Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Raleigh/RTP to host the 43rd annual IMAPS International Symposium on Microelectronics

Abstract:
3D Semiconductor Integration, Next Generation Materials, Photovoltaics, Advanced Assembly & Packaging
to be Highlighted at IMAPS 2010 International Microelectronics Conference

Raleigh/RTP to host the 43rd annual IMAPS International Symposium on Microelectronics

Raleigh, NC | Posted on September 26th, 2010

The latest developments in advanced microelectronics packaging, including focused tracks on 3D integration, LED technology, MEMS packaging and thermal management, will be part of the technical program at the International Symposium on Microelectronics, sponsored by the International Microelectronics And Packaging Society (IMAPS). The world's leading scientists, engineers and researchers in the field of advanced semiconductor packaging will showcase their work in a program of technical papers, poster sessions, forums, professional development courses, exhibitions and other events designed to cover the entire microelectronics supply chain.

The 43rd annual IMAPS Symposium will be held at the Raleigh Convention Center near Research Triangle Park, NC from October 31 through November 4, 2010. A full program of 18 professional development courses will be held on October 31 and November 1 in conjunction with the conference, and more than 180 papers will be presented in the main technical program.

The technical program is arranged around five main topics, or tracks, including:
* 3D Packaging & Integration - 3D IC integration and packaging is one of the fastest-growing areas in microelectronics, with some of the industry's leading work being done in the Research Triangle Park area. IMAPS 2010 has assembled a series of invited papers from RTP researchers and companies to inform attendees about the latest advancements in 3-D packaging, including TSVs, die stacking, and wafer thinning.
* Next Generation Materials - These sessions focus on the use of advanced materials for microelectronics packaging, including conductive adhesives, advanced ceramics, high-performance interconnects, and thermal management issues.
* Assembly & Packaging - This track includes package reliability, with research on experimental testing and simulation methods of evaluating solder ball joints, interconnects, and multichip modules; lead-free solder materials, and wirebonding techniques.
* Advanced Technologies - Highlights include advances in LED technology, wafer-level and chipscale packaging developments, MEMS and sensor packaging, and emerging technologies such as printed electronics.
* Modeling & Reliability - Papers in this track discuss new modeling approaches for emerging technologies such as 3D and multichip modules; signal/power integrity issues, and flip-chip and wafer-bonding processes.

A complete list of the technical program sessions is available at: www.imaps.org/imaps2010/program.htm <http://www.imaps.org/imaps2010/program.htm>

In addition to the main technical papers, an interactive session consisting of more than 30 poster presentations will be held, giving conference participants the opportunity for detailed interaction with the researchers.

Professional Development Courses
IMAPS 2010 offers a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the microelectronics and packaging community. Held for two days prior to the conference and exhibition, on October 31 and November 1, there are 18 Professional Development Courses, taught by recognized industry experts, designed to give attendees an opportunity to integrate the latest advances in materials and technologies to help them stay competitive in today's global microelectronics market. A complete list of the IMAPS 2010 PDCs is available at: www.imaps.org/imaps2010/pdcs.htm .

Global Business Council Marketing Forum
The IMAPS 2010 Global Business Council Marketing Forum is a business session open to all IMAPS 2010 attendees. Held on Wednesday November 3, 2010 at 5:00pm, this year's session is entitled "Materials for Photovoltaics & 3D Packaging," and includes:
* "An Electronic Material Supplier's Perspective on Challenges & Opportunities in 3D Packaging" by Leo Linehan, Global Business Director of Advanced Packaging Technologies, Dow Electronic Materials
* "The Critical Role of Materials in the Photovoltaic Industry" by David Miller, President of DuPont Electronics & Communications

Keynote Presentations
IMAPS 2010 will feature two world-renown keynote presentations:
* Dr. John Edmond, co-founder, CREE Research - "High Efficiency Blue & White LEDs for the New Lightbulb"
* Dr. Rao Tummala, professor & director of 3D Systems Packaging Research Center at the Georgia Institute of Technology - Grand Challenges & Potential Solutions in the Changing World of Nanoelectronics from ICs to 3D ICs to 3D Systems"

Student Programs
IMAPS 2010 will also include a comprehensive student program for both university and high school students that features a student paper competition, a student booth competition, and a tour of the DuPont Microcircuit Material Headquarters in RTP. An employment center for students will also be available.

Exhibition Hall
IMAPS 2010 is the world's largest symposium dedicated to microelectronics and electronics packaging technologies, with exhibits from companies representing all facets of the microelectronics supply chain.

Registration Information
Early registration for IMAPS 2010 is open until September 28, 2010. Complete information is available at: www.imaps.org/ <http://www.imaps.org/>

####

About IMAPS
Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community, providing means of communicating, educating and interacting at all levels. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.

For more information, please click here

Contacts:
Editor Contacts:
Chris Burke or Garth Miller
BtB Marketing Communications
(919) 872-8172

Copyright © IMAPS

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Arrowhead Pharmaceuticals Announces Pricing of Underwritten Public Offering of Common Stock January 18th, 2018

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

Ultra-thin optical fibers offer new way to 3-D print microstructures: Novel approach lays groundwork for using 3-D printing to repair tissue in the body January 17th, 2018

Arrowhead Pharmaceuticals Announces Proposed Underwritten Offering of Common Stock January 17th, 2018

Chip Technology

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

Ultra-thin memory storage device paves way for more powerful computing January 17th, 2018

'Gyroscope' molecules form crystal that's both solid and full of motion: New type of molecular machine designed by UCLA researchers could have wide-ranging applications in technology and science January 16th, 2018

New oxide and semiconductor combination builds new device potential: Researchers integrated oxide two-dimensional electron gases with gallium arsenide and paved the way toward new opto-electrical devices January 10th, 2018

Materials/Metamaterials

Ultrathin black phosphorus for solar-driven hydrogen economy: Osaka University researchers use sunlight to make hydrogen with a new nanostructured catalyst based on nanosheets of black phosphorus and bismuth vanadate January 17th, 2018

Nanotube fibers in a jiffy: Rice University lab makes short nanotube samples by hand to dramatically cut production time January 11th, 2018

New oxide and semiconductor combination builds new device potential: Researchers integrated oxide two-dimensional electron gases with gallium arsenide and paved the way toward new opto-electrical devices January 10th, 2018

Ultrafine fibers have exceptional strength: New technique developed at MIT could produce strong, resilient nanofibers for many applications January 5th, 2018

Announcements

Arrowhead Pharmaceuticals Announces Pricing of Underwritten Public Offering of Common Stock January 18th, 2018

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

Ultra-thin optical fibers offer new way to 3-D print microstructures: Novel approach lays groundwork for using 3-D printing to repair tissue in the body January 17th, 2018

Arrowhead Pharmaceuticals Announces Proposed Underwritten Offering of Common Stock January 17th, 2018

Events/Classes

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

21st International Conference on Advanced Nanoscience and Nanotechnology December 31st, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Leti to Demo Wristband with Embedded Sensors to Diagnose Sleep Apnea: APNEAband, Which Will Be Demonstrated at CES 2018, Also Monitors Mountain Sickness, Dehydration, Dialysis Treatment Response and Epileptic Seizures December 12th, 2017

Solar/Photovoltaic

Tweaking quantum dots powers-up double-pane solar windows: Engineered quantum dots could bring down the cost of solar electricity January 2nd, 2018

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Inorganic-organic halide perovskites for new photovoltaic technology November 6th, 2017

New nanomaterial can extract hydrogen fuel from seawater: Hybrid material converts more sunlight and can weather seawater's harsh conditions October 4th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project