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February 1st, 2010
Intel Corp. and Micron Technology Inc. have reclaimed the process technology lead in NAND flash by rolling out 25nm devices.
The first 25nm NAND device is a multi-level-cell (MLC), 8Gbyte device, which is said to reduce IC count by 50 percent over previous products. With the device, measuring 167mm², the Intel-Micron duo will retake the NAND process lead over the SanDisk-Toshiba duo and Samsung Electronics Co. Ltd, which have recently announced 32nm and 30nm products, respectively. Another player, Hynix Semiconductor Inc., has a 26nm device waiting in the wings.
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