Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Atotech and SEMATECH Partner at the UAlbany NanoCollege to Deliver Manufacturable Process Solutions for 3D Integrated Circuits

Abstract:
Collaborative Research Activities to Advance Copper Plating Process Technologies for 3D Interconnects

Atotech and SEMATECH Partner at the UAlbany NanoCollege to Deliver Manufacturable Process Solutions for 3D Integrated Circuits

Albany, NY and Berlin, Germany | Posted on April 15th, 2009

SEMATECH, a global consortium of chip-makers, and global metallization technology provider, Atotech today announced that Atotech has become a member of SEMATECH's 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

As a member of SEMATECH's 3D program, Atotech will collaborate with SEMATECH in leading-edge research to enable the development of high yield, low cost copper electroplating solutions that will enable void-free filling of high density 3D through-silicon-vias (TSVs).

The new partnership will result in additional Atotech researchers being located at CNSE's Albany NanoTech, where Atotech launched a $5 million research and development program in January 2008 in collaboration with the UAlbany NanoCollege.

Robert Preisser, Vice President of Semiconductor Technology for Atotech, said, "We are excited to be part of the SEMATECH 3D Interconnect program, working with the most advanced 300 mm equipment and technologists in developing this leading-edge technology. By building on its presence at CNSE's world-class Albany NanoTech, Atotech is positioned to make significant contributions to the development production of 3D devices, aiding their rapid adoption into mainstream electronics."

"The goal of SEMATECH's 3D program is to make 3D-TSV both manufacturable and affordable," said John Warlaumont, SEMATECH vice president of advanced technology. "By partnering with Atotech, we have the opportunity to take another major step in developing practical process solutions for 3D TSVs by engaging with a world leader of chip processing technologies."

"Atotech's recognized expertise in developing innovative copper-plating technologies will enhance SEMATECH's 3D Interconnect Program and further strengthen the world-class research and development capabilities at the UAlbany NanoCollege," said Richard Brilla, Vice President for Strategy, Alliances and Consortia at CNSE. "This new collaboration also underscores the success of the SEMATECH-CNSE partnership in accelerating cutting-edge technology development for the world's leading nanoelectronics companies."

Atotech is well known for its innovation and expertise in the area of wafer metallization chemistries, and their participation in SEMATECH's 3D program will be very valuable," said Sitaram Arkalgud, SEMATECH's 3D program director. "SEMATECH engineers are developing leading-edge TSV integration for both die-to-wafer and wafer-to-wafer 3D applications, and we look forward to working with Atotech to deliver cost-effective processes that will accelerate progress toward industry-wide implementation."

Launched two years ago, SEMATECH's 3D IC program has been actively engaging with leading edge equipment and materials suppliers and leveraging their expertise to ready TSV technology. During 2008, in collaboration with the UAlbany NanoCollege, the program began addressing the infrastructure and development challenges in 3D-TSV, including materials characterization, unit processes and integration, equipment hardening, reliability, cost and benefit to device and circuit performance. Eventually, 3D interconnects will provide cost-effective ways to integrate diverse CMOS technologies and chips with emerging technologies such as micro- and nano-electromechanical systems (MEMS, NEMS) and bio-chips.

About Atotech:

A global leader in the field of metallization technologies and chemistries, Atotech has more than 3,000 employees that support the integration and use of metallization chemicals in general metal finishing (GMF), electronics (EC) and semiconductors (SC). Sixteen production and service facilities in the different countries assure a close customer support and short turnaround time. For more information, visit www.atotech.com/.

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About CNSE:

The UAlbany CNSE is the first college in the world dedicated to research, development, education, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. In May 2007, it was ranked as the world's number one college for nanotechnology and microtechnology in the Annual College Ranking by Small Times magazine. CNSE's Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world: a $4.5 billion, 800,000-square-foot megaplex that attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,000 scientists, researchers, engineers, students, and faculty work on site at CNSE's Albany NanoTech, from companies including IBM, AMD, SEMATECH, Toshiba, ASML, Applied Materials, Tokyo Electron, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu/.

For more information, please click here

Contacts:
SEMATECH
Erica McGill
518-956-7446

Copyright © Business Wire 2009

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Protein Building Blocks for Nanosystems: Scientists develop method for producing bio-based materials with new properties April 17th, 2015

Oxford Instruments commissions high field outsert magnet system for the National High Magnetic Field Laboratory 32 Tesla magnet program April 17th, 2015

QD Vision Expands Product Line with Two-Millimeter Color LCD Display Optic: Color IQ™ Optic Enables Full-Color Gamut for Ultra-Thin Displays and All-in-One Computers April 16th, 2015

The National Science Foundation names engineering researcher Andrea Alú its Alan T. Waterman awardee for 2015: Alú is a pioneer in the field of metamaterials who has developed "cloaking" technology to make objects invisible to sensors April 16th, 2015

Chip Technology

Nanotubes with two walls have singular qualities: Rice University lab calculates unique electronic qualities of double-walled carbon nanotubes April 16th, 2015

Graphenea embarks on a new era April 16th, 2015

Quantization of 'surface Dirac states' could lead to exotic applications April 15th, 2015

Study shows novel pattern of electrical charge movement through DNA April 14th, 2015

Announcements

Protein Building Blocks for Nanosystems: Scientists develop method for producing bio-based materials with new properties April 17th, 2015

Oxford Instruments commissions high field outsert magnet system for the National High Magnetic Field Laboratory 32 Tesla magnet program April 17th, 2015

Newly-Developed Nanocatalysts Increase Performance of Fuel Cells April 16th, 2015

Lanthanide-Organic Framework Nanothermometers Prepared by Spray-Drying April 16th, 2015

Alliances/Partnerships/Distributorships

How can you see an atom? (video) April 10th, 2015

FibeRio and VF Corporation Form Strategic Partnership to Lead the Apparel and Footwear Markets in Nanofiber Technology April 8th, 2015

UK National Graphene Institute Selects Bruker as Official Partner: World-Leading Graphene Research Facility Purchases Multiple Bruker AFMs April 7th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE