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Abstract:
Today Chipworks announced the availability of the first detailed technology analysis of Intel's 32 nm "Westmere" process. The full suite of reverse engineering analysis includes a Structural Analysis Report, a Transistor Characterization Report, and a Packaging Analysis Report. Chipworks' suite of reverse engineering analysis reports help leading semiconductor companies make the right technology choices, save millions, and speed time-to-market.

Technology Analysis of Intel’s 32 nm “Westmere” Process Available from Chipworks

Ottowa, ON, Canada | Posted on October 6th, 2009

Chipworks (www.chipworks.com), the world's leader in reverse engineering and patent infringement analysis, today announced the availability of the first detailed technology analysis of Intel's 32 nm "Westmere" process. The full suite of reverse engineering analysis includes a Structural Analysis Report, a Transistor Characterization Report, and a Packaging Analysis Report.

"Our analysis shows that this 32 nm process continues to keep Intel ahead of the game. The transistor design is very different than what we saw in the previous generation 45 nm high-k metal gate process, which was itself a radical design when compared to the competition. The Westmere employs second generation metal gates and second generation low-k dielectrics in the metallization stack," said Dick James, Senior Technology Analyst with Chipworks. "The Chipworks reports provide exacting detail and analysis that far exceeds information available from simple product teardowns. Leading semiconductor companies use our reports to reduce the risk of billion dollar long-term investments, save millions in development costs, and earn millions in new revenue by getting better products to market faster."

The Structural Analysis Report provides comprehensive analysis of the process technology, materials, and design rules using advanced lab techniques and the latest microscopy.

The Transistor Characterization Report delivers an analysis of the DC electrical characteristics obtained by microprobing of both the NMOS and PMOS transistors on the 32 nm device using atomic force microscopy (AFM).

The Packaging Analysis Report presents a cross-sectional analysis of the packaging technology using SEM and materials analyses.

Reports will begin shipping October 20th. A library of preliminary images covering the SEM, TEM, and materials analyses is available immediately to Chipworks' clients. For more information, or to order the suite of reports, visit www.chipworks.com/intel-westmere.aspx

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About Chipworks
Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company’s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world’s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation – earning hundreds of millions of dollars in patent licenses and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design and earning even more through superior product design and faster launches. Headquartered in Canada, Chipworks maintains offices in the USA, Japan, Korea, and Taiwan.

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