Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab in Taiwan: Localized Support to Address Increased Demand for 3D IC Process Developm

Abstract:
EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3D IC and other advanced process development programs. In a shared commitment to speed commercialization of through-silicon via (TSV) technology and enable the development of smaller, higher performance, and more power-efficient electronic devices, this move is set to continue the momentum of their joint development efforts.

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab in Taiwan: Localized Support to Address Increased Demand for 3D IC Process Developm

ST. FLORIAN, Austria and ROLLA, MO. | Posted on January 7th, 2009

In December 2007, EVG and Brewer Science announced ultra-thin wafer handling capability for TSV creation to enable 3D chip stacking. This joint development program continues efforts to provide a complete family of ultra- thin wafer handling solutions to leading-edge CMOS image sensors, DRAM, and integrated devices manufacturers, who demand wider temperature range, thin wafer etching, passivation and metallization. To better leverage their bonding and materials expertise and relationships in Taiwan, the two companies now bring local bonding capability to technology development teams for rapid process testing and development in the Asia-Pacific region.

"With Taiwan, and Asia Pacific generally, home to leading adopters of novel processes such as TSV, the move to jointly manage customer process development locally is a logical progression in advancing our partnership efforts with Brewer Science," remarked Stefan Pargfrieder, EVG's business development manager. "By leveraging Brewer Science's facility and equipping them to handle temporary bonding demonstrations, it allows us to have faster cycle times and a more centralized hands-on lab to collaborate closely to adapt the process to our Asia-Pacific customers' requirements." Pargfrieder concluded, "The addition of an applications lab in Taiwan not only augments our network of global demonstration centers, but also truly reinforces our commitment to delivering faster, localized support to our customer base."

Commenting on today's news, Mark Privett, product manager of bonding materials at Brewer Science, Inc., added, "Demand for localized TSV development support in the Asia-Pacific region warranted this investment. Adding EVG's 500 series bonder to the laboratory in Taiwan will help accelerate the adoption of TSV and 3DP technology in the region. The addition of the bonder to the lab also allows us to provide process training for the region's engineers."

EVG's 500 series wafer bonding system was integrated in the applications lab in December 2008.

To formally initiate the joint efforts in Taiwan, the companies will host a technology workshop featuring presentations by EVG and Brewer Science specialists on solutions for 3D interconnects using thin-wafer handling technology. This workshop, which will take place in Hsinchu, is scheduled for January 15, 2009. For more details, please contact EVG Jointech Corp. via email at or by phone at +886 3 280 5680.

About Brewer Science

Brewer Science is a leading-edge materials supplier to the electronics industry and provides solutions for lithography, advanced packaging, MEMS, nanotechnology, optoelectronics and compound semiconductor applications. Our extensive product portfolio includes ARC(R) anti-reflective coatings for microlithography, ProTEK(R) temporary etch protective coatings, WaferBOND(TM) temporary bonding materials, Cee(R) precision coat-bake-develop equipment and microelectronics-grade carbon nanotube solutions.

Exceptional technical expertise and extensive semiconductor industry knowledge, combined with a long tradition of addressing market and customer needs through its world-class product and customer support, make Brewer Science an exceptional global supplier of choice.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor- related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Contacts:

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Nano Ruffles in Brain Matter: Freiburg researchers decipher the role of nanostructures around brain cells in central nervous system function October 31st, 2014

Gold nanoparticle chains confine light to the nanoscale October 31st, 2014

'Nanomotor lithography' answers call for affordable, simpler device manufacturing October 31st, 2014

Device invented at Johns Hopkins provides up-close look at cancer on the move: Microscopic view of metastasis could give insight about how to keep cancer in check October 31st, 2014

Chip Technology

Sussex physicists find simple solution for quantum technology challenge October 28th, 2014

Watching the hidden life of materials: Ultrafast electron diffraction experiments open a new window on the microscopic world October 27th, 2014

Breakthrough in molecular electronics paves the way for DNA-based computer circuits in the future: DNA-based programmable circuits could be more sophisticated, cheaper and simpler to make October 27th, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Announcements

Nano Ruffles in Brain Matter: Freiburg researchers decipher the role of nanostructures around brain cells in central nervous system function October 31st, 2014

Gold nanoparticle chains confine light to the nanoscale October 31st, 2014

'Nanomotor lithography' answers call for affordable, simpler device manufacturing October 31st, 2014

Device invented at Johns Hopkins provides up-close look at cancer on the move: Microscopic view of metastasis could give insight about how to keep cancer in check October 31st, 2014

Alliances/Partnerships/Distributorships

'Electronic skin' could improve early breast cancer detection October 29th, 2014

European Commission opens the gate towards the implementation of Nanomedicine Translation Hub October 16th, 2014

IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization October 15th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

NanoNews-Digest
The latest news from around the world, FREE





  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE