Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > FEI Connectivity Solutions Improve and Accelerate TEM Imaging for Semiconductor Manufacturing

Abstract:
Higher-quality results in hours (not days) speed process development and enhance yields

FEI Connectivity Solutions Improve and Accelerate TEM Imaging for Semiconductor Manufacturing

HILLSBORO, OR | Posted on July 15th, 2008

FEI Company (Nasdaq: FEIC), a leading provider of atomic-scale imaging and analysis systems, today announced the Ultimate Throughput™ and Ultimate Imaging™ Connectivity Solutions. By accelerating and improving the quality of preparation, imaging and analysis of the ultra-thin samples required for transmission electron microscopy (TEM), the FEI® Connectivity Solutions can reduce a lab's "wafers-to-atoms" time from days to hours. That, in turn, offers the opportunity to dramatically improve lab efficiency to better support the development of new processes and enhance yields.

"Nowhere is the saying ‘time is money' more true than in the semiconductor manufacturing industry," said Tony Edwards, FEI's Electronics division general manager. "Multi-billion dollar fab investments result in tremendous pressure to take new products to market as fast as possible, and the cost of downtime in a high-volume production process can easily run to millions of dollars a day. The economic benefit provided by faster answers to critical process questions is substantial."

TEM usage has grown quickly in recent years, driven by the need for imaging and analysis of barrier layers, critical interfaces, gate structures, dopant profiles and silicon strain. TEM requires ultrathin samples that can take days to prepare using manual techniques. Sample preparation techniques using FEI focused ion beam (FIB) and SEM DualBeam™ systems are faster and more reliable. The FEI Connectivity Solutions improve the efficiency and quality of sample preparation by linking the operations of preparation, lift-out, transfer, loading and imaging/analysis tools.

The Ultimate Imaging solution includes: the Helios NanoLab™ 400S DualBeam system for sample preparation and thinning, the MultiLoader™ tool for tweezer-less transfer and loading of mounted samples, and the Titan3™ TEM for sub-Ångstrom imaging and analysis. The Ultimate Throughput solution includes: the CLM-3D™ full wafer DualBeam system for reliable, repeatable, programmed TEM sample preparation; the TEMLink™ 150 ex-situ extraction tool for automated sample lift-out; and the MultiLoader™ tool and Cartridge Transfer Station for sample staging, transfer and loading to a TEM (for imaging and analysis) or to the Helios NanoLab 400S (for additional thinning). Both solutions use versions of the FEI AutoTEM™ software for precision in the location and preparation of the samples.

####

About FEI Company
FEI (Nasdaq: FEIC) is the world leader in pioneering technologies and applications that deliver imaging solutions for 3D characterization, analysis and modification/prototyping with resolutions down to the sub-Ångström level. Our customers, working in advanced research and manufacturing, are supported by field-experienced applications specialists. They have open access to FEI’s prestigious global user network so they can succeed in accelerating nanoscale discovery and contribute to better living through new product commercialization. FEI’s NanoPorts in North America, Europe and Asia provide centers of technical excellence where our world-class community of customers and specialists collaborate on the ongoing development of new ideas and innovative solutions. FEI has sales and service operations in more than 50 countries around the world.

FEI Safe Harbor Statement

This press release contains forward-looking statements about the introduction and benefits of a suite of applications called Connectivity Solutions. Factors that could affect these forward-looking statements include, but are not limited to the failure of the product or technology to perform as expected and achieve anticipated results, unexpected technical problems, the company’s inability to manufacture the products deployed in the applications described, problems with suppliers, and completion of final engineering and product introduction. Please also refer to the company's Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update any forward- looking statements.

The FEI logo, Helios NanoLab, Titan3, CLM-3D, DualBeam, TEMLink, MultiLoader and AutoTEM are trademarks of FEI Company.

For more information, please click here

Contacts:
Media Contact:
Sandy Fewkes, Principal
MindWrite Communications, Inc
+1 408 224 4024


FEI Company
Fletcher Chamberlin (investors and analysts)
Investor Relations
+1 503 726 7710

Copyright © FEI Company

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

UK NANOSAFETY GROUP publishes 2nd Edition of guidance to support safe working with nanomaterials May 30th, 2016

Fast, stretchy circuits could yield new wave of wearable electronics May 30th, 2016

Automating DNA origami opens door to many new uses: Like 3-D printing did for larger objects, method makes it easy to build nanoparticles out of DNA May 30th, 2016

Simple attraction: Researchers control protein release from nanoparticles without encapsulation: U of T Engineering discovery stands to improve reliability and fabrication process for treatments to conditions such as spinal cord damage and stroke May 28th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Imaging

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Light can 'heal' defects in new solar cell materials: Defects in some new electronic materials can be removed by making ions move under illumination May 24th, 2016

More light on cancer: Scientists created nanoparticles to highlight cancer cells May 21st, 2016

Announcements

UK NANOSAFETY GROUP publishes 2nd Edition of guidance to support safe working with nanomaterials May 30th, 2016

Fast, stretchy circuits could yield new wave of wearable electronics May 30th, 2016

Automating DNA origami opens door to many new uses: Like 3-D printing did for larger objects, method makes it easy to build nanoparticles out of DNA May 30th, 2016

Simple attraction: Researchers control protein release from nanoparticles without encapsulation: U of T Engineering discovery stands to improve reliability and fabrication process for treatments to conditions such as spinal cord damage and stroke May 28th, 2016

Tools

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Light can 'heal' defects in new solar cell materials: Defects in some new electronic materials can be removed by making ions move under illumination May 24th, 2016

More light on cancer: Scientists created nanoparticles to highlight cancer cells May 21st, 2016

Nanotubes are beacons in cancer-imaging technique: Rice University researchers use spectral triangulation to pinpoint location of tumors May 21st, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic