Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009

Abstract:
ST, one of the world leaders in semiconductors, to leverage knowledge and contacts to build high-value EMPC 2009 conference program in Rimini, Italy

STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009

Geneva, Switzerland | Posted on August 1st, 2008

STMicroelectronics (NYSE: STM), one of the world's largest semiconductor manufacturers and a world leader in MEMS and power ICs, is to be the principal sponsor of EMPC 2009 (www.empc2009.org), the 17th European Microelectronics And Packaging Conference & Exhibition. The company will work with the organizer, the Italian chapter of IMAPS (International Microelectronics and Packaging Society), and in collaboration with CPMT (IEEE Components Packaging and Manufacturing Technology society), to assemble a powerful and informative program. The conference and exhibition will take place in Rimini, Italy, next year, from June 15-18, 2009.

As part of the sponsor agreement, ST will be inviting certain key clients to participate at the plenary sessions of the events as well as contributing articles to the general sessions. The company will also be inviting other key technology partners such as research institutions and subcontract suppliers to contribute.

"ST is proud to be the principal sponsor of EMPC 2009, the forum for leading specialists to discuss the most important future trends and techniques in materials and packaging," said Carlo Cognetti, Director,Corporate Packaging & Automation, STMicroelectronics, and ST's representative on the EMPC 2009 steering committee. "We intend to play an active role in assisting the IMAPS team to assemble a hard-hitting conference program, which will deliver ample value for industry experts travelling to the event from around the world."

A first call for papers has been issued, and speakers will also be able to register for the conference at a reduced fee. Papers are invited on cutting-edge packaging technology, in areas such as MEMS, power devices, photovoltaics, nanotechnologies, advanced materials, and modeling and characterization. The call for papers, including a full list of the subject areas to be covered, can be downloaded from the event website at www.empc2009.org.

The associated exhibition will be an opportunity for packaging equipment manufactures and materials suppliers to the microelectronics industry to demonstrate the latest advances. Exhibitors will include suppliers of materials, equipment or components, service providers, manufacturers, research specialists and academic bodies. As an added benefit this year, close co-ordination between the conference program and the exhibition will provide ample time for conference delegates to visit the exhibition and discuss exhibitors' opinions.

The three-day conference and exhibition will be held from June 15-18, 2009 at Palacongressi in Rimini, and will be complemented by advanced professional courses as well as poster sessions.

####

About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10.0 billion.

For more information, please click here

Contacts:
STMicroelectronics
39, Chemin du Champ des Filles
C. P. 21
CH 1228 Plan-Les-Ouates
GENEVA, Switzerland
Tel: +41 22 929 29 29
Fax: +41 22 929 29 88

Copyright © STMicroelectronics

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Heating quantum matter: A novel view on topology: Physicists demonstrate how heating up a quantum system can be used as a universal probe for exotic states of matter August 22nd, 2017

A Tougher Tooth: A new dental restoration composite developed by UCSB scientists proves more durable than the conventional material August 22nd, 2017

Nagoya physicists resolve long-standing mystery of structure-less transition: Nagoya University-led team of physicists use a synchrotron radiation X-ray source to probe a so-called 'structure-less' transition and develop a new understanding of molecular conductors August 21st, 2017

Tokai University research: Nanomaterial wrap for improved tissue imaging August 21st, 2017

Chip Technology

Nagoya physicists resolve long-standing mystery of structure-less transition: Nagoya University-led team of physicists use a synchrotron radiation X-ray source to probe a so-called 'structure-less' transition and develop a new understanding of molecular conductors August 21st, 2017

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Announcements

Heating quantum matter: A novel view on topology: Physicists demonstrate how heating up a quantum system can be used as a universal probe for exotic states of matter August 22nd, 2017

A Tougher Tooth: A new dental restoration composite developed by UCSB scientists proves more durable than the conventional material August 22nd, 2017

Nagoya physicists resolve long-standing mystery of structure-less transition: Nagoya University-led team of physicists use a synchrotron radiation X-ray source to probe a so-called 'structure-less' transition and develop a new understanding of molecular conductors August 21st, 2017

Tokai University research: Nanomaterial wrap for improved tissue imaging August 21st, 2017

Events/Classes

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

FRITSCH Milling and Sizing! Innovations at POWTECH 2017 - Hall 2 Stand 227 August 9th, 2017

Thermo Fisher Scientific Showcases Innovations in Electron Microscopy and Spectroscopy at M&M 2017: New analytical technologies improve workflows for life sciences and materials science researchers August 8th, 2017

Nanometrics Announces Upcoming Investor Events August 3rd, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project