Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development

Abstract:
Funding Helps Provider of Innovative Wet Deposition Processes for Through-Silicon Via 3D-Packaging Meet Continuing Growth in Demand

Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development

MASSY, France | Posted on June 23rd, 2009

Alchimer S.A., a leading provider of cost-saving wet deposition processes for interconnections in advanced 3D-packaging applications, announced today that it has raised an additional $10 million in new financing to expand customer-support programs and pursue new IP development.

Alchimer's D round of funding includes both previous and new investors, including AGF, CEA Investissement and Emertec Gestion.

"We expect Alchimer to make a significant contribution to 3D-packaging technology, which will play an important role in the development of next-generation devices," said Jean-Philippe Stefanini, general partner of Grenoble, France-based Emertec Gestion. "Alchimer is an ideal fit for our portfolio, and we have great confidence in its experienced management team."

"The continued support of investors, especially in this difficult economic environment, is a solid endorsement of Alchimer's innovative technology," said Alchimer CEO Steve Lerner. "It also underscores the impact of Alchimer's electrografting technology in enabling the emerging 3D market through process enhancement and cost reduction."

Alchimer recently announced an enhancement of its eG ViaCoat process for the copper seed metallization of through-silicon vias (TSVs), which are used to create interconnections in advanced 3D-packaging applications. These structures are typically very narrow in comparison to their depth; this high aspect ratio creates a number of challenges to the deposition of uniform films. The eG ViaCoat process uses chemicals to deposit these films at levels of uniformity that meet or exceed standard industry quality metrics. In addition to having a number of process advantages, this "wet" approach allows the eG ViaCoat to be implemented on legacy plating equipment without retrofits or modifications.

In further evidence of the company's increasing acceptance as a low-cost alternative for TSV copper seed and related films, Alchimer announced that it has signed an agreement with Nagase & Co. Ltd., a Tokyo-based technology-marketing company with an extensive background in chemicals, plastics and electronics. Nagase will help Alchimer meet rapidly increasing demand from key Japanese customers.

"Nagase will allow us to take advantage of synergies in the chemical and electronics markets and ensure excellent support for our customers in Japan," Lerner said.

The company also announced that industry veteran Kathy Cook has been hired in a new position, director of business development in North America. Cook has held positions in manufacturing, sales and business development within the semiconductor industry for more than 15 years, with companies including Applied Materials, Millipore Corp., ULVAC Technologies and SUSS MicroTec.

####

About Alchimer S.A.
Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in both semiconductor interconnects and 3D TSVs (through-silicon vias). The company’s breakthrough technology, Electrografting (eG™), is an electrochemical-based process that enables the growth of very thin coatings, of various types, on both conducting and semiconducting surfaces. Based in Massy, France, Alchimer is a spin-off from the Commissariat ŕ l’Energie Atomique (CEA). Founded in 2001, it won the First National Award for the Creation of High Tech Companies from the French Minister of Research and Industry and is a Red Herring Top 100 European Company.

For more information, please click here

Contacts:
Kathy Cook

Alchimer

Director of Business Development

Phone: +1 214 649 6153





Sarah-Lyle Dampoux

Loomis Group

Phone: +33 1 58 18 59 30

Copyright © Alchimer S.A.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Video captures bubble-blowing battery in action: Researchers propose how bubbles form, could lead to smaller lithium-air batteries April 26th, 2017

New Product Nanoparticle preparation from Intertronics with new Thinky NP-100 Nano Pulveriser April 26th, 2017

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

Affordable STM32 Cloud-Connectable Kit from STMicroelectronics Puts More Features On-Board for Fast and Flexible IoT-Device Development April 26th, 2017

VC/Funding/Angel financing/Loans/Leases/Crowdfunding

Forge Nano 2017: 1st Quarter Media Update April 20th, 2017

180 Degree Capital Corp. Announces the Start of Kevin Rendino as Chairman and Chief Executive Officer and Completion of its Transition to a Registered Closed-End Fund March 31st, 2017

Caught on camera -- chemical reactions 'filmed' at the single-molecule level March 22nd, 2017

Harris & Harris Group Issues Its Financial Statements as of December 31, 2016, Posts Its Annual Shareholder Letter, And Will Host a Conference Call for Shareholders on Friday, March 17, 2017 March 15th, 2017

Chip Technology

Geoffrey Beach: Drawn to explore magnetism: Materials researcher is working on the magnetic memory of the future April 25th, 2017

'Neuron-reading' nanowires could accelerate development of drugs for neurological diseases April 12th, 2017

Nanometrics to Announce First Quarter Financial Results on May 2, 2017 April 11th, 2017

AIM Photonics Presents Cutting-Edge Integrated Photonics Technology Developments to Packed House at OFC 2017, the Optical Networking and Communication Conference & Exhibition April 11th, 2017

Announcements

Video captures bubble-blowing battery in action: Researchers propose how bubbles form, could lead to smaller lithium-air batteries April 26th, 2017

New Product Nanoparticle preparation from Intertronics with new Thinky NP-100 Nano Pulveriser April 26th, 2017

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

Affordable STM32 Cloud-Connectable Kit from STMicroelectronics Puts More Features On-Board for Fast and Flexible IoT-Device Development April 26th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project