- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
TSMC (TWSE: 2330; NYSE: TSM) and CEA-Leti, the leading French semiconductor research institute, signed an agreement today in which TSMC will join the new industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC manufacturing. Intended to operate for three years, this program allows companies to assess a maskless lithography infrastructure for IC manufacturing and use MAPPER Technology as a solution towards high throughput. It covers a global approach, including tool assessment, patterning and process integration, data handling, prototyping and cost analysis.
"TSMC is always pushing for cost-effective lithography and the development of maskless lithography is one of the potential solutions. We have already announced the joint steps with Mapper to explore multiple e-beam lithography for IC manufacturing at 22 nanometer node and beyond," said TSMC's VP of R&D, Jack Sun. "By joining the IMAGINE program at CEA-Leti, we intend to federate the semiconductor industry around this technology and accelerate its development and introduction for IC manufacturing."
"Lithography is a major challenge for the industry. A maskless approach can offer flexibility and gain in cost of ownership. Together with MAPPER, we see a route towards industrial throughput," said Leti's CEO, Laurent Malier. "Having TSMC on board the IMAGINE program is pivotal and will strengthen the assessment towards manufacturing. It shows the commitment in the technology from the industry and will take maskless lithography to the next step in the development that is required to make it a viable solution for 22-nm manufacturing."
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GIGAFABs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan.
CEA is a French Research and Technology Organisation, with activities in three main areas: Energy, Technologies for Information and Healthcare, and Defence and Security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and Microsystems (MEMS) are at the core of its activities. As a major player in MINATEC excellence centre, Leti operates 8,000 m(2) state-of-the-art clean rooms, on 24/7 mode, on 200 mm and 300 mm wafer standards. With 1,200 employees, Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, Leti puts a strong emphasis on Intellectual Property and owns more than 1,400 patent families. In 2008, contractual income covered more than 75% of its budget worth 205 M¿. For more information, visit www.leti.fr.
For more information, please click here
Copyright © PR Newswire Association LLC.If you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
RMIT researchers make leap in measuring quantum states July 21st, 2016
New reaction for the synthesis of nanostructures July 21st, 2016
Research team led by NUS scientists develop plastic flexible magnetic memory device: Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance July 21st, 2016
Graphene photodetectors: Thinking outside the 2-D box July 21st, 2016
Scientists move 1 step closer to creating an invisibility cloak July 15th, 2016
Yale researchers’ technology turns wasted heat into power June 27th, 2016
FEI and King Abdullah University of Science and Technology Establish New Electron Microscopy ‘Centre of Excellence’: Centre of Excellence involves materials and life sciences research and technical collaboration July 5th, 2016
FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016