Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Replisaurus to Collaborate with IMEC on 3D Integration Research

Abstract:
Joint Development Program Will Employ S.E.T.'s High Accuracy FC300 System to Explore Advanced 3D Applications

Replisaurus to Collaborate with IMEC on 3D Integration Research

Saint Jeoire, France | Posted on January 14th, 2009

S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced today that they will collaborate with IMEC, one of Europe's leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.'s Flip Chip bonder equipment.

IMEC's 3D integration program explores 3D technology and design for applications in various domains, focusing on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects.

The joint development program will employ S.E.T.'s FC300, which is a high-accuracy (≤0.5 µm), high force (4,000N) device bonder system for die-to-die and die-to-wafer bonding on wafers up to 300 mm. The program is scheduled to begin during the first quarter of 2009, at which time S.E.T. will enter the IMEC's Industrial Affiliation Program (IIAP) on 3D integration. The parties will collaborate to develop highly-accurate pick-and-place processes and low-temperature bonding processes, which are required by advanced 3D integration schemes.

"The integration of the FC300 will be a welcome addition to our 3D program, as is the participation of S.E.T. and Replisaurus," said Luc van den Hove, Executive Vice President and COO of IMEC. "The Replisaurus and S.E.T. technologies are very interesting for advanced packaging applications, and the integration of this tool in particular will help complete our program."

"IMEC's installation of the FC300 is fully in line with Replisaurus' product and technology portfolio, which offers game-changing opportunities to the global chip market," said James Quinn, CEO of Replisaurus. "IMEC's advanced 3D integration program is recognized worldwide, and the FC300 is extremely complimentary to Replisaurus' ElectroChemical Pattern Replication (ECPR) technology, which is well-suited for advanced 3D integration and related applications."

####

About Replisaurus
Replisaurus Technologies, Inc. has developed a revolutionary metallization technology targeted at key growth markets such as integrated passives, copper pillars and 3D integration (TSV). The ElectroChemical Pattern Replication (ECPR™) process offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. ECPR is a fab-friendly, environmentally clean process which does not use any solvents, developers or strippers and has extremely fast plating rates. The ECPR technology is a “Design Enabling” technology for integrated passives enabling advanced designs, eliminating the need for prototyping and dummy plating patterns. The electrochemical replication principle of ECPR combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution.

About S.E.T.

S.E.T., Smart Equipment Technology is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 250 Device Bonders installed worldwide, S.E.T. is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder, through the automated FC150 and FC300 to the production FC250, S.E.T. offers a continuous process path from research to production. S.E.T. bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. Further information on the FC300 is available on www.set-sas.fr.

About IMEC

IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. IMEC vzw is headquartered in Leuven,Belgium, has a sister company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan, and representatives in Japan. Its staff of more than 1600 people includes more than 500 industrial residents and guest researchers. In 2007, its revenue (P&L) was EUR 244.5 million.
IMEC’s More Moore research aims at semiconductor scaling towards sub-32nm nodes. With its More than Moore research, IMEC looks into technologies for nomadic embedded systems, wireless autonomous transducer solutions, biomedical electronics, photovoltaics, organic electronics and GaN power electronics.
IMEC’s research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network worldwide position IMEC as a key partner for shaping technologies for future systems. Further information on IMEC can be found on www.imec.be.

For more information, please click here

Contacts:
James Quinn
CEO
Phone: +46 70 66 55 160


Mike Thompson
COO
Phone: +33 (0) 627 39 17 57


SET contact:
Gilbert Lecarpentier
International Product Manager
Phone: +33 (0) 686 28 1224


Agency contact:
Sarah Lyle Dampoux

Phone: +33 1 58 18 59 30

Copyright © Replisaurus

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Yale researchers’ technology turns wasted heat into power June 27th, 2016

FEI Launches Helios G4 DualBeam Series for Materials Science: The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions June 27th, 2016

Russian physicists create a high-precision 'quantum ruler': Physicists have devised a method for creating a special quantum entangled state June 25th, 2016

Nanoscientists develop the 'ultimate discovery tool': Rapid discovery power is similar to what gene chips offer biology June 25th, 2016

Chip Technology

GraphExeter illuminates bright new future for flexible lighting devices June 23rd, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Particle zoo in a quantum computer: First experimental quantum simulation of particle physics phenomena June 23rd, 2016

Nanometrics to Participate in the 8th Annual CEO Investor Summit: Investor Event Held Concurrently with SEMICON West 2016 in San Francisco June 22nd, 2016

Announcements

Yale researchers’ technology turns wasted heat into power June 27th, 2016

FEI Launches Helios G4 DualBeam Series for Materials Science: The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions June 27th, 2016

Russian physicists create a high-precision 'quantum ruler': Physicists have devised a method for creating a special quantum entangled state June 25th, 2016

Nanoscientists develop the 'ultimate discovery tool': Rapid discovery power is similar to what gene chips offer biology June 25th, 2016

Alliances/Trade associations/Partnerships/Distributorships

FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016

French Research Team Helps Extend MRI Detection of Diseases & Lower Health-Care Costs: CEA, INSERM and G2ELab Brings Grenoble Region’s Expertise In Advanced Medicine & Magnetism Applications to H2020 IDentIFY Project June 21st, 2016

Research showing why hierarchy exists will aid the development of artificial intelligence June 13th, 2016

UK NANOSAFETY GROUP publishes 2nd Edition of guidance to support safe working with nanomaterials May 30th, 2016

Research partnerships

Superheroes are real: Ultrasensitive nonlinear metamaterials for data transfer June 25th, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016

Tailored DNA shifts electrons into the 'fast lane': DNA nanowire improved by altering sequences June 22nd, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic