Nanotechnology Now





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Abstract:
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ.

SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Scottsdale, AZ | Posted on March 9th, 2011

Technologists from SEMATECH's 3D Interconnect program have demonstrated a novel die-to-wafer interconnect process using a die-tacking and collective-bonding approach on a 300mm wafer platform for 3D-IC applications. Composite wafers containing a 50µm thin through-silicon-via (TSV) wafer attached to a supporting handle wafer were populated with dice using a short, low-temperature tacking process. This process enables a faster method of die-to-wafer integration needed for the advancement of heterogeneous 3D-IC.

Wafer-to-wafer (WtW) bonding is a key enabling process step for 3D interconnection of wafers through stacking. The International Technology Roadmap for Semiconductors (ITRS) roadmap for high density, intermediate level, TSVs specifies via diameters of 0.8 to 4.0µm in 2012 and beyond.

"Through collaborative research efforts, SEMATECH has developed new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "This practical implementation approach is critical to the integration and process development that will make 3D TSVs commercially viable."

3D ICs will play an important role in the semiconductor industry, given their potential to alleviate scaling limitations, increase performance and functionality, and reduce cost. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth.

Additionally, Sitaram Arkalgud presented a summary of SEMATECH's programs in 3D IC technology development and emerging standards at the Global Business Council Spring Conference, held in conjunction with DPC. Arkalgud delivered an invited talk highlighting SEMATECH's 3D Enablement program and a summary on how it will enable industry-wide ecosystem readiness for cost-effective TSV-based stacked IC solutions.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume TSV manufacturing. In order to accelerate technology adoption and build critical industry infrastructure, SEMATECH established the 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration. Administered by SEMATECH's 3D Interconnect program, in partnership with SIA and SRC, the program is developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer and die handling.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Haydale Named Lead Sponsor for Cambridge Graphene Festival May 22nd, 2015

Simulations predict flat liquid May 21st, 2015

Chip Technology

Nanometrics Announces Live Webcast of Upcoming Investor and Analyst Day May 20th, 2015

Sandia researchers first to measure thermoelectric behavior by 'Tinkertoy' materials May 20th, 2015

Defects can 'Hulk-up' materials: Berkeley lab study shows properly managed damage can boost material thermoelectric performances May 20th, 2015

GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications: Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs May 20th, 2015

Discoveries

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Nanotherapy effective in mice with multiple myeloma May 21st, 2015

Turn that defect upside down: Twin boundaries in lithium-ion batteries May 21st, 2015

Announcements

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Haydale Named Lead Sponsor for Cambridge Graphene Festival May 22nd, 2015

INSIDDE: Uncovering the real history of art using a graphene scanner May 21st, 2015

Tools

Nanometrics Announces Live Webcast of Upcoming Investor and Analyst Day May 20th, 2015

Taking control of light emission: Researchers find a way of tuning light waves by pairing 2 exotic 2-D materials May 20th, 2015

DELMIC announces a workshop hosted by Phenom World on Integrated CLEM to be held on Wednesday June 24th at the Francis Crick Institute (Lincoln Inn Fields Laboratory). May 19th, 2015

DiATOME enables surface preparation for AFM and FIB May 19th, 2015

Alliances/Partnerships/Distributorships

Samtec, Global Provider of Interconnect Systems, Joins IRT Nanoelec Silicon Photonics Program May 21st, 2015

SUNY Poly CNSE and NIOSH Launch Federal Nano Health and Safety Consortium: May 20th, 2015

Industrial Nanotech, Inc. Announces Official Launch of the Eagle Platinum Tile™ May 19th, 2015

DiATOME enables surface preparation for AFM and FIB May 19th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project