Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009

Abstract:
ST, one of the world leaders in semiconductors, to leverage knowledge and contacts to build high-value EMPC 2009 conference program in Rimini, Italy

STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009

Geneva, Switzerland | Posted on August 1st, 2008

STMicroelectronics (NYSE: STM), one of the world's largest semiconductor manufacturers and a world leader in MEMS and power ICs, is to be the principal sponsor of EMPC 2009 (www.empc2009.org), the 17th European Microelectronics And Packaging Conference & Exhibition. The company will work with the organizer, the Italian chapter of IMAPS (International Microelectronics and Packaging Society), and in collaboration with CPMT (IEEE Components Packaging and Manufacturing Technology society), to assemble a powerful and informative program. The conference and exhibition will take place in Rimini, Italy, next year, from June 15-18, 2009.

As part of the sponsor agreement, ST will be inviting certain key clients to participate at the plenary sessions of the events as well as contributing articles to the general sessions. The company will also be inviting other key technology partners such as research institutions and subcontract suppliers to contribute.

"ST is proud to be the principal sponsor of EMPC 2009, the forum for leading specialists to discuss the most important future trends and techniques in materials and packaging," said Carlo Cognetti, Director,Corporate Packaging & Automation, STMicroelectronics, and ST's representative on the EMPC 2009 steering committee. "We intend to play an active role in assisting the IMAPS team to assemble a hard-hitting conference program, which will deliver ample value for industry experts travelling to the event from around the world."

A first call for papers has been issued, and speakers will also be able to register for the conference at a reduced fee. Papers are invited on cutting-edge packaging technology, in areas such as MEMS, power devices, photovoltaics, nanotechnologies, advanced materials, and modeling and characterization. The call for papers, including a full list of the subject areas to be covered, can be downloaded from the event website at www.empc2009.org.

The associated exhibition will be an opportunity for packaging equipment manufactures and materials suppliers to the microelectronics industry to demonstrate the latest advances. Exhibitors will include suppliers of materials, equipment or components, service providers, manufacturers, research specialists and academic bodies. As an added benefit this year, close co-ordination between the conference program and the exhibition will provide ample time for conference delegates to visit the exhibition and discuss exhibitors' opinions.

The three-day conference and exhibition will be held from June 15-18, 2009 at Palacongressi in Rimini, and will be complemented by advanced professional courses as well as poster sessions.

####

About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10.0 billion.

For more information, please click here

Contacts:
STMicroelectronics
39, Chemin du Champ des Filles
C. P. 21
CH 1228 Plan-Les-Ouates
GENEVA, Switzerland
Tel: +41 22 929 29 29
Fax: +41 22 929 29 88

Copyright © STMicroelectronics

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Bringing the atomic world into full color: Researchers turn atomic force microscope measurements into color images October 19th, 2017

'Find the Lady' in the quantum world: International team of researchers presents method for quantum-mechanical swapping of positions October 18th, 2017

Long nanotubes make strong fibers: Rice University researchers advance characterization, purification of nanotube wires and films October 17th, 2017

Spinning strands hint at folding dynamics: Rice University lab uses magnetic beads to model microscopic proteins, polymers October 17th, 2017

Chip Technology

Bringing the atomic world into full color: Researchers turn atomic force microscope measurements into color images October 19th, 2017

Spin current detection in quantum materials unlocks potential for alternative electronics October 15th, 2017

Quantum manipulation power for quantum information processing gets a boost: Improving the efficiency of quantum heat engines involves reducing the number of photons in a cavity, ultimately impacting quantum manipulation power October 14th, 2017

Injecting electrons jolts 2-D structure into new atomic pattern: Berkeley Lab study is first to show potential of energy-efficient next-gen electronic memory October 13th, 2017

Announcements

Bringing the atomic world into full color: Researchers turn atomic force microscope measurements into color images October 19th, 2017

Long nanotubes make strong fibers: Rice University researchers advance characterization, purification of nanotube wires and films October 17th, 2017

Spinning strands hint at folding dynamics: Rice University lab uses magnetic beads to model microscopic proteins, polymers October 17th, 2017

Rice U. study: Vibrating nanoparticles interact: Placing nanodisks in groups can change their vibrational frequencies October 16th, 2017

Events/Classes

Nanometrics Announces Preliminary Results for the Third Quarter of 2017: Quarterly Results Impacted by Delays in Revenue Recognition on Multiple Systems into Japan October 12th, 2017

More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop October 12th, 2017

Arrowhead Pharmaceuticals to Present Preclinical Data on ARO-AAT at The Liver Meeting(R) October 10th, 2017

Arrowhead to Present at Chardan Gene Therapy Conference October 3rd, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project