Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Technologists Investigate Challenges for 3D Interconnect Metrology at SEMATECH Workshop during SEMICON West

Abstract:
To gain a better understanding of how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to 3D Interconnect Metrology on July 15th in conjunction with SEMICON West in San Francisco, CA.

Technologists Investigate Challenges for 3D Interconnect Metrology at SEMATECH Workshop during SEMICON West

Albany, NY and Austin, TX | Posted on June 4th, 2009

To further explore innovative metrology capabilities, workshop participants will share real metrology results from 3D interconnect processing, discuss metrology challenges, and define possible solutions for measuring films and high-aspect ratio features that dominate 3D architectures.

"We must have the 3D tooling infrastructure available and address the equipment concerns that have to be resolved before volume manufacturing can take place," said Andrew Rudack, SEMATECH's 3D equipment process engineer and workshop chair. "Through SEMATECH's 3D Interconnect program and workshops such as this, attendees can compare progress and develop an assessment on integration approaches, process architectures, and tool sets that will make 3D TSVs commercially viable."

The speaker line-up is as follows:

o Metrology Applications of Enabling Technologies for Wafer Thinning, John Moore, Daetec

o Scanning Acoustics Microscopy for Metrology of 3D Interconnect Bonded Wafers, James McKeon, Sonix

o Through-Silicon Via (TSV) Processes Demand Macroscopic to Microscopic Metrology, Liam Cunnane, Metryx

o 3D Interconnect Bonded Wafer Pair Metrology Using IR Microscopy, Richard Poplawski, Olympus-ITA

o A Route Towards Non-Destructive Three-Dimensional CD Measurements of Through Silicon Via with X-ray Computed Tomography, Steve Wang, Xradia

o Optical Metrology for TSV Process Control, Matthew Knowles, Zygo

o Aspect Ratio Independent Non-Contact, High Throughput TSV Depth Metrology for 3D Interconnect Technology, David Marx, Tamar

The half-day workshop will conclude with a panel discussion entitled "3D Metrology - Does it Measure Up" that focuses on the readiness of metrology tools to support 3D integration challenges.

SEMATECH's 3D program was established to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking. The SEMATECH 3D program has also been building industry consensus by sponsoring 3D workshops and continued ITRS involvement.

The 3D Interconnect Metrology Workshop is part of the SEMATECH Knowledge Series, a set of public, single-focused industry meetings designed to increase global knowledge in key areas of semiconductor R&D. For more information on the July workshop, including registration and other relevant information, visit www.sematech.org/meetings/announcements/8736/. To see a complete listing of all the meetings in this series, go to www.sematech.org/meetings/sks.htm.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road | Suite 2200
Albany, NY | 12203
o: 518-649-1041
m: 518-487-8256


Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Scientists reveal breakthrough in optical fiber communications December 21st, 2014

Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014

Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014

Instant-start computers possible with new breakthrough December 19th, 2014

Chip Technology

Instant-start computers possible with new breakthrough December 19th, 2014

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

Pb islands in a sea of graphene magnetise the material of the future December 16th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

Announcements

Scientists reveal breakthrough in optical fiber communications December 21st, 2014

Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014

Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014

Instant-start computers possible with new breakthrough December 19th, 2014

Events/Classes

Bruker Introduces BioScope Resolve High-Resolution BioAFM System: Featuring PeakForce Tapping for Quantitative Bio-Mechanical Property Mapping December 16th, 2014

TCL Launches World’s Most Advanced TV in the World’s Largest Market: New Quantum Dot TVs with Color IQ™ Optics Deliver OLED-Quality Color at a Fraction of the Price December 15th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

PETA science consortium to present at Society for Risk Analysis meeting December 10th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE