Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

android tablet pc

Home > Press > Call for Papers Now Open for 2009 Advanced Metallization Conference

UC Berkeley Extension announced today that abstracts for paper presentations are now being accepted for the 26th Advanced Metallization Conference (AMC) which will be held October 13-15, 2009, in Baltimore, Maryland. The submission deadline for abstracts is June 26, 2009.

Call for Papers Now Open for 2009 Advanced Metallization Conference

Berkeley, CA | Posted on June 3rd, 2009

The conference draws technical leaders from around the world to discuss leading-edge research in the field of advanced metallization and 3-D integration for ULSI IC applications. "The meeting provides a forum for open discussion of critical issues affecting state-of-the-art and future directions in interconnect systems. It's a great opportunity for collaboration on new cutting-edge research," said Stefan E. Schulz, Professor for Nanoelectronics Technologies at Chemnitz University of Technology, Germany and co-chair of the conference. "This year we widened the thin film metallization paper topics to include application in solar cells. We encourage experts in this area to share their challenges and R&D results in metallization topics by submitting their papers to AMC." Topics include both fundamental and applied research, as well as advanced interconnect materials issues, manufacturing unit process development, full integration data, interconnect reliability, and IC wiring scaling.

Presentations must be original, non-commercial and non-published works, and focus on ULSI IC metallization and associated subjects such as ultra low-k dielectrics, scaling effects on resistance, diffusion barriers, metal/dielectric planarization emphasizing CMP, electrochemical and electroless deposition processes in advanced metallization, novel interconnect systems concepts such as vertical, optical and RF issues, chip interconnect/packaging interface including 3-D integration as well as metallization technologies for micro-system-technology and solar cell applications.

Abstracts of approximately 250 words are due by June 26, 2009. Abstracts submitted electronically must be a PDF file with all fonts embedded. Send abstracts to

Papers presented at the conference will be published by the Materials Research Society. In the past, the books resulting from this meeting have been very popular, and have found highest acceptance as information sources for advanced metallization.

A complete list of topic areas for papers is available at:


For more information, please click here




Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Sopping up proteins with thermosponges: Researchers develop novel nanoparticle platform that proves effective in delivering protein-based drugs October 22nd, 2014

Brookhaven Lab Launches Computational Science Initiative:Leveraging computational science expertise and investments across the Laboratory to tackle "big data" challenges October 22nd, 2014

Bipolar Disorder Discovery at the Nano Level: Tiny structures found in brain synapses help scientists better understand disorder October 22nd, 2014

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014


NanoTechnology for Defense (NT4D) October 22nd, 2014

Mechanism behind nature's sparkles revealed October 22nd, 2014

TARA Biosystems and Harris & Harris Group Form Company to Improve Safety and Efficacy of New Therapies October 22nd, 2014

Researchers patent a nanofluid that improves heat conductivity October 22nd, 2014


NanoTechnology for Defense (NT4D) October 22nd, 2014

Ucore's McKenzie to Deliver Presentation to Rare Earths Conference in Singapore as Highlight of Fall 2014 Marketplace Schedule October 19th, 2014

Aspen Aerogels, Inc. Schedules Third Quarter 2014 Earnings Release and Conference Call for November 6, 2014 October 17th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project

© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE