Nanotechnology Now - Press Release: "STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009"

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Abstract:
ST, one of the world leaders in semiconductors, to leverage knowledge and contacts to build high-value EMPC 2009 conference program in Rimini, Italy

STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009

Geneva, Switzerland | Posted on August 1st, 2008

STMicroelectronics (NYSE: STM), one of the world's largest semiconductor manufacturers and a world leader in MEMS and power ICs, is to be the principal sponsor of EMPC 2009 (www.empc2009.org), the 17th European Microelectronics And Packaging Conference & Exhibition. The company will work with the organizer, the Italian chapter of IMAPS (International Microelectronics and Packaging Society), and in collaboration with CPMT (IEEE Components Packaging and Manufacturing Technology society), to assemble a powerful and informative program. The conference and exhibition will take place in Rimini, Italy, next year, from June 15-18, 2009.

As part of the sponsor agreement, ST will be inviting certain key clients to participate at the plenary sessions of the events as well as contributing articles to the general sessions. The company will also be inviting other key technology partners such as research institutions and subcontract suppliers to contribute.

"ST is proud to be the principal sponsor of EMPC 2009, the forum for leading specialists to discuss the most important future trends and techniques in materials and packaging," said Carlo Cognetti, Director,Corporate Packaging & Automation, STMicroelectronics, and ST's representative on the EMPC 2009 steering committee. "We intend to play an active role in assisting the IMAPS team to assemble a hard-hitting conference program, which will deliver ample value for industry experts travelling to the event from around the world."

A first call for papers has been issued, and speakers will also be able to register for the conference at a reduced fee. Papers are invited on cutting-edge packaging technology, in areas such as MEMS, power devices, photovoltaics, nanotechnologies, advanced materials, and modeling and characterization. The call for papers, including a full list of the subject areas to be covered, can be downloaded from the event website at www.empc2009.org.

The associated exhibition will be an opportunity for packaging equipment manufactures and materials suppliers to the microelectronics industry to demonstrate the latest advances. Exhibitors will include suppliers of materials, equipment or components, service providers, manufacturers, research specialists and academic bodies. As an added benefit this year, close co-ordination between the conference program and the exhibition will provide ample time for conference delegates to visit the exhibition and discuss exhibitors' opinions.

The three-day conference and exhibition will be held from June 15-18, 2009 at Palacongressi in Rimini, and will be complemented by advanced professional courses as well as poster sessions.

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About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10.0 billion.

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Contacts:
STMicroelectronics
39, Chemin du Champ des Filles
C. P. 21
CH 1228 Plan-Les-Ouates
GENEVA, Switzerland
Tel: +41 22 929 29 29
Fax: +41 22 929 29 88

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