global Collaborations and Technological Breakthroughs in Nanoelectronics— April 24th, 2014

Multicapacity Microreactor for Catalyst Characterisation April 24th, 2014

Making graphene work for real-world devices: Fundamental research in phonon scattering helps researchers design graphene materials for applications April 24th, 2014

Return on investment for kit and promotion materials April 24th, 2014

Chip Technology

Making graphene work for real-world devices: Fundamental research in phonon scattering helps researchers design graphene materials for applications April 24th, 2014

Return on investment for kit and promotion materials April 24th, 2014

Harris & Harris Group Notes the Receipt of Proceeds From the Sale of Molecular Imprints' Semiconductor Business to Canon April 22nd, 2014

Progress made in developing nanoscale electronics: New research directs charges through single molecules April 21st, 2014

Announcements

Imec Reports Four Percent Growth for 2013 Fiscal Year End —Continues to Accelerate Innovation Through Global Collaborations and Technological Breakthroughs in Nanoelectronics— April 24th, 2014

Multicapacity Microreactor for Catalyst Characterisation April 24th, 2014

Making graphene work for real-world devices: Fundamental research in phonon scattering helps researchers design graphene materials for applications April 24th, 2014

Return on investment for kit and promotion materials April 24th, 2014

Research partnerships

University of Waterloo Visits China to Strengthen Bonds With Research Partners April 21st, 2014

Novel stapled peptide nanoparticle combination prevents RSV infection, study finds April 17th, 2014

Scientists Capture Ultrafast Snapshots of Light-Driven Superconductivity: X-rays reveal how rapidly vanishing 'charge stripes' may be behind laser-induced high-temperature superconductivity April 16th, 2014

Scalable CVD process for making 2-D molybdenum diselenide: Rice, NTU scientists unveil CVD production for coveted 2-D semiconductor April 8th, 2014

NanoNews-Digest
The latest news from around the world, FREE







  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE