Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Abstract:
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ.

SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Scottsdale, AZ | Posted on March 9th, 2011

Technologists from SEMATECH's 3D Interconnect program have demonstrated a novel die-to-wafer interconnect process using a die-tacking and collective-bonding approach on a 300mm wafer platform for 3D-IC applications. Composite wafers containing a 50µm thin through-silicon-via (TSV) wafer attached to a supporting handle wafer were populated with dice using a short, low-temperature tacking process. This process enables a faster method of die-to-wafer integration needed for the advancement of heterogeneous 3D-IC.

Wafer-to-wafer (WtW) bonding is a key enabling process step for 3D interconnection of wafers through stacking. The International Technology Roadmap for Semiconductors (ITRS) roadmap for high density, intermediate level, TSVs specifies via diameters of 0.8 to 4.0µm in 2012 and beyond.

"Through collaborative research efforts, SEMATECH has developed new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "This practical implementation approach is critical to the integration and process development that will make 3D TSVs commercially viable."

3D ICs will play an important role in the semiconductor industry, given their potential to alleviate scaling limitations, increase performance and functionality, and reduce cost. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth.

Additionally, Sitaram Arkalgud presented a summary of SEMATECH's programs in 3D IC technology development and emerging standards at the Global Business Council Spring Conference, held in conjunction with DPC. Arkalgud delivered an invited talk highlighting SEMATECH's 3D Enablement program and a summary on how it will enable industry-wide ecosystem readiness for cost-effective TSV-based stacked IC solutions.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume TSV manufacturing. In order to accelerate technology adoption and build critical industry infrastructure, SEMATECH established the 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration. Administered by SEMATECH's 3D Interconnect program, in partnership with SIA and SRC, the program is developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer and die handling.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

The George Washington University Opens Science and Engineering Hall, Largest Building of Its Kind in D.C.: Building Represents Significant Investment in Research Programs and Facilities; Commitment to Solve Global Problems, Improve Lives of Millions March 5th, 2015

Anousheh Ansari Wins the National Space Society's Space Pioneer Award for "Service to the Space Community" March 5th, 2015

Enhanced Graphene Components for Next Generation Racing Yacht March 5th, 2015

Chip Technology

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

Experiment and theory unite at last in debate over microbial nanowires: New model and experiments settle debate over metallic-like conductivity of microbial nanowires in bacterium March 4th, 2015

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

The taming of magnetic vortices: Unified theory for skyrmion-materials March 3rd, 2015

Discoveries

Enhanced Graphene Components for Next Generation Racing Yacht March 5th, 2015

American Chemical Society Presidential Symposia: nanoscience, international chemistry March 5th, 2015

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

CiQUS researchers obtain high-quality perovskites over large areas by a chemical method March 4th, 2015

Announcements

The George Washington University Opens Science and Engineering Hall, Largest Building of Its Kind in D.C.: Building Represents Significant Investment in Research Programs and Facilities; Commitment to Solve Global Problems, Improve Lives of Millions March 5th, 2015

Anousheh Ansari Wins the National Space Society's Space Pioneer Award for "Service to the Space Community" March 5th, 2015

Enhanced Graphene Components for Next Generation Racing Yacht March 5th, 2015

Get ready for NanoDays! March 5th, 2015

Tools

Keysight Technologies Shifts to Direct Sales of High-Performance Products in North America March 3rd, 2015

Forbidden quantum leaps possible with high-res spectroscopy March 2nd, 2015

International research partnership tricks the light fantastic March 2nd, 2015

Important step towards quantum computing: Metals at atomic scale March 2nd, 2015

Alliances/Partnerships/Distributorships

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

American Chemical Society Presidential Symposia: nanoscience, international chemistry March 5th, 2015

Keysight Technologies Shifts to Direct Sales of High-Performance Products in North America March 3rd, 2015

Cambrios and Heraeus Jointly Create New, High-Conductivity Transparent Conductors: Two Companies' Combined Products Dramatically Extend Flexible Substrate Capabilities for Next-Generation Mass-Market Technology Products March 3rd, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE