Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > News > R&D Profile: Silicon on Ceramics - A New Concept for Micro-Nano-Integration on Wafer Level

March 24th, 2009

R&D Profile: Silicon on Ceramics - A New Concept for Micro-Nano-Integration on Wafer Level

Abstract:
One of the challenges of using nano effects and patterns in semiconductor devices is the realization of an intelligent and robust connection to the macro world.

Story:
LTCC (low temperature cofired ceramics) are established materials for "System in Package" solutions due to the integration of passive elements, such as capacitors or resistors, associated with short development times as well as simple and cheap processing. The advantages of reliability, thermal stability and chemically inert packages offered by ceramic interconnect devices are combined with thin film precision by means of a smart wafer level packaging process. Tough mechanical, electrical or fluidic coupling of nano elements without affecting their functionality is guaranteed by a fully silicon-ceramic wafer compound material. The method is based on a bonding procedure between a nano patterned silicon surface (modified Black Silicon) and LTCC. A LTCC tape with adapted TCE to silicon is joined with a silicon wafer by lamination and pressure assisted firing. This manufactured "Silicon-On-Ceramic"-substrate enables a wide range of design solutions, in witch several, unfired ceramic layers are prepared with vias, wirings and fluidic channels using standard LTCC-technologies. After sintering, the ceramic acts as a carrier system with electrical and fluidic properties.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

NREL Announces New Center Directors to lead R&D, Analysis Efforts September 30th, 2014

Yale University and Leica Microsystems Partner to Establish Microscopy Center of Excellence: Yale Welcomes Scientists to Participate in Core Facility Opening and Super- Resolution Workshops October 20 Through 31, 2014 September 30th, 2014

Speed at its limits September 30th, 2014

Research mimics brain cells to boost memory power September 30th, 2014

Chip Technology

Speed at its limits September 30th, 2014

Research mimics brain cells to boost memory power September 30th, 2014

'Pixel' engineered electronics have growth potential: Rice, Oak Ridge, Vanderbilt, Penn scientists lead creation of atom-scale semiconducting composites September 29th, 2014

Future flexible electronics based on carbon nanotubes: Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers September 23rd, 2014

Announcements

Park Systems Announces Outsourced Analytical Services Including AFM Surface Imaging, Data Analysis and Interpretation September 30th, 2014

Ad-REIC vaccine: A magic bullet for cancer treatment September 30th, 2014

New Topical Hemostatic Agent: Neutral Self-Assembling Peptide Hydrogel September 30th, 2014

Chemical interactions between silver nanoparticles and thiols: A comparison of mercaptohexanol again September 30th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE