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3D Semiconductor Integration, Next Generation Materials, Photovoltaics, Advanced Assembly & Packaging
to be Highlighted at IMAPS 2010 International Microelectronics Conference
The latest developments in advanced microelectronics packaging, including focused tracks on 3D integration, LED technology, MEMS packaging and thermal management, will be part of the technical program at the International Symposium on Microelectronics, sponsored by the International Microelectronics And Packaging Society (IMAPS). The world's leading scientists, engineers and researchers in the field of advanced semiconductor packaging will showcase their work in a program of technical papers, poster sessions, forums, professional development courses, exhibitions and other events designed to cover the entire microelectronics supply chain.
The 43rd annual IMAPS Symposium will be held at the Raleigh Convention Center near Research Triangle Park, NC from October 31 through November 4, 2010. A full program of 18 professional development courses will be held on October 31 and November 1 in conjunction with the conference, and more than 180 papers will be presented in the main technical program.
The technical program is arranged around five main topics, or tracks, including:
* 3D Packaging & Integration - 3D IC integration and packaging is one of the fastest-growing areas in microelectronics, with some of the industry's leading work being done in the Research Triangle Park area. IMAPS 2010 has assembled a series of invited papers from RTP researchers and companies to inform attendees about the latest advancements in 3-D packaging, including TSVs, die stacking, and wafer thinning.
* Next Generation Materials - These sessions focus on the use of advanced materials for microelectronics packaging, including conductive adhesives, advanced ceramics, high-performance interconnects, and thermal management issues.
* Assembly & Packaging - This track includes package reliability, with research on experimental testing and simulation methods of evaluating solder ball joints, interconnects, and multichip modules; lead-free solder materials, and wirebonding techniques.
* Advanced Technologies - Highlights include advances in LED technology, wafer-level and chipscale packaging developments, MEMS and sensor packaging, and emerging technologies such as printed electronics.
* Modeling & Reliability - Papers in this track discuss new modeling approaches for emerging technologies such as 3D and multichip modules; signal/power integrity issues, and flip-chip and wafer-bonding processes.
A complete list of the technical program sessions is available at: www.imaps.org/imaps2010/program.htm <http://www.imaps.org/imaps2010/program.htm>
In addition to the main technical papers, an interactive session consisting of more than 30 poster presentations will be held, giving conference participants the opportunity for detailed interaction with the researchers.
Professional Development Courses
IMAPS 2010 offers a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the microelectronics and packaging community. Held for two days prior to the conference and exhibition, on October 31 and November 1, there are 18 Professional Development Courses, taught by recognized industry experts, designed to give attendees an opportunity to integrate the latest advances in materials and technologies to help them stay competitive in today's global microelectronics market. A complete list of the IMAPS 2010 PDCs is available at: www.imaps.org/imaps2010/pdcs.htm .
Global Business Council Marketing Forum
The IMAPS 2010 Global Business Council Marketing Forum is a business session open to all IMAPS 2010 attendees. Held on Wednesday November 3, 2010 at 5:00pm, this year's session is entitled "Materials for Photovoltaics & 3D Packaging," and includes:
* "An Electronic Material Supplier's Perspective on Challenges & Opportunities in 3D Packaging" by Leo Linehan, Global Business Director of Advanced Packaging Technologies, Dow Electronic Materials
* "The Critical Role of Materials in the Photovoltaic Industry" by David Miller, President of DuPont Electronics & Communications
IMAPS 2010 will feature two world-renown keynote presentations:
* Dr. John Edmond, co-founder, CREE Research - "High Efficiency Blue & White LEDs for the New Lightbulb"
* Dr. Rao Tummala, professor & director of 3D Systems Packaging Research Center at the Georgia Institute of Technology - Grand Challenges & Potential Solutions in the Changing World of Nanoelectronics from ICs to 3D ICs to 3D Systems"
IMAPS 2010 will also include a comprehensive student program for both university and high school students that features a student paper competition, a student booth competition, and a tour of the DuPont Microcircuit Material Headquarters in RTP. An employment center for students will also be available.
IMAPS 2010 is the world's largest symposium dedicated to microelectronics and electronics packaging technologies, with exhibits from companies representing all facets of the microelectronics supply chain.
Early registration for IMAPS 2010 is open until September 28, 2010. Complete information is available at: www.imaps.org/ <http://www.imaps.org/>
Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community, providing means of communicating, educating and interacting at all levels. The Society's portfolio of technologies
For more information, please click here
Chris Burke or Garth Miller
BtB Marketing Communications
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