Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Abstract:
Scanning acoustic microscopy (SAM) for non-destructive void inspection after wafer bonding improves wafer thinning performance and tool stability and can also be applied to detect voids in TSVs during processing.

PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Leuven, Belgium | Posted on January 17th, 2013

Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.

The initial focus of the collaboration was on developing metrology aimed at detecting voids after temporary wafer bonding, allowing for proper rework of 3D wafers. Temporary wafer (de)bonding and thin wafer handling remains challenging for 3D stacked IC technology. The development of interface particles and voids during the temporary bonding process has a detrimental impact on the subsequent wafer thinning process steps, affecting the wafer thinning performance as well as long-term tool stability and performance. PVA Tepla and imec have developed an automated foup-to-foup, wafer-level process based on 200MHz Scanning Acoustic Microscopy (SAM) using Tepla's AutoWafer 300 tool.

After demonstrating non-destructive detection of interface particles and voids, imec used PVA Tepla's high-resolution capability GHz frequency SAM tool to successfully detect voids in TSVs of 5µm diameter and 50µm depth, immediately after plating. Future work will concentrate on further refining the process and implementing GHz SAM capability to increase the spatial detection resolution. Moreover, imec and PVA Tepla will investigate the applicability of GHz SAM to detect submicron voids in TSV and to investigate other aspects related to 3D-technology such as bump connection quality.

####

About IMEC
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of close to 2,000 people includes more than 600 industrial residents and guest researchers. In 2011, imec's revenue (P&L) was about 300 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.) and imec India (Imec India Private Limited).

About PVA TePla

PVA TePla Analytical Systems GmbH is a member of the PVA TePla AG group. The company develops advanced technology developments in scanning acoustic microscopy and provides innovative analytical solutions for applications in material science, biology, inspection of solar and semiconductor systems, as well as for defect analysis in ingots for the production of wafers and MEMS systems.

PVA TePla Group is a specialist for high-temperature and vacuum furnaces. Its core competencies are in the fields of hard-metal sintering and crystal growing, the application of plasma systems for surface activation and ultra-fine cleaning as well as the application of inspection systems for high tech materials.

For more information, please click here

Contacts:
imec :
Hanne Degans
External Communications Officer
T: +32 16 28 17 69
Mobile: +32 486 065 175


PVA TePla:
Sandy Kolbe
Executive Assistance
T: +49 (0)7363 9544 – 200


Olga Walsh
Business Technology
[ f o r m u l a ]
Formula PR, Inc.
1215 Cushman Avenue
San Diego, CA 92110
Office 619-234-0345 |

Copyright © IMEC

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Imaging

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

News and information

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

Chip Technology

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

GraphExeter illuminates bright new future for flexible lighting devices June 23rd, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Particle zoo in a quantum computer: First experimental quantum simulation of particle physics phenomena June 23rd, 2016

Discoveries

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Yale researchers’ technology turns wasted heat into power June 27th, 2016

Announcements

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Tools

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

FEI Launches Helios G4 DualBeam Series for Materials Science: The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions June 27th, 2016

Nanoscientists develop the 'ultimate discovery tool': Rapid discovery power is similar to what gene chips offer biology June 25th, 2016

Research partnerships

Superheroes are real: Ultrasensitive nonlinear metamaterials for data transfer June 25th, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016

Tailored DNA shifts electrons into the 'fast lane': DNA nanowire improved by altering sequences June 22nd, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic