Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Solid State Equipment LLC Joins SEMATECH’s 3D Interconnect Program at UAlbany NanoCollege

Abstract:
Solid State Equipment LLC (SSEC), a manufacturer of single wafer wet processing equipment for the semiconductor industry, has joined SEMATECH's 3D Interconnect program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process and metrology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.

Solid State Equipment LLC Joins SEMATECH’s 3D Interconnect Program at UAlbany NanoCollege

Albany, NY and Horsham, PA | Posted on June 6th, 2012

The collaboration between SSEC and engineers in SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech Complex will include evaluation and development of leading-edge wafer thinning and TSV wafer cleaning processes. Specifically, SMEATECH will utilize various SSEC process platforms for silicon etching, via reveal height metrology and wet cleaning.

"3D integration offers a path for higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction," said John Voltz, Director of Global Field Operations for SSEC. "By joining SEMATECH's 3D Interconnect program and collaborating with industry-leading partners, we expect to play a critical role in addressing industry infrastructure and technology gaps in equipment, integration and product related issues for high volume adoption of through-silicon vias."

"SEMATECH is constantly strengthening and growing our strategic network alliances with leading-edge equipment and materials suppliers," said Sitaram Arkalgud, director of SEMATECH's 3D interconnect program. "We are excited by this opportunity to partner with SSEC. Such partnerships coupled with SEMATECH's leading edge R&D capabilities for advanced 3D IC know-how will contribute to the growth of the semiconductor industry."

"The addition of Solid State Equipment LLC to CNSE's Albany NanoTech Complex further underscores Governor Andrew Cuomo's declaration that New York is open for business," said Richard Brilla, CNSE vice president for strategy, alliances and consortia. "We look forward to working with SSEC as part of the CNSE-SEMATECH partnership, which is playing a vital role in driving technological progress and economic development."

Through technology leadership and global collaboration, SEMATECH's 3D Interconnect program emphasis is on exploring 3D technology options that provide cost-effective and reliable solutions to drive manufacturing readiness of 3D TSV.

####

About SEMATECH
SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, this year celebrates 25 years of excellence in accelerating the commercialization of technology innovations into manufacturing solutions. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market. Information about SEMATECH can be found at www.sematech.org.

Twitter: www.twitter.com/sematechnews

About Solid State Equipment LLC

Founded in 1965 and headquartered in Horsham, Pennsylvania, Solid State Equipment LLC dba SSEC, is a leading manufacturer of single wafer wet processing equipment for the Advanced Packaging, Compound Semiconductor and Silicon Semiconductor Industries. Solid State Equipment maintains worldwide sales and technical service offices in Horsham, Pennsylvania; San Jose, California; Regensburg, Germany; Cramlington, England; Taiwan, R.O.C.; Shanghai, P.R.C; Woodlands, Singapore; Gyeonggi, R.O.K.; and Laguna, Philippines.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Tough foam from tiny sheets: Rice University lab uses atom-thick materials to make ultralight foam July 29th, 2014

Zenosense, Inc. July 29th, 2014

Optimum inertial design for self-propulsion: A new study investigates the effects of small but finite inertia on the propulsion of micro and nano-scale swimming machines July 29th, 2014

A new way to make microstructured surfaces: Method can produce strong, lightweight materials with specific surface properties July 29th, 2014

Academic/Education

Haydale Announces Collaboration Agreement with Swansea University’s Welsh Centre for Printing and Coatings (WCPC) July 12th, 2014

STFC takes delivery of the 100th Hitachi Tabletop SEM in the UK July 3rd, 2014

Innovation Management and the Emergence of the Nanobiotechnology Industry July 1st, 2014

Albany NanoCollege Faculty Member Selected as Editor-in-Chief of the Prestigious Journal of Electronic Materials July 1st, 2014

Chip Technology

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

Announcements

Tough foam from tiny sheets: Rice University lab uses atom-thick materials to make ultralight foam July 29th, 2014

Zenosense, Inc. July 29th, 2014

Optimum inertial design for self-propulsion: A new study investigates the effects of small but finite inertia on the propulsion of micro and nano-scale swimming machines July 29th, 2014

A new way to make microstructured surfaces: Method can produce strong, lightweight materials with specific surface properties July 29th, 2014

Alliances/Partnerships/Distributorships

SouthWest NanoTechnologies Names NanoSperse as A SWeNT Certified Compounder July 29th, 2014

ACS Biomaterials Science & Engineering™: Brand-new journal names editor July 29th, 2014

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

Organometallics welcomes new editor-in-chief: Paul Chirik, Ph.D. July 22nd, 2014

Research partnerships

Breakthrough laser experiment reveals liquid-like motion of atoms in an ultra-cold cluster: University of Leicester research team unlocks insights into creation of new nano-materials July 25th, 2014

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE