Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Abstract:
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ.

SEMATECH Reports Advances in Bond Process for 3D Integration Development: Results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform

Scottsdale, AZ | Posted on March 9th, 2011

Technologists from SEMATECH's 3D Interconnect program have demonstrated a novel die-to-wafer interconnect process using a die-tacking and collective-bonding approach on a 300mm wafer platform for 3D-IC applications. Composite wafers containing a 50µm thin through-silicon-via (TSV) wafer attached to a supporting handle wafer were populated with dice using a short, low-temperature tacking process. This process enables a faster method of die-to-wafer integration needed for the advancement of heterogeneous 3D-IC.

Wafer-to-wafer (WtW) bonding is a key enabling process step for 3D interconnection of wafers through stacking. The International Technology Roadmap for Semiconductors (ITRS) roadmap for high density, intermediate level, TSVs specifies via diameters of 0.8 to 4.0µm in 2012 and beyond.

"Through collaborative research efforts, SEMATECH has developed new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "This practical implementation approach is critical to the integration and process development that will make 3D TSVs commercially viable."

3D ICs will play an important role in the semiconductor industry, given their potential to alleviate scaling limitations, increase performance and functionality, and reduce cost. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth.

Additionally, Sitaram Arkalgud presented a summary of SEMATECH's programs in 3D IC technology development and emerging standards at the Global Business Council Spring Conference, held in conjunction with DPC. Arkalgud delivered an invited talk highlighting SEMATECH's 3D Enablement program and a summary on how it will enable industry-wide ecosystem readiness for cost-effective TSV-based stacked IC solutions.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume TSV manufacturing. In order to accelerate technology adoption and build critical industry infrastructure, SEMATECH established the 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration. Administered by SEMATECH's 3D Interconnect program, in partnership with SIA and SRC, the program is developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer and die handling.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Industrial Nanotech, Inc. to Publish PCAOB Audited Financials July 31st, 2014

Nanostructured metal-oxide catalyst efficiently converts CO2 to methanol: Highly reactive sites at interface of 2 nanoscale components could help overcome hurdle of using CO2 as a starting point in producing useful products July 31st, 2014

Carnegie Mellon Chemists Create Nanofibers Using Unprecedented New Method July 31st, 2014

Pressure probing potential photoelectronic manufacturing compound July 31st, 2014

Chip Technology

Pressure probing potential photoelectronic manufacturing compound July 31st, 2014

Nanometrics Reports Second Quarter 2014 Financial Results July 30th, 2014

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Discoveries

Study finds physical link to strange electronic behavior: Neutron measurements offer new clues about iron-based superconductor July 31st, 2014

Nanostructured metal-oxide catalyst efficiently converts CO2 to methanol: Highly reactive sites at interface of 2 nanoscale components could help overcome hurdle of using CO2 as a starting point in producing useful products July 31st, 2014

Carnegie Mellon Chemists Create Nanofibers Using Unprecedented New Method July 31st, 2014

Pressure probing potential photoelectronic manufacturing compound July 31st, 2014

Announcements

Industrial Nanotech, Inc. to Publish PCAOB Audited Financials July 31st, 2014

Nanostructured metal-oxide catalyst efficiently converts CO2 to methanol: Highly reactive sites at interface of 2 nanoscale components could help overcome hurdle of using CO2 as a starting point in producing useful products July 31st, 2014

Carnegie Mellon Chemists Create Nanofibers Using Unprecedented New Method July 31st, 2014

Pressure probing potential photoelectronic manufacturing compound July 31st, 2014

Tools

Carnegie Mellon Chemists Create Nanofibers Using Unprecedented New Method July 31st, 2014

New imaging agent provides better picture of the gut July 30th, 2014

Nanometrics Reports Second Quarter 2014 Financial Results July 30th, 2014

New Objective Focusing Nanopositioner from nPoint July 30th, 2014

Alliances/Partnerships/Distributorships

Nature inspires a greener way to make colorful plastics July 30th, 2014

SouthWest NanoTechnologies Names NanoSperse as A SWeNT Certified Compounder July 29th, 2014

ACS Biomaterials Science & Engineering™: Brand-new journal names editor July 29th, 2014

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE