Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Leti’s Planar-SOI Technology Meets Low-Power, 22nm Node Requirements, Supports Development of “Green” Products

Abstract:
Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, today presented results at the SOI Industry Consortium workshop in Leuven, Belgium, that prove SOI-based planar CMOS meets requirements for low-power, 22nm node devices, offering a practical route to further feature shrink and enabling a significant jump for "green" products.

Leti’s Planar-SOI Technology Meets Low-Power, 22nm Node Requirements, Supports Development of “Green” Products

Grenoble, France | Posted on October 16th, 2009

With unmatched access resistance and electrostatic characteristics, planar SOI is superior to other technologies based on bulk CMOS technology and FinFET architecture. It also shows outstanding performances for low-power applications requiring 22nm technology, such as consumer electronic devices including 4G mobile phones.

"Many transistor architectures have been proposed for the 22nm node and below. At Leti, we favored planar technologies for faster and easier transition to manufacturing," said Laurent Malier, CEO of Leti. "Our recent results prove the strength of this approach. Together with the recent ARM results demonstrating power reduction on 45nm technology, we have proven that SOI technologies offer solutions for low power at a wide variety of nodes, including 22nm and below. Furthermore, we have demonstrated that planar SOI dramatically improves the energy performances of many products that will change our lives, while offering long-term success for many companies involved in these fast-growing markets.

In addition, drain-induced barrier lowering (DIBL) below 100mV/V has been demonstrated and SOI has been proven to enable the reduction of electrostatic parasitics.

While variability is a major challenge to be addressed for the 22nm node, Leti's results prove that variability control is possible with today's state-of-the-art SOI wafers. In particular, variability on threshold voltage was reduced by a factor of two compared with FinFET technologies, at wafer and batch levels.

Leti also showed that fully depleted SOI (FDSOI) CMOS can be scaled down to the 10nm node through tuning the buried oxide and silicon layer thickness. Displayed results show that FDSOI approach also addresses the variability issues for this further shrink.


####

About CEA-Leti
CEA is a French Research and Technology Organization, with activities in three main areas: Energy, Technologies for Information and Healthcare, and Defence and Security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and Microsystems (MEMS) are at the core of its silicon activities. As a major player in the MINATEC® innovation campus, LETI operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, Leti puts a strong emphasis on intellectual property and owns more than 1,400 patent families.

For more information, please click here

Contacts:
Clément Moulet, Press Officer
Tel.: +33 4 38 78 03 26

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Instant-start computers possible with new breakthrough December 19th, 2014

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

Pb islands in a sea of graphene magnetise the material of the future December 16th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

Announcements

Scientists reveal breakthrough in optical fiber communications December 21st, 2014

Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014

Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014

Instant-start computers possible with new breakthrough December 19th, 2014

Environment

Nanoparticles Prove Effective in Removing Phosphor from Calcareous Soil December 10th, 2014

Detecting gases wirelessly and cheaply: New sensor can transmit information on hazardous chemicals or food spoilage to a smartphone December 8th, 2014

Nanocatalysts Can Reduce Pollution Caused by Diesel Engines December 4th, 2014

Green meets nano: Scientists at TU Darmstadt create multifunctional nanotubes using nontoxic materials December 3rd, 2014

Events/Classes

Bruker Introduces BioScope Resolve High-Resolution BioAFM System: Featuring PeakForce Tapping for Quantitative Bio-Mechanical Property Mapping December 16th, 2014

TCL Launches World’s Most Advanced TV in the World’s Largest Market: New Quantum Dot TVs with Color IQ™ Optics Deliver OLED-Quality Color at a Fraction of the Price December 15th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

PETA science consortium to present at Society for Risk Analysis meeting December 10th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE