Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Call for Papers Now Open for 2009 Advanced Metallization Conference

Abstract:
UC Berkeley Extension announced today that abstracts for paper presentations are now being accepted for the 26th Advanced Metallization Conference (AMC) which will be held October 13-15, 2009, in Baltimore, Maryland. The submission deadline for abstracts is June 26, 2009.

Call for Papers Now Open for 2009 Advanced Metallization Conference

Berkeley, CA | Posted on June 3rd, 2009

The conference draws technical leaders from around the world to discuss leading-edge research in the field of advanced metallization and 3-D integration for ULSI IC applications. "The meeting provides a forum for open discussion of critical issues affecting state-of-the-art and future directions in interconnect systems. It's a great opportunity for collaboration on new cutting-edge research," said Stefan E. Schulz, Professor for Nanoelectronics Technologies at Chemnitz University of Technology, Germany and co-chair of the conference. "This year we widened the thin film metallization paper topics to include application in solar cells. We encourage experts in this area to share their challenges and R&D results in metallization topics by submitting their papers to AMC." Topics include both fundamental and applied research, as well as advanced interconnect materials issues, manufacturing unit process development, full integration data, interconnect reliability, and IC wiring scaling.

Presentations must be original, non-commercial and non-published works, and focus on ULSI IC metallization and associated subjects such as ultra low-k dielectrics, scaling effects on resistance, diffusion barriers, metal/dielectric planarization emphasizing CMP, electrochemical and electroless deposition processes in advanced metallization, novel interconnect systems concepts such as vertical, optical and RF issues, chip interconnect/packaging interface including 3-D integration as well as metallization technologies for micro-system-technology and solar cell applications.

Abstracts of approximately 250 words are due by June 26, 2009. Abstracts submitted electronically must be a PDF file with all fonts embedded. Send abstracts to

Papers presented at the conference will be published by the Materials Research Society. In the past, the books resulting from this meeting have been very popular, and have found highest acceptance as information sources for advanced metallization.

A complete list of topic areas for papers is available at:

####

For more information, please click here

Contacts:

(510)

642-4151

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

CubeSat Structures Competition Opens Space Design to Students of the World December 16th, 2017

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Error-free into the quantum computer age December 15th, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Announcements

CubeSat Structures Competition Opens Space Design to Students of the World December 16th, 2017

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Error-free into the quantum computer age December 15th, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Events/Classes

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Leti to Demo Wristband with Embedded Sensors to Diagnose Sleep Apnea: APNEAband, Which Will Be Demonstrated at CES 2018, Also Monitors Mountain Sickness, Dehydration, Dialysis Treatment Response and Epileptic Seizures December 12th, 2017

Arrowhead Presents New Clinical Data Demonstrating a Sustained Host Response in Hepatitis B Patients Following RNAi Therapy Up to 5.0 log10 reduction in HBsAg observed; data presented at HEP DART 2017 December 6th, 2017

Leti Breakthroughs Point Way to Significant Improvements in SoC Memories December 6th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project