Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Abstract:
Scanning acoustic microscopy (SAM) for non-destructive void inspection after wafer bonding improves wafer thinning performance and tool stability and can also be applied to detect voids in TSVs during processing.

PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Leuven, Belgium | Posted on January 17th, 2013

Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.

The initial focus of the collaboration was on developing metrology aimed at detecting voids after temporary wafer bonding, allowing for proper rework of 3D wafers. Temporary wafer (de)bonding and thin wafer handling remains challenging for 3D stacked IC technology. The development of interface particles and voids during the temporary bonding process has a detrimental impact on the subsequent wafer thinning process steps, affecting the wafer thinning performance as well as long-term tool stability and performance. PVA Tepla and imec have developed an automated foup-to-foup, wafer-level process based on 200MHz Scanning Acoustic Microscopy (SAM) using Tepla's AutoWafer 300 tool.

After demonstrating non-destructive detection of interface particles and voids, imec used PVA Tepla's high-resolution capability GHz frequency SAM tool to successfully detect voids in TSVs of 5µm diameter and 50µm depth, immediately after plating. Future work will concentrate on further refining the process and implementing GHz SAM capability to increase the spatial detection resolution. Moreover, imec and PVA Tepla will investigate the applicability of GHz SAM to detect submicron voids in TSV and to investigate other aspects related to 3D-technology such as bump connection quality.

####

About IMEC
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of close to 2,000 people includes more than 600 industrial residents and guest researchers. In 2011, imec's revenue (P&L) was about 300 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.) and imec India (Imec India Private Limited).

About PVA TePla

PVA TePla Analytical Systems GmbH is a member of the PVA TePla AG group. The company develops advanced technology developments in scanning acoustic microscopy and provides innovative analytical solutions for applications in material science, biology, inspection of solar and semiconductor systems, as well as for defect analysis in ingots for the production of wafers and MEMS systems.

PVA TePla Group is a specialist for high-temperature and vacuum furnaces. Its core competencies are in the fields of hard-metal sintering and crystal growing, the application of plasma systems for surface activation and ultra-fine cleaning as well as the application of inspection systems for high tech materials.

For more information, please click here

Contacts:
imec :
Hanne Degans
External Communications Officer
T: +32 16 28 17 69
Mobile: +32 486 065 175


PVA TePla:
Sandy Kolbe
Executive Assistance
T: +49 (0)7363 9544 – 200


Olga Walsh
Business Technology
[ f o r m u l a ]
Formula PR, Inc.
1215 Cushman Avenue
San Diego, CA 92110
Office 619-234-0345 |

Copyright © IMEC

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Iranian Experts Clean Uranium-Contaminated Water by Nano-Particles November 23rd, 2014

Novel Method Found for Connection of Metallic Alloys to Polymers November 23rd, 2014

New research project supports internationalisation in nano-research: Launch of new “Baltic Sea Network” November 22nd, 2014

3rd Iran-Proposed Nano Standard Approved by International Standard Organization November 22nd, 2014

Imaging

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

NRL Scientists Discover Novel Metamaterial Properties within Hexagonal Boron Nitride November 20th, 2014

Spectral Surface Mapping with Microscopic Resolution: CRAIC Technologies introduces Spectral Surface Mapping™ (S2M™) software November 18th, 2014

Two sensors in one: Nanoparticles that enable both MRI and fluorescent imaging could monitor cancer, other diseases November 18th, 2014

Chip Technology

Nanometrics Announces Upcoming Investor Events November 19th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Researchers create & control spin waves, lifting prospects for enhanced info processing November 17th, 2014

VDMA Electronics Production Equipment: Growth track for 2014 and 2015 confirmed: Business climate survey shows robust industry sector November 14th, 2014

Discoveries

Iranian Experts Clean Uranium-Contaminated Water by Nano-Particles November 23rd, 2014

Novel Method Found for Connection of Metallic Alloys to Polymers November 23rd, 2014

NMTI announces breakthrough solutions for HAMR nanoantenna for next-generation ultra-high density magnetic storage November 21st, 2014

Nano Sorbents Able to Remove Pollutions Caused by Oil Derivatives November 20th, 2014

Announcements

Iranian Experts Clean Uranium-Contaminated Water by Nano-Particles November 23rd, 2014

Novel Method Found for Connection of Metallic Alloys to Polymers November 23rd, 2014

New research project supports internationalisation in nano-research: Launch of new “Baltic Sea Network” November 22nd, 2014

3rd Iran-Proposed Nano Standard Approved by International Standard Organization November 22nd, 2014

Tools

Iranian Experts Clean Uranium-Contaminated Water by Nano-Particles November 23rd, 2014

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Nanometrics Announces Upcoming Investor Events November 19th, 2014

Two sensors in one: Nanoparticles that enable both MRI and fluorescent imaging could monitor cancer, other diseases November 18th, 2014

Research partnerships

Novel Method Found for Connection of Metallic Alloys to Polymers November 23rd, 2014

New research project supports internationalisation in nano-research: Launch of new “Baltic Sea Network” November 22nd, 2014

Quantum mechanical calculations reveal the hidden states of enzyme active sites November 20th, 2014

UO-industry collaboration points to improved nanomaterials: University of Oregon microscope puts spotlight on the surface structure of quantum dots for designing new solar devices November 20th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More












ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE