Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Nextreme Receives Industry Awards

Abstract:
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, continues to receive industry accolades for its technology innovation excellence. The Thermal Copper Pillar Bump, Nextreme's core technology, and the OptoCooler module received awards from two leading technology magazines.

Nextreme Receives Industry Awards

DURHAM, NC | Posted on July 28th, 2008

Advanced Packaging recognized the thermal bump with a 2008 Advanced Packaging Award in the thermal management technology category. The AP awards recognize excellence in industry innovation in the integrated circuit packaging engineering community.

Also, Nextreme's OptoCooler™ was given an award by Nanotech Briefs® in their fourth annual Nano 50™ Awards program, which recognizes the top 50 technologies, products, and innovators that have significantly impacted - or are expected to impact - the state of the art in nanotechnology. The winners of the Nano 50 awards are the "best of the best" - the innovative designs that will move nanotechnology to key mainstream markets. "We are honored to receive the 2008 Advanced Packaging award and the Nano 50 award for our breakthrough technologies," said Dr. Paul A. Magill, vice president of marketing and business development at Nextreme. "We are particularly pleased because these awards are consistent with the response we are getting from early customers who are recognizing that we enable new thermal and power generation functionality in their products with our technology."

Receives Industry Accolades, Page 2 The thermal bump is a thermoelectric structure made from a thin-film thermally active material embedded into flip-chip interconnects (in particular copper pillar solder bumps) for use in electronics packaging. Thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. Thermal bumps are extremely small: 238μm (microns) in diameter by 60μm high, which enables the integration of thermal management capabilities at the wafer, die or package levels.

Nextreme's OptoCooler™ product family addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military and aerospace applications. With the thermal bump at its core, the OptoCooler UPF4 module can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a wide variety of thermal management applications. Its larger cousin, the OptoCooler UPF40, is ideal for optoelectronics applications with high heat-flux requirements, particularly semiconductor optical amplifiers (SOA) and laser diodes.

####

About Nextreme Thermal Solutions™, Inc.
Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme’s breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, highvolume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry. Nextreme is managed by an experienced start-up team and world-renowned experts in electronic packaging, thermal management and pillar bump technology. The company has 38 employees and is based near Research Triangle Park, North Carolina.

For more information, please click here

Contacts:
Nextreme
3908 Patriot Dr., Suite 140
Durham, NC 27703-8031
(919)-597-7300

Copyright © Nextreme Thermal Solutions™, Inc.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Chip Technology

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

GraphExeter illuminates bright new future for flexible lighting devices June 23rd, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Particle zoo in a quantum computer: First experimental quantum simulation of particle physics phenomena June 23rd, 2016

Announcements

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

Building a smart cardiac patch: 'Bionic' cardiac patch could one day monitor and respond to cardiac problems June 28th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Grants/Awards/Scholarships/Gifts/Contests/Honors/Records

Nanoscientists develop the 'ultimate discovery tool': Rapid discovery power is similar to what gene chips offer biology June 25th, 2016

Ultrathin, flat lens resolves chirality and color: Multifunctional lens could replace bulky, expensive machines June 25th, 2016

Particle zoo in a quantum computer: First experimental quantum simulation of particle physics phenomena June 23rd, 2016

Self-assembling icosahedral protein designed: Self-assembling icosahedral protein designed June 22nd, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic