Home > Press > Finding the perfect spot to rest
 |
| Like spokes on a gear, alkyl chains twist and stop at specific spots on the surface of the catalyst titanium dioxide. |
Abstract:
Prima donnas. Floppy hydrocarbon chains are quite particular about where they'll rest on a catalyst, according to a recent study by the Department of Energy's Pacific Northwest National Laboratory and the University of Texas at Austin.
Finding the perfect spot to rest
Posted on February 1st, 2010
On the surface of the common catalyst titanium dioxide, these hydrocarbon chains settle into valleys of titanium atoms, avoiding nearby ridges of oxygen atoms. The alkyl chains are drawn to these locations because of a weak attraction to the titanium. Understanding where the alkyl chains reside aids scientists in precisely modifying catalyzed reactions, such as the those used in producing biofuels. This work was done using instruments at the Department of Energy's EMSL, a national scientific user facility at PNNL.
####
For more information, please click here
Contacts:
Kristin Manke
509.372.6011
Copyright © DOE Pulse
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Chemistry
Iranian Scientists Use Pomegranate Juice to Produce Copper Iodide Nanostructure May 14th, 2013
Chemistry breakthrough sheds new light on illness and health May 12th, 2013
Researchers develop unique method for creating uniform nanoparticles May 6th, 2013
Four groups at the UJI set up a multidisciplinary cooperative research consortium to advance in medicine, energy and catalysis May 1st, 2013
Announcements
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
Energy
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
Solar panels as inexpensive as paint? It’s possible due to research at UB, elsewhere May 13th, 2013
Flawed Diamonds Promise Sensory Perfection: Berkeley Lab researchers and their colleagues extend electron spin in diamond for incredibly tiny magnetic detectors May 10th, 2013
Automotive/Transportation
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
Physicists discover a new kind of friction: Friction in the nano-world May 16th, 2013
Michigan Tech Scientist's Discovery Could Lead to a Better Capacitor April 16th, 2013
Surface diffusion plays a key role in defining the shapes of catalytic nanoparticles April 8th, 2013
Alliances/Partnerships/Distributorships
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013