Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Abstract:
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ.

SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Scottsdale, AZ | Posted on March 9th, 2011

Technologists from SEMATECH's 3D Interconnect program have demonstrated a novel die-to-wafer interconnect process using a die-tacking and collective-bonding approach on a 300mm wafer platform for 3D-IC applications. Composite wafers containing a 50µm thin through-silicon-via (TSV) wafer attached to a supporting handle wafer were populated with dice using a short, low-temperature tacking process. This process enables a faster method of die-to-wafer integration needed for the advancement of heterogeneous 3D-IC.

Wafer-to-wafer (WtW) bonding is a key enabling process step for 3D interconnection of wafers through stacking. The International Technology Roadmap for Semiconductors (ITRS) roadmap for high density, intermediate level, TSVs specifies via diameters of 0.8 to 4.0µm in 2012 and beyond.

"Through collaborative research efforts, SEMATECH has developed new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "This practical implementation approach is critical to the integration and process development that will make 3D TSVs commercially viable."

3D ICs will play an important role in the semiconductor industry, given their potential to alleviate scaling limitations, increase performance and functionality, and reduce cost. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth.

Additionally, Sitaram Arkalgud presented a summary of SEMATECH's programs in 3D IC technology development and emerging standards at the Global Business Council Spring Conference, held in conjunction with DPC. Arkalgud delivered an invited talk highlighting SEMATECH's 3D Enablement program and a summary on how it will enable industry-wide ecosystem readiness for cost-effective TSV-based stacked IC solutions.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume TSV manufacturing. In order to accelerate technology adoption and build critical industry infrastructure, SEMATECH established the 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration. Administered by SEMATECH's 3D Interconnect program, in partnership with SIA and SRC, the program is developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer and die handling.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles: Invited Paper also Will Present Leti’s Success with New Augmented Reality Technology That Reduces Pixel Pitch to Less than 5 Microns May 22nd, 2017

Graphene-nanotube hybrid boosts lithium metal batteries: Rice University prototypes store 3 times the energy of lithium-ion batteries May 19th, 2017

Chip Technology

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

Oddball enzyme provides easy path to synthetic biomaterials May 17th, 2017

Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology: Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program May 11th, 2017

Discoveries

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Sensors detect disease markers in breath May 19th, 2017

Graphene-nanotube hybrid boosts lithium metal batteries: Rice University prototypes store 3 times the energy of lithium-ion batteries May 19th, 2017

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

Announcements

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles: Invited Paper also Will Present Leti’s Success with New Augmented Reality Technology That Reduces Pixel Pitch to Less than 5 Microns May 22nd, 2017

Graphene-nanotube hybrid boosts lithium metal batteries: Rice University prototypes store 3 times the energy of lithium-ion batteries May 19th, 2017

Tools

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

The brighter side of twisted polymers: Conjugated polymers designed with a twist produce tiny, brightly fluorescent particles with broad applications May 16th, 2017

Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology: Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program May 11th, 2017

UnitySC Announces Wafer Thinning Inspection System; Win from Power Semiconductor IDM for Automotive: Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications May 11th, 2017

Alliances/Trade associations/Partnerships/Distributorships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

BASF and Landa partner to create revolutionary pigments for automotive coatings: The alliance combines BASF innovations with Landa nano-pigment technology April 5th, 2017

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project