Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SUSS MicroTec launches 300mm Coat/Develop Cluster enhanced for 3D Integration

Frontview ACS300 Gen2 modular coat/bake/develop system from SUSS MicroTec (Photo: Business Wire)
Frontview ACS300 Gen2 modular coat/bake/develop system from SUSS MicroTec (Photo: Business Wire)

Abstract:
At Semicon Korea 2009, SUSS MicroTec (FWB:SMH)(GER:SMH) unveiled the second generation of its ACS300, a modular system for coating, baking and developing of wafers up to 300mm. The ACS300 Gen2 offers unmatched configuration flexibility at market-leading cost of ownership. The system architecture and process modules are specifically adapted to the needs of the advanced packaging and 3D integration industry, which requires very thick photo resist layers of up to 100 microns and more. Combining best in class coat and develop uniformity with exceptional edge bead performance makes the ACS300 Gen2 the preferred solution for various special spin coating applications such photosensitive polymers like polyimide, PBO or Cyclotene™ (BCB).

SUSS MicroTec launches 300mm Coat/Develop Cluster enhanced for 3D Integration

MUNICH, Germany | Posted on January 19th, 2009

The ACS300 Gen2 continues the success of the preceding model, ACS300Plus with developments driving equipment cost down, extending overall equipment efficiency and scaling down of the footprint.

"Addressing the specific requirements for wafer level packaging and 3D integration the new ACS300 is equipped with various packaging specific features, which makes it specifically suited for applications like solder bumping, gold bumping or redistribution layers," said Rolf Wolf, General Manager of SUSS MicroTec Lithography Division. "The next generation ACS300 will definitively help SUSS MicroTec to continue and further expand its market leading position in the field of advanced packaging, and extending it into 3D processing."

####

About SUSS MicroTec
SUSS MicroTec is a leading supplier of process and test solutions for markets such as 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership.

SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany.

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.

For more information, please click here

Contacts:
SUSS MicroTec
Brigitte Wehrmann
Marketing Communications Manager
SUSS MicroTec Lithography Division
Tel: +49 (0) 89 32007-237

Copyright © Business Wire 2009

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Camouflaged nanoparticles used to deliver killer protein to cancer June 17th, 2018

Squeezing light at the nanoscale: Ultra-confined light could detect harmful molecules June 17th, 2018

Physicists devise method to reveal how light affects materials: The new method adds to the understanding of the fundamental laws governing the interaction of electrons and light June 15th, 2018

Tripling the Energy Storage of Lithium-Ion Batteries: Scientists have synthesized a new cathode material from iron fluoride that surpasses the capacity limits of traditional lithium-ion batteries June 14th, 2018

Chip Technology

Making quantum puddles: Physicists discover how to create the thinnest liquid films ever June 13th, 2018

Leti Presenting Strategic Vision and Hosting a Workshop at SEMICON West: “From Electrons to Photons” Leti Workshop and CEO Media Briefing Set for Tuesday, July 10 in W Hotel, San Francisco June 12th, 2018

Nanometrics Updates Time of Webcast at Stifel 2018 Cross Sector Insight Conference June 12th, 2018

Does nanoconfinement affect the interaction between two materials placed in contact? It ispossible to estimate how nanoconfinement affects the number of contacts formed by two materials placed in intimate contact and, hence, the interfacial interactions June 7th, 2018

Announcements

Camouflaged nanoparticles used to deliver killer protein to cancer June 17th, 2018

Squeezing light at the nanoscale: Ultra-confined light could detect harmful molecules June 17th, 2018

Physicists devise method to reveal how light affects materials: The new method adds to the understanding of the fundamental laws governing the interaction of electrons and light June 15th, 2018

Tripling the Energy Storage of Lithium-Ion Batteries: Scientists have synthesized a new cathode material from iron fluoride that surpasses the capacity limits of traditional lithium-ion batteries June 14th, 2018

Tools

Nanometrics Updates Time of Webcast at Stifel 2018 Cross Sector Insight Conference June 12th, 2018

Nano-saturn: Supramolecular complex formation: Anthracene macrocycle and C60 fullerene June 8th, 2018

Detecting the birth and death of a phonon June 7th, 2018

Scientists use photonic chip to make virtual movies of molecular motion June 6th, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project