- About Us
- Nano-Social Network
- Nano Consulting
- My Account
EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3D IC and other advanced process development programs. In a shared commitment to speed commercialization of through-silicon via (TSV) technology and enable the development of smaller, higher performance, and more power-efficient electronic devices, this move is set to continue the momentum of their joint development efforts.
In December 2007, EVG and Brewer Science announced ultra-thin wafer handling capability for TSV creation to enable 3D chip stacking. This joint development program continues efforts to provide a complete family of ultra- thin wafer handling solutions to leading-edge CMOS image sensors, DRAM, and integrated devices manufacturers, who demand wider temperature range, thin wafer etching, passivation and metallization. To better leverage their bonding and materials expertise and relationships in Taiwan, the two companies now bring local bonding capability to technology development teams for rapid process testing and development in the Asia-Pacific region.
"With Taiwan, and Asia Pacific generally, home to leading adopters of novel processes such as TSV, the move to jointly manage customer process development locally is a logical progression in advancing our partnership efforts with Brewer Science," remarked Stefan Pargfrieder, EVG's business development manager. "By leveraging Brewer Science's facility and equipping them to handle temporary bonding demonstrations, it allows us to have faster cycle times and a more centralized hands-on lab to collaborate closely to adapt the process to our Asia-Pacific customers' requirements." Pargfrieder concluded, "The addition of an applications lab in Taiwan not only augments our network of global demonstration centers, but also truly reinforces our commitment to delivering faster, localized support to our customer base."
Commenting on today's news, Mark Privett, product manager of bonding materials at Brewer Science, Inc., added, "Demand for localized TSV development support in the Asia-Pacific region warranted this investment. Adding EVG's 500 series bonder to the laboratory in Taiwan will help accelerate the adoption of TSV and 3DP technology in the region. The addition of the bonder to the lab also allows us to provide process training for the region's engineers."
EVG's 500 series wafer bonding system was integrated in the applications lab in December 2008.
To formally initiate the joint efforts in Taiwan, the companies will host a technology workshop featuring presentations by EVG and Brewer Science specialists on solutions for 3D interconnects using thin-wafer handling technology. This workshop, which will take place in Hsinchu, is scheduled for January 15, 2009. For more details, please contact EVG Jointech Corp. via email at or by phone at +886 3 280 5680.
About Brewer Science
Brewer Science is a leading-edge materials supplier to the electronics industry and provides solutions for lithography, advanced packaging, MEMS, nanotechnology, optoelectronics and compound semiconductor applications. Our extensive product portfolio includes ARC(R) anti-reflective coatings for microlithography, ProTEK(R) temporary etch protective coatings, WaferBOND(TM) temporary bonding materials, Cee(R) precision coat-bake-develop equipment and microelectronics-grade carbon nanotube solutions.
Exceptional technical expertise and extensive semiconductor industry knowledge, combined with a long tradition of addressing market and customer needs through its world-class product and customer support, make Brewer Science an exceptional global supplier of choice.
About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor- related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.
For more information, please click here
Copyright © PR Newswire Association LLC.If you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017
ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017
Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017